초록 ▼

A protective arrangement comprising one or several plane structures such as protective plates or elements, each one of which is meant to be used with one or several similar ones and are removably attached to one another. The structural part is stiffened in proportion to bending and has stiffening ri

A protective arrangement comprising one or several plane structures such as protective plates or elements, each one of which is meant to be used with one or several similar ones and are removably attached to one another. The structural part is stiffened in proportion to bending and has stiffening ribs. The arrangement is meant for temporarily protecting a field of grass and/or ice. One or several plastic based thermal insulation assemblies are attached to the downward side of the supporting structural part. A supporting structure is formed from the thermal insulation assembly that projects from the downward surface of the stiffening ribs.

대표청구항 ▼

A protective arrangement comprising one or several plane structures such as protective plates or elements, each one of which is meant to be used with one or several similar ones and are removably attached to one another. The structural part is stiffened in proportion to bending and has stiffening ri

A protective arrangement comprising one or several plane structures such as protective plates or elements, each one of which is meant to be used with one or several similar ones and are removably attached to one another. The structural part is stiffened in proportion to bending and has stiffening ribs. The arrangement is meant for temporarily protecting a field of grass and/or ice. One or several plastic based thermal insulation assemblies are attached to the downward side of the supporting structural part. A supporting structure is formed from the thermal insulation assembly that projects from the downward surface of the stiffening ribs. ein said plurality of separate processing units include: a coverage unit for performing said coverage process; a leveling unit for performing said leveling process on the substrate processed by said coverage unit; and a drying unit for performing said drying process on the substrate processed by said leveling unit. 5. A substrate processing apparatus as defined in claim 1, wherein said series of film forming processes includes a removing process for removing unwanted parts of the photoresist solution from the substrate, said coating section including a plurality of separate processing units for successively performing said series of film forming processes including said removing process as divided into separate time series. 6. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage unit for performing said coverage process; and a leveling, drying and removing unit for performing said leveling process, said drying process and said removing process. 7. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage and leveling unit for performing said coverage process and said leveling process; and a drying and removing unit for performing said drying process and said removing process. 8. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage, leveling and drying unit for performing said coverage process, said leveling process and said drying process; and a removing unit for performing said removing process. 9. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage unit for performing said coverage process; a leveling unit for performing said leveling process; and a drying and removing unit for performing said drying process and said removing process. 10. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage unit for performing said coverage process; a leveling and drying unit for performing said leveling process and said drying process; and a removing unit for performing said removing process. 11. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage and leveling unit for performing said coverage process and said leveling process; a drying unit for performing said drying process; and a removing unit for performing said removing process. 12. A substrate processing apparatus as defined in claim 5, wherein said plurality of separate processing units include: a coverage unit for performing said coverage process; a leveling unit for performing said leveling process; a drying unit for performing said drying process; and a removing unit for performing said removing process. 13. A substrate processing apparatus as defined in claim 5, wherein said removing process comprises an edge rinsing for removing the film of coating solution from edges of the substrate. 14. A substrate processing apparatus as defined in claim 5, wherein said removing process comprises a back rinsing for removing the coating solution from a back surface of the substrate. 15. A substrate processing apparatus comprising a coating section for forming a film of coating solution on a substrate, a developing section for developing the substrate after a coating process and an exposing process, a heat-treating section for heat-treating the substrate before and after the coating and developing processes, and a transport mechanism for transporting the substrate to each processing section, wherein said coating section performs a series of film forming processes including a coverage process for supplying a coating solution on the substrate and covering a surface of the substrate with the coating so