초록 ▼

A light output control system for implementing a method for sensing the tri-stimulus values for controlling a light output illuminated from an LED based luminary is disclosed. The system comprises one or more filter/photo diode sensors for sensing a first set of tri-stimulus values of the light outp

A light output control system for implementing a method for sensing the tri-stimulus values for controlling a light output illuminated from an LED based luminary is disclosed. The system comprises one or more filter/photo diode sensors for sensing a first set of tri-stimulus values of the light output and providing signals indicative thereof. The signals are utilized in a transformation matrix whereby a second set of tri-stimulus values is obtained. The system controls the light output as a function of the second set of tri-stimulus values.

대표청구항 ▼

A light output control system for implementing a method for sensing the tri-stimulus values for controlling a light output illuminated from an LED based luminary is disclosed. The system comprises one or more filter/photo diode sensors for sensing a first set of tri-stimulus values of the light outp

A light output control system for implementing a method for sensing the tri-stimulus values for controlling a light output illuminated from an LED based luminary is disclosed. The system comprises one or more filter/photo diode sensors for sensing