[특허]Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing

[미국특허] Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B65D-041/02
출원번호	US-0651512 (2000-08-30)
발명자 / 주소	Tabrizi, Farzad Kitazumi, Barry Barker, David A. Setton, David A. Niewmierzycki, Leszek Kuhlman, Michael J.
출원인 / 주소	Mattson Technology, Inc.
대리인 / 주소	Wilson Sonsini Goodrich & Rosati
인용정보	피인용 횟수 : 22 인용 특허 : 35

초록 ▼

A workpiece handling system with dual load locks, a transport chamber and a process chamber. Workpieces may be retrieved from one load lock for processing at vacuum pressure, while workpieces are unloaded from the other load lock at the pressure of the surrounding environment. The transport chamber has a transport robot with two arms. Processed workpieces and new workpieces may be exchanged by a simple under/over motion of the two robot arms. The transport robot rotates about a central shaft to align with the load locks or the process chamber. The robot may also be raised or lowered to align the arms with the desired location to which workpieces are deposited or from which workpieces are retrieved. The two load locks may be positioned one above the other such that a simple vertical motion of the robot can be used to select between the two load locks. The two load locks and transport robot allow almost continuous processing. Additional process chambers may be added to the transport chamber to further increase throughput. Each stage of the workpiece handling system may also be designed to handle multiple workpieces, such as two side by side workpieces. Throughput is increased while allowing shared machinery to be used. Linear and rotational doors may be used for the load locks to provide a simple, compact design.

대표청구항 ▼

1. An apparatus for selectively allowing workpieces to enter a chamber having a low contamination environment, the apparatus comprising: a door member comprising an outer frame portion and an inner plate portion, the outer frame portion forming a recessed cavity for receiving the inner plate portion; a connector for coupling the outer frame portion to the chamber, the connector configured to vertically guide the door member to a first position and a second position, the first position substantially covering an aperture formed in the chamber and the second position substantially exposing the aperture; and an extendable connector, coupled between the outer frame portion and the inner plate portion, configured to extend the inner plate portion when the door member is in the first position to form a seal with a peripheral portion of the aperture. 2. The apparatus of claim 1, wherein the extendable connector comprises a spring. 3. The apparatus of claim 1, wherein the extendable connector compresses the inner plate portion toward the chamber when the door member is in the first position. 4. The apparatus of claim 3, wherein the inner plate portion comprises a magnetically responsive material. 5. The apparatus of claim 4, wherein the inner plate portion is further compressed toward the aperture via a magnetic force. 6. The apparatus of claim 1, wherein the extendable connector is further configured to retract the inner plate portion within the recessed cavity of the outer frame portion when the door member is in the second position.

