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Evaporator employing a liquid superheat tolerant wick 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0933589 (2001-08-21)
발명자 / 주소
  • Kroliczek, Edward J.
  • Wrenn, Kimberly R.
  • Wolf, Sr., David A.
출원인 / 주소
  • Swales Aerospace
대리인 / 주소
    Roberts Abokhair & Mardula, LLC
인용정보 피인용 횟수 : 21  인용 특허 : 25

초록

A capillary wick for use in capillary evaporators has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels to the liquid reservoir. Use of a central liquid flow channel in the wick is eliminated, and pore size in the

대표청구항

A capillary wick for use in capillary evaporators has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels to the liquid reservoir. Use of a central liquid flow channel in the wick is eliminated, and pore size in the

이 특허에 인용된 특허 (25)

  1. Chao Shun-Lung (Plano TX) McEwin ; Jr. Louis W. (Plano TX), Apparatus and method for cooling electronic devices.
  2. Sawata ; Shinji ; Tani ; Tatsuo ; Tanaka ; Tadayoshi ; Horigome ; Takash i, Apparatus for heat transfer.
  3. Dunbar Neil William,GBX, Capillary evaporator.
  4. Owen James W. (Huntsville AL), Capillary heat transport and fluid management device.
  5. Swanson Theodore D. ; Wren ; deceased Paul, Capillary pumped loop body heat exchanger.
  6. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  7. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  8. Seidenberg Benjamin (Baltimore MD) Swanson Theodore D. (Columbia MD), Ceramic heat pipe wick.
  9. Conte Alfred S. (Hollister CA), Cooling multi-chip modules using embedded heat pipes.
  10. Meyer ; IV George A. (Conestoga PA) Garner Scott D. (Lititz PA), Electrically insulated envelope heat pipe.
  11. Mueller Robert (Moordeich DEX), Evaporator, especially for discharging waste heat.
  12. Marcus Bruce D. (Los Angeles CA) Fleischman George L. (Inglewood CA), Flat-plate heat pipe.
  13. Marcus Bruce D. (Los Angeles CA) Edwards Donald K. (Los Angeles CA), Graded pore size heat pipe wick.
  14. Ogushi Tetsurou (Amagasaki JPX) Murakami Masaaki (Amagasaki JPX) Yabuchi Kazuyoshi (Amagasaki JPX) Yao Akira (Kamakura JPX), Heat pipe.
  15. Basiulis Algerd (Redondo Beach CA), Heat pipe cooling module for high power circuit boards.
  16. Maidanik Jury F. (Sverdlovsk SUX) Vershinin Sergei V. (Sverdlovsk SUX) Kholodov Valery F. (Zhukovsky SUX) Dolgirev Jury E. (Sverdlovsk SUX), Heat transfer apparatus.
  17. Kiseev Valery M. (Sverdlovsk SUX) Maidanik Jury F. (Sverdlovsk SUX) Gerasimov Jury F. (Sverdlovsk SUX), Heat-transporting device.
  18. Asselman George Albert Apolonia (Eindhoven NL) Green David Bruce (Weymouth EN) Castelijns Adrianus Petrus Johannes (Eindhoven NL) Naastepad Pieter Aart (Eindhoven NL) De Ruiter Jacob Willem (Eindhove, Heating device.
  19. Lomolino ; Sr. Paul A. (Danville CA) Lomolino ; Jr. Paul A. (Tracy CA) Lean Grace A. (Livermore CA) Burns Patricia L. (San Jose CA), Method and apparatus for a self contained heat exchanger.
  20. Anderson Timothy Merrill ; Chrysler Gregory Martin ; Chu Richard Chao-Fan, Orientation independent evaporator.
  21. Sata ; Takeo ; Takamura ; Masayuki ; Shinoda ; Norio ; Hatae ; Masataka, Process for producing a heat pipe.
  22. Bizzell Gary D. (Los Altos CA) Ekern William F. (Sunnyvale CA), Pump-assisted heat pipe.
  23. Tanzer Herbert J. (Topanga CA), Space vehicle thermal rejection system.
  24. Sarraf David B. (Elizabethtown PA) Shaubach Robert M. (Lititz PA) Eastman George Y. (Lancaster PA), Tunnel artery wick for high power density surfaces.
  25. Cima Richard M. (Palo Alto CA), Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system.

이 특허를 인용한 특허 (21)

  1. Kim, Ye-Yong; Choi, Young-Don, Cooling apparatus for electronic device.
  2. Takamatsu, Tomonao; Hisano, Katsumi; Iwasaki, Hideo, Evaporator and circulation type cooling equipment using the evaporator.
  3. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  4. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  5. Wong,Shwin Chung, Flat-plate heat pipe containing channels.
  6. Thayer,John Gilbert; Ernst,Donald M., Heat pipe evaporator with porous valve.
  7. Hou, Tung-Fu, High efficiency isothermal heat sink.
  8. Wang, Cheng-Tu; Liao, Pang-Hung; Tseng, Kuo-Feng; Chang, Wen-Tsai, Long-acting heat pipe and corresponding manufacturing method.
  9. Kang, Shung-Wen; Tsai, Meng-Chang, Loop heat pipe with flat evaportor having a wick with an internal chamber.
  10. Chung, Ming-Hsiu; Cheng, Nien-Tien, Manufacturing method of casing of heat pipe.
  11. Kim, Chul-Ju; Seo, Min-Whan; Sung, Byung-Ho; Yoo, Jung-Hyun; Choi, Jee-Hoon; Ki, Jae-Hyung, Method for manufacturing evaporator for loop heat pipe system.
  12. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  13. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  14. Liu, I-Ming, Radiator plate rapid cooling apparatus.
  15. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  16. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  17. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  18. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  19. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  20. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  21. Hul Chun,Hsu, Wick structure of heat pipe.
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