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Thermoelectric-enhanced heat exchanger 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
출원번호 US-0116099 (2002-04-04)
발명자 / 주소
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Simons, Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Wojnicki, Jr., Esq., Andrew J.Radigan, Esq., Kevin P.Heslin Rothenberg Farley & Mesiti P.C.
인용정보 피인용 횟수 : 63  인용 특허 : 15

초록

A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat

대표청구항

A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat

이 특허에 인용된 특허 (15)

  1. Chien Chuan-Fu,TWX, CPU cooling system.
  2. Macias Jose Javier ; Silva Rogelio Hernandez, Computer enclosure cooling unit.
  3. Cardella Mark A., Cooling system and method of cooling electronic devices.
  4. Cheon Kioan, Cooling system for computer.
  5. Cheon Kioan, Fanless cooling system for computer.
  6. Rajasubramanian Sathya ; DeVilbiss Roger S. ; Dedmon Thomas C. ; Quisenberry Tony M., Hybrid air conditioning system and a method therefor.
  7. Rajasubramanian Sathya ; DeVilbiss Roger S. ; Dedmon Thomas C. ; Quisenberry Tony M. ; Borman Ronald ; Boger ; Jr. Allen D., Hybrid air conditioning system and a method therefor.
  8. Uttam Shyamalindu Ghoshal, Mixed thermoelectric cooling apparatus and method.
  9. Maruyama Hidetoshi,JPX ; Sakama Hiroyuki,JPX, Pipe cooler and small-sized temperature controlling apparatus using the same.
  10. Park Yong Jae,KRX, Temperature controller for bedding.
  11. Kerner James M. (779 Hillgrove Chico CA 95926), Thermoelectric closed-loop heat exchange system.
  12. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance.
  13. Gilley Michael D. ; Webb Ralph L., Thermoelectric device with evaporating/condensing heat exchanger.
  14. Wright Lloyd F. (Pleasant Valley NY) Wright Clifford C. (Rancho Palos Verdes CA), Thermoelectric heat exchanger.
  15. Jerry Monroe, Thermoelectric water pre-cooling for an evaporative cooler.

이 특허를 인용한 특허 (63)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  2. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Contaminant separator for a vapor-compression refrigeration apparatus.
  3. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Contaminant separator for a vapor-compression refrigeration apparatus.
  4. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
  5. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
  6. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
  7. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling.
  10. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  11. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  12. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  13. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Cooled electronic system with thermal spreaders coupling electronics cards to cold rails.
  14. Storm, Bruce H; Chen, Dingding; Song, Haoshi, Cooling apparatus, systems, and methods.
  15. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  16. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  17. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  18. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  19. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  20. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  21. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  22. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat exchange assembly with integrated heater.
  23. Storm, Jr., Bruce H.; Schultz, Roger L.; Fripp, Michael L., Heating and cooling electrical components in a downhole operation.
  24. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus.
  25. Storm,Bruce H.; Song,Haoshi, Method and apparatus for managing the temperature of thermal components.
  26. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Method of fabricating a cooled electronic system.
  27. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Vandeventer, Allan C.; Zoodsma, Randy J., Modular pumping unit(s) facilitating cooling of electronic system(s).
  28. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; VanDeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling method for continuous cooling of an electronic system(s).
  29. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; Vandeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling system for continuous cooling of an electronic system(s).
  30. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  31. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  32. Seeler, Fabian; Degen, Georg; Reesink, Bernard Hendrik; Kaczun, Jurgen, Printing method for producing thermomagnetic form bodies for heat exchangers.
  33. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Rechargeable energy storage device in a downhole operation.
  34. Kusaka, Hiroto, Semiconductor element cooling structure.
  35. Storm, Bruce H; Schultz, Roger L.; Fripp, Michael L., Switchable power allocation in a downhole operation.
  36. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  37. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  38. Ueki, Tatsuhiko; Shimada, Mamoru; Hiratani, Yuji, Temperature adjustment device and laser module.
  39. Grünwald, Jürgen; Wehowski, Manuel, Temperature-control device and method for the temperature control of an energy store.
  40. David, Milnes P.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Parida, Pritish R.; Schmidt, Roger R.; Steinke, Mark E., Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s).
  41. Ouyang, Chien, Thermal-electric-MHD cooling.
  42. Venkatasubramanian, Rama, Thermoelectric generators for solar conversion and related systems and methods.
  43. Callas,James J.; Taher,Mahmoud A., Thermoelectric heat exchange element.
  44. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  45. Brehm, Holger; Heckenberger, Thomas; Himmer, Thomas; Riedel, Rudolf, Thermoelectric heat exchanger.
  46. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  47. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  48. Grünwald, Jürgen; Neff, Heiko; Neumeister, Dirk; Wehowski, Manuel; Steinbach, Martin; Moldovan, Florin, Thermoelectric temperature control unit.
  49. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
  50. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
  51. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air cooling for an electronics rack.
  52. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air cooling for an electronics rack.
  53. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air-cooled thermal conductors.
  54. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced, inlet air-cooled thermal conductors.
  55. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  56. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  57. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  58. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, refrigeration cooling of an electronic component.
  59. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component.
  60. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component.
  61. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s).
  62. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  63. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater.
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