초록 ▼

A method to fabricate a bonding pad structure including the following steps. A substrate having a top metal layer and a passivation layer overlying the top metal layer is provided. The top metal layer being electrically connected to a lower metal layer by at least one metal via within a metal via ar

A method to fabricate a bonding pad structure including the following steps. A substrate having a top metal layer and a passivation layer overlying the top metal layer is provided. The top metal layer being electrically connected to a lower metal layer by at least one metal via within a metal via area. The substrate includes a low-k dielectric layer at least between the lower metal layer and the top metal layer. The passivation layer is etched within the metal via area to form a trench exposing at least a portion of the top metal layer. A patterned, extended bonding pad is formed over the etched passivation layer and lining the trench. The extended bonding pad having a portion that extends over a peripheral planar area of the substrate adjacent the trench not within the metal via area. A wire bond is bonded to the extended bonding pad at the peripheral planar area portion to form the bonding pad structure.

대표청구항 ▼

A method to fabricate a bonding pad structure including the following steps. A substrate having a top metal layer and a passivation layer overlying the top metal layer is provided. The top metal layer being electrically connected to a lower metal layer by at least one metal via within a metal via ar

A method to fabricate a bonding pad structure including the following steps. A substrate having a top metal layer and a passivation layer overlying the top metal layer is provided. The top metal layer being electrically connected to a lower metal layer by at least one metal via within a metal via area. The substrate includes a low-k dielectric layer at least between the lower metal layer and the top metal layer. The passivation layer is etched within the metal via area to form a trench exposing at least a portion of the top metal layer. A patterned, extended bonding pad is formed over the etched passivation layer and lining the trench. The extended bonding pad having a portion that extends over a peripheral planar area of the substrate adjacent the trench not within the metal via area. A wire bond is bonded to the extended bonding pad at the peripheral planar area portion to form the bonding pad structure. is direction, for adjusting the angular distribution of the light from the secondary light source upon the surface to be illuminated, without changing the illuminance distribution of the light from the secondary light source upon the surface to be illuminated. 2. An illumination optical system according to claim 1, wherein said condensing optical system includes a first lens group and a second lens group in an order along the advancement of the light, and said first lens group is actuated to change the illuminance distribution on the surface illuminated, while said second lens group is actuated to change the angular distribution of the light incident on the surface. 3. An illumination optical system according to claim 1, wherein said first lens group includes at least two lens elements which are movable along an optical axis direction independently of each other to change distortion on the surface illuminated, thereby to change the illuminance distribution. 4. An illumination optical system according to any one of claim 1, wherein said first lens group includes at least two lens elements which are movable along an optical axis direction independently of each other to correct a change in a focal distance and an aberration, other than distortion, thereby to change the illuminance distribution on the surface. 5. An illumination optical system according to claim 4, wherein one of said at least two lenses, which is close to the surface to be illuminated, comprises a negative meniscus lens having a concave surface facing to the surface. 6. An illumination optical system according to claim 1, wherein said second lens group is movable along an optical axis direction to change the angular distribution of the light incident on the surface, about an optical axis and with respect to a magnification, while correcting a change in a focal distance and an aberration. 7. An illumination optical system according to claim 1, wherein, when the proportion of the image height is X(0≤X≤1) and the distortion at the most abaxial image height (X=1) is D(%), the distortion Y(%) of said condensing optical system at different image heights satisfied a relation: Y=D×Xn(1.5≤n≤3.0). 8. An exposure apparatus, comprising: an illumination optical system as recited in claim 1, for illuminating a pattern of a mask; and a projection optical system for projecting the pattern onto a photosensitive substrate. 9. An apparatus according to claim 8, further comprising detecting means for detecting an angular distribution and an illuminance distribution of exposure light incident on the photosensitive substrate, and driving means for driving a first lens group and a second lens group, respectively, in accordance with a result of the detection by said detecting means. 10. An apparatus according to claim 9, wherein said detecting means is arranged to detect a change in an illuminance distribution on the photosensitive substrate as an illumination condition for illumination of the mask is changed, and a change in an angular distribution of the exposure light incident on the photosensitive substrate, and wherein the illuminance distribution and the angular distribution of the exposure light incident on the photosensitive substrate are corrected on the basis of a result of a detection by said detecting means. 11. An exposure method for projecting a pattern of a mask onto a photosensitive substrate by use of an exposure apparatus as recited in claim 8, said method comprising the steps of: detecting a change in an illuminance distribution on the photosensitive substrate produced with a change in an illumination condition for illumination of the mask, and a change in an angular distribution of exposure light incident on the photosensitive substrate; and correcting the illuminance distribution and the angular distribution on the basis of a result of the detection, by adjusting a condensing optical system. 12. A device manufacturing method, comprising