$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method of processing and plating planar articles 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-001/18
  • B05D-001/02
출원번호 US-0907253 (2001-07-16)
발명자 / 주소
  • Gramarossa, Daniel J.
  • Downes, Gary C.
출원인 / 주소
  • Technic Inc.
대리인 / 주소
    Blakely Sokoloff Taylor & Zafman LLP
인용정보 피인용 횟수 : 5  인용 특허 : 36

초록

A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and

대표청구항

A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and

이 특허에 인용된 특허 (36)

  1. Hollars Dennis R. ; Waltrip Delbert F. ; Zubeck Robert B. ; Bonigut Josef ; Smith Robert M. ; Payne Gary L., Apparatus and method for high throughput sputtering.
  2. Katuki Yamasaki JP; Osamu Kuroda JP; Kazuyuki Honda JP; Hiroshi Yamahata JP, Apparatus for and method of transporting substrates to be processed.
  3. Shishkin Viktor V. (ulitsa Festivalnava ; 1 ; kv. 5 Krasnodar SUX) Samuliev Jury D. (Petropavlovsk ulitsa Bostandyxkaya ; 3 ; kv. 10 Severo-Kazakhstanskava oblast SUX) Shapovalov Jury P. (ulitsa Alma, Apparatus for cleaning the inner surface of a pipeline from deposits and for forming a protective coating.
  4. Iseki Izuru,JPX ; Sato Seiichiro,JPX ; Muraoka Yusuke,JPX, Apparatus for processing substrates.
  5. Greene George W. (Burlington MA) Albrecht Peter D. (Spartanburg SC) Strittmatter Kenneth D. (Mauldin SC) Hidalgo Rafael (Greenville SC), Automated wafer lapping system.
  6. Taniguchi Kazuhiro,JPX, Automatic wafer plating equipment.
  7. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Disk or wafer handling and coating system.
  8. Bhatt Anilkumar C. (Johnson City NY) Freeman Michael T. (Endicott NY) Konrad John J. (Endicott NY) Shah Narendra G. (Johnson City NY), Electrode array and use thereof.
  9. Kumasaka Osamu (Yamanashi JPX) Yamaoka Nobuki (Yamanashi JPX), Electroless plating method and apparatus.
  10. Reid Jonathan D. ; Taatjes Steven W. ; Contolini Robert J. ; Patton Evan E., Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability.
  11. Horsky Thomas N. (Boxborough MA) Reynolds William E. (Topsfield MA) Cloutier Richard M. (Salisbury MA), Endcap for indirectly heated cathode of ion source.
  12. Horzel Jorg,BEX ; Szlufcik Jozef,BEX ; Nijs Johan,BEX, Furnace for continuous, high throughput diffusion processes from various diffusion sources.
  13. Hollars Dennis R. ; Waltrip Delbert F. ; Zubeck Robert B. ; Bonigut Josef ; Smith Robert M. ; Payne Gary L., Heating system for high throughput sputtering.
  14. Leonov Mark (Santa Clara CA) Kerba Emile N. (Los Altos CA) Aknin Jack (San Carlos CA), Holder mechanism for simultaneously tilting and rotating a wafer cassette.
  15. Flint Alan (Los Gatos CA) Miller Ken (Mt. View CA) Shah Sushil (Sunnyvale CA), In-line disk sputtering system.
  16. Bouchaib Pierre (L\Etang la Ville FRX), Installation for treatment of materials for the production of semi-conductors.
  17. Canady Mickey Lynn (Rochester MN) Edmonson David Alvoid (Rochester MN) Johnson Gary James (Rochester MN) Teig Paul David (Byron MN) Wall Arthur Carl (Rochester MN), Method and apparatus for coating thin film data storage disks.
  18. Botts Robert R. ; Joshi Swati V. ; Nicholls Louis W., Method and apparatus using an anode basket for electroplating a workpiece.
  19. Kuczma ; Jr. John J. (Poplar Creek Rd. Nashville TN 37201), Method for the electroless nickel plating of long bodies.
  20. Yamazaki, Shunpei, Method of making a non-single-crystalline semi-conductor layer on a substrate.
  21. Scott John C. (Saratoga CA) Li Eric K. (Palo Alto CA) Washburn Hudson A. (Santa Clara CA) Viswanathan Nal T. (San Jose CA), Method of making a thin film magnetic disk.
  22. Kubo Toyoshige (Hitachi JPX) Fujishima Katsuhiko (Hitachi JPX) Yamamoto Narito (Hitachi JPX), Method of producing electrolytic copper foil and apparatus for producing same.
  23. Bacon Duane E. (Lee\s Summit MO) Hecox Spencer S. (Raytown MO), Methods of and apparatus for electroplating preselected surface regions of electrical articles.
  24. Kosaki Katsuya,JPX ; Tamaki Masahiro,JPX, Plating apparatus for plating a wafer.
  25. Buschow Adolph G. (Largo FL) Eidschun Charles D. (Seminole FL), Plating method and apparatus.
  26. Tzanavaras George (2674 Park Wilshire Dr. San Jose CA 95124) Cohen Uri (765 San Antonio Rd. ; #53 Palo Alto CA 94303), Precision high rate electroplating cell and method.
  27. Galik George M. (3236 Falcon Ridge Rd. Diamond Bar CA 91765), Printed circuit board fine line plating.
  28. Hubel Egon (Feucht DEX), Process for improving the coating of electrolytically treated work pieces, and arrngement for carrying out the process.
  29. Klein Gerhart P. (Manchester MA) Kallianidis Milton (Brockton MA), Riser protection for anodes.
  30. Arken David M. ; Chiu Andrew ; Fatula ; Jr. Joseph John ; Hitzfield Robert William ; Hsiao Wen-Chien David ; Hsiao Yiping, Rotary plater with radially distributed plating solution.
  31. Ting Chiu H. ; Holtkamp William H. ; Ko Wen C., Rotating anode for a wafer processing chamber.
  32. Begin Robert George ; Clarke Peter J., System for and method of providing a controlled deposition on wafers.
  33. Love Robert B. (Franklin TN), Vacuum deposition system and method.
  34. Reed Ronald G. (Colorado Springs CO), Variable size segmented anode array for electroplating.
  35. Frey Bernhard M., Wafer cleaning system.
  36. Uzoh Cyprian Emeka, Wafer edge deplater for chemical mechanical polishing of substrates.

이 특허를 인용한 특허 (5)

  1. Hong, Heung-Ki, Deposition apparatus, method for manufacturing organic light emitting display apparatus, and organic light emitting display apparatus.
  2. Calcaterra, Anthony; Knox, David, Method and apparatus for applying a voltage to a substrate during plating.
  3. Calcaterra,Anthony; Knox,David, Method and apparatus for applying a voltage to a substrate during plating.
  4. Olsen, Gerald L.; Huang, Lee Ping; Betin, Leslie Ramsay, Method and apparatus for washing, etching, rinsing, and plating substrates.
  5. Emoto, Jun; Kagaya, Takeshi; Yamazaki, Kazuo, Wafer processing apparatus having wafer mapping function.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로