초록 ▼

A bright metallized formable film laminate having excellent optical and deformation properties. The bright metallized formable film laminate preferably includes a formable, weatherable clear coat film comprising polyvinylidene difluoride, a formable clear coat leveling layer on the weatherable clear

A bright metallized formable film laminate having excellent optical and deformation properties. The bright metallized formable film laminate preferably includes a formable, weatherable clear coat film comprising polyvinylidene difluoride, a formable clear coat leveling layer on the weatherable clear coat film, and a discontinuous layer of indium islands deposited on the formable leveling layer, opposite said weatherable clear coat film. Also disclosed are methods of making such bright metallized formable film laminates.

대표청구항 ▼

A bright metallized formable film laminate having excellent optical and deformation properties. The bright metallized formable film laminate preferably includes a formable, weatherable clear coat film comprising polyvinylidene difluoride, a formable clear coat leveling layer on the weatherable clear

A bright metallized formable film laminate having excellent optical and deformation properties. The bright metallized formable film laminate preferably includes a formable, weatherable clear coat film comprising polyvinylidene difluoride, a formable clear coat leveling layer on the weatherable clear coat film, and a discontinuous layer of indium islands deposited on the formable leveling layer, opposite said weatherable clear coat film. Also disclosed are methods of making such bright metallized formable film laminates. ct with a surface of each wiring, and a distance between the electrical insulating substrate and the surface of each wiring that is in contact with the conductor is substantially the same. 3. The circuit board according to claim 1, wherein surfaces of the wirings in contact with the conductor are embedded in the adhesive layers. 4. The circuit board according to claim 1, wherein the conductor is formed of a conductive paste. 5. The circuit board according to claim 1, wherein the electrical insulating substrate is formed of a compound of fiber and thermosetting resin. 6. The circuit board according to claim 1, wherein the electrical insulating substrate is formed of an organic resin film. 7. The circuit board according to claim 1, wherein the adhesive layers are formed of thermosetting organic resin. 8. A multilayer circuit board, comprising at least one circuit board according to claim 1.