IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0989618
(2001-11-20)
|
발명자
/ 주소 |
- Brinson, John Dillard
- Forrester, Gil
|
대리인 / 주소 |
Greer, Burns & Crain, Ltd.
|
인용정보 |
피인용 횟수 :
13 인용 특허 :
7 |
초록
▼
A portable, folding camera dolly track is assembled from a number of folding track sections, each track section having a parallel pair of rails, each rail having a base and a cylindrical wheel-supporting rail element, and a transverse spacer. A continuous, removable, resilient cap is provided on eac
A portable, folding camera dolly track is assembled from a number of folding track sections, each track section having a parallel pair of rails, each rail having a base and a cylindrical wheel-supporting rail element, and a transverse spacer. A continuous, removable, resilient cap is provided on each wheel-supporting rail element to provide a smooth ride over joints formed by adjoining rail elements.
대표청구항
▼
A portable, folding camera dolly track is assembled from a number of folding track sections, each track section having a parallel pair of rails, each rail having a base and a cylindrical wheel-supporting rail element, and a transverse spacer. A continuous, removable, resilient cap is provided on eac
A portable, folding camera dolly track is assembled from a number of folding track sections, each track section having a parallel pair of rails, each rail having a base and a cylindrical wheel-supporting rail element, and a transverse spacer. A continuous, removable, resilient cap is provided on each wheel-supporting rail element to provide a smooth ride over joints formed by adjoining rail elements. , and flip-chip bumps electrically conductively connecting said pads to said contact-connection points of said semiconductor chip, said semiconductor chip and said electrically insulating protective layer being configured such that said pads are first on said connection plane and such that said pads electrically conductively contact-connect said semiconductor chip to said contact areas, said electrically insulating protective layer being applied only around said semiconductor chip, said flip-chip bumps extending through said electrically insulating protective layer, each one of said flip-chip bumps having an end that is remote from said semiconductor chip, said end of each one of said flip-chip bumps forming a pad lying approximately plane-parallel in said surface of said electrically insulating protective layer that is remote from said semiconductor chip, and said electrically insulating protective layer being a covering compound; said pads of said chip element being connected to said contact areas of said connection lead frame in a manner that is selected from a group consisting of being soldered and being electrically conductively adhesively bonded. 5. A smart card module, comprising: a smart card body formed with a cavity, said smart card body having contact areas forming a connection plane; and a chip element including: a semiconductor chip electrically conductively contact-connected to said connection plane in which contact areas are formed, said semiconductor chip having sides, said semiconductor chip having contact-connection points, an electrically insulating protective layer located on at least one of said sides of said semiconductor chip, said electrically insulating protective layer having a surface that is remote from said semiconductor chip, pads formed on said surface of said electrically insulating protective layer that is remote from said semiconductor chip, and flip-chip bumps electrically conductively connecting said pads to said contact-connection points of said semiconductor chip, said semiconductor chip and said electrically insulating protective layer being configured such that said pads are first on said connection plane and such that said pads electrically conductively contact-connect said semiconductor chip to said contact areas, said electrically insulating protective layer being applied only around said semiconductor chip, said flip-chip bumps extending through said electrically insulating protective layer, each one of said flip-chip bumps having an end that is remote from said semiconductor chip, said end of each one of said flip-chip bumps forming a pad lying approximately plane-parallel in said surface of said electrically insulating protective layer that is remote from said semiconductor chip, and said electrically insulating protective layer being a covering compound; said chip element being inserted into said smart card body such that said pads are on top; and said contact areas being connected to said pads in a manner selected from a group consisting of being sputtered on said pads and being printed on said pads. 6. A method for producing a smart card module, which comprises: providing a semiconductor chip having contact-connection points and an underside located opposite the contact-connection points; fixing the underside of the semiconductor chip to a carrier element; applying flip-chip bumps made of a ductile material on the contact-connection points of the chip, and subsequently: transporting the chip with the bumps into an open injection mold having an upper mold half with an inner wall that faces the bumps, and subsequently: closing the injection mold such that the inner wall compresses ends of the bumps that are remote from the chip to form pads in a plane at a height that corresponds to a thickness of a plastic covering compound that will be injected on top of the chip; injecting the plastic covering compound into the closed injection mold to e
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