이 특허에 인용된 특허 (35) 인용/피인용 타임라인 분석

Hirasawa Shigeki (Ibaraki) Torii Takuji (Ushiku) Watanabe Tomoji (Ibaraki) Komatsu Toshihiro (Ibaraki) Honma Kazuo (Ibaraki) Sakai Akihiko (Ibaraki) Takagaki Tetsuya (Tokorozawa) Uchino Toshiyuki (To, Apparatus and method for performing heat treatment on semiconductor wafers.
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Sheets Ronald E. (Santa Ana CA), Apparatus for heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivatio.
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Breunig Steffen,DEX ; Hasenoehrl Oliver,DEX ; Klein Berthold,DEX, Arrangement for guiding a swing-out sliding door on a vehicle body.
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Glants Alex, Automatic positive pressure seal access door.
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Jones Clifford D., Automatic toilet seat closing device.
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Sugimura Shunsuke,JPX ; Nose Matsuo,JPX, Control device for a work carrying system.
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Mosior Donald J. (Lake Geneva WI) Hay Edward C. (Crystal Lake IL), Disposal container with locking closure.
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Erben Hannes (Donauwoerth DEX) Buchs Wolfgang (Donauwoerth DEX), Door system, particularly for a passenger plane.
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Fairbairn Kevin ; Lane Christopher ; Colborne Kelly ; Sundar Satish, Dual blade robot.
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Kroeker Tony ; Mooring Ben, Dual plane robot.
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Sieradzki Manny (Gloucester MA), High speed movement of workpieces in vacuum processing.
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Quan Pei Xin (Beijing CNX) Hou Dong Yan (Beijing CNX) Chen Bi-Xian (Beijing CNX) Ma Teng Ge (Beijing CNX) Lin Hui Wang (Beijing CNX) Li Zhi Jian (Beijing CNX), Induction system for rapid heat treatment of semiconductor wafers.
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Haraguchi Hideo (Toyonaka JPX) Suzuki Masaki (Hirakata JPX) Ishida Toshimichi (Hirakata JPX), Method of handling wafers in a vacuum processing apparatus.
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Orgami Nobutoshi (Kyoto JPX) Fukutomi Yoshiteru (Kyoto JPX), Method of heat treating a substrate with standby and treatment time periods.
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Sheets Ronald E. (Santa Ana CA), Method of heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation la.
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Asakawa Teruo,JPX ; Saeki Hiroaki,JPX, Multi-chamber treatment system.
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Jonsson, Bert O., Object sensing apparatus for an automatic door.
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Kawanobe Osamu,JPX ; Shimura Ryoji,JPX, Open/close control system for a vehicle slide door.
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Britzke Ingo (Kassel DEX) Dilcher Dietmar (Vellmar DEX), Pivotable sliding door for vehicles.
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Peter Walter H., Proximity sensor.
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Moore Gary M. (San Jose CA) Nishikawa Katsuhito (San Jose CA), Rapid thermal processing apparatus for processing semiconductor wafers.
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Sisbarro Thomas A. (536 Killin Ct. Reynoldsburg OH 43068), Safety top modular door closure system for a vapor degreaser.
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Palmieri Thomas (Paramus NJ) Babson Arthur L. (Chester NJ), Self-sealing reagent container and reagent container system.
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Imahashi Issei (Yamanashi-ken JPX), Semiconductor processing system.
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Araki Shinichiro (Kumamoto JPX), Semiconductor treatment system and method for exchanging and treating substrate.
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Nulman Jaim (Palo Alto CA), Single anneal step process for forming titanium silicide on semiconductor wafer.
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Kim Sun Y., Slide hatch for bulk carrier.
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Kornbrekke Henning N. (Burlington CT) Ranaudo Anthony R. (Naugatuck CT), Sliding door threshold sensor.
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Davis ; Jr. James C. (Carlisle MA) Hofmeister Christopher A. (Hampstead NH), Substrate transport apparatus with dual substrate holders.
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Hofmeister Christopher A., Swap out plate and assembly.
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Stonestreet Paul (Cowfold GB2) Allum Clive (Crawley GB2) Webber Bert (Crawley GB2) Cooke Richard (West Worthing GB2) Robinson Frederick J. L. (Crawley GB2) Wauk ; II Michael T. (Haywards Heath GB2), Systems and methods for wafer handling in semiconductor process equipment.
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Watanabe Hirofumi,JPX ; Matsuo Daisaku,JPX, Tension adjusting apparatus for use in vehicle door powered sliding device.
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Soraoka Minoru,JPX ; Yoshioka Ken,JPX ; Kawasaki Yoshinao,JPX, Vacuum processing apparatus and semiconductor manufacturing line using the same.
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Tam Johann (Saratoga CA) Ashjaee Jalal (Mountain View CA) Kuwaki Nobuo B. (San Jose CA) Ngo Tuan M. (Milpitas CA) Kung Susan W. (Oakland CA), Wafer handling apparatus and method.
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Davis Cecil J. (Greenville TX) Matthews Robert T. (Plano TX), Wafer processing apparatus.
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이 특허를 인용한 특허 (22) 인용/피인용 타임라인 분석

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Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
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Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
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Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
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Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
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Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
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Gage, Chris; Genetti, Damon, High throughput method of in transit wafer position correction in a system using multiple robots.
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Gage, Chris; Genetti, Damon, High throughput method of in transit wafer position correction in system using multiple robots.
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Yazawa, Takayuki; Nakajima, Hiroto, Industrial robot.
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Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
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Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
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Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
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Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
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Niewmierzycki, Leszek, Low cost high throughput processing platform.
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Niewmierzycki, Leszek; Barker, David; Devine, Daniel J.; Kuhlman, Michael; Pakulski, Ryan; Shan, Hongqing; Zucker, Martin, Low cost high throughput processing platform.
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Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
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Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
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Blahnik,Jeff; Kraus,Joe; Rice,Mike, Single-sided inflatable vertical slit valve.
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Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.
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Genetti, Damon; Hamilton, Shawn; Blank, Rich; Templeton, James Sheldon, Wafer position correction with a dual, side-by-side wafer transfer robot.
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Genetti, Damon; Hamilton, Shawn; Blank, Rich; Templeton, Sheldon, Wafer position correction with a dual, side-by-side wafer transfer robot.
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[미국특허] Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing 원문보기