초록 ▼

A small-sized hydroelectric power generating apparatus includes a body case having a fluid passage, a water wheel provided at the above fluid passage and rotating with passing of the fluid having the predetermined flowing amount, a rotator coupled to this water wheel, and rotating with the water whe

A small-sized hydroelectric power generating apparatus includes a body case having a fluid passage, a water wheel provided at the above fluid passage and rotating with passing of the fluid having the predetermined flowing amount, a rotator coupled to this water wheel, and rotating with the water wheel, the rotator serving as a rotor portion arranged opposed to a stator portion, the rotor portion being relatively rotated in relation to the stator portion by passing the fluid to generate electric power, the stator portion having comb-shaped pole teeth which are arranged in the circumferential direction at regular intervals so as to be opposed to the peripheral surface of a rotor magnet of the above rotor portion, and a circumferential gap between the adjacent pole teeth is set to 1.5 times or less the size of a radial gap between each pole tooth and the rotor magnet.

대표청구항 ▼

A small-sized hydroelectric power generating apparatus includes a body case having a fluid passage, a water wheel provided at the above fluid passage and rotating with passing of the fluid having the predetermined flowing amount, a rotator coupled to this water wheel, and rotating with the water whe

A small-sized hydroelectric power generating apparatus includes a body case having a fluid passage, a water wheel provided at the above fluid passage and rotating with passing of the fluid having the predetermined flowing amount, a rotator coupled to this water wheel, and rotating with the water wheel, the rotator serving as a rotor portion arranged opposed to a stator portion, the rotor portion being relatively rotated in relation to the stator portion by passing the fluid to generate electric power, the stator portion having comb-shaped pole teeth which are arranged in the circumferential direction at regular intervals so as to be opposed to the peripheral surface of a rotor magnet of the above rotor portion, and a circumferential gap between the adjacent pole teeth is set to 1.5 times or less the size of a radial gap between each pole tooth and the rotor magnet. t least post contact; and at least a post electrode in said at least through hole, said at least post electrode having a bottom portion in contact with a top of said at least post contact and a top portion in contact with said at least bump, so that said at least land portion is electrically connected through said at least post electrode and said at least post contact to said bump. 6. The semiconductor device as claimed in claim 5, further comprising: an adhesive metal layer interposed between said at least pad electrode and said at least land portion. 7. The semiconductor device as claimed in claim 6, wherein said adhesive metal layer comprises a metal having a high adhesiveness with said at least pad electrode and a gentle metal inter-diffusion as well as a high adhesiveness with said insulative resin stress buffer layer. 8. The semiconductor device as claimed in claim 1, further comprising: an adhesive layer provided over said land portion and said insulative resin stress buffer layer; and an insulating sheet provided over said adhesive layer, wherein said at least bump is partially buried in said adhesive layer and said insulating sheet, and a bottom of said at least bump is in contact directly with said top surface of said land portion, and said bump is tightly supported by said adhesive layer and secured to said land portion. 9. The semiconductor device as claimed in claim 8, further comprising: an adhesive metal layer interposed between said at least pad electrode and said at least land portion. 10. The semiconductor device as claimed in claim 9, wherein said adhesive metal layer comprises a metal having a high adhesiveness with said at least pad electrode and a gentle metal inter-diffusion as well as a high adhesiveness with said insulative resin stress buffer layer. 11. The semiconductor device as claimed in claim 1, wherein said adhesive metal layer comprises a titanium-based alloy. 12. The semiconductor device as claimed in claim 1, wherein said adhesive metal layer comprises chromium. 13. The semiconductor device as claimed in claim 1, wherein said at least land portion comprises a part of a re-wiring layer extending over said insulative resin stress buffer layer. 14. The semiconductor device as claimed in claim 1, wherein said insulative resin stress buffer layer comprises an organic resin material having a decomposition temperature of not less than 200° C. 15. The semiconductor device as claimed in claim 1, wherein said insulative resin stress buffer layer includes a thermosetting resin composition. 16. The semiconductor device as claimed in claim 1, wherein said insulative resin stress buffer layer comprises a photo-sensitive resin composition. 17. The semiconductor device as claimed in claim 1, wherein said at least bump comprises a spherical solder bump. 18. A semiconductor device comprising: a semiconductor substrate; at least a pad electrode provided over said semiconductor substrate; a passivation film provided over said semiconductor substrate; an insulative resin stress buffer layer provided over said at least pad electrode and said passivation film, said insulative resin stress buffer layer having at least an opening positioned over at least a part of said at least pad electrode; at least a land portion provided over said insulative resin stress buffer layer and also electrically connected to said at least pad electrode, and a top surface of said at least land portion being electrically connected to at least a bump which is positioned over said at least land portion; an adhesive layer provided over said land portion and said insulative resin stress buffer layer; an insulating sheet provided over said adhesive layer; at least a through hole penetrating said insulating sheet and said adhesive layer, and said at least through hole being positioned over said at least land portion; and at least a post electrode in said at least through hole, said at least post electrode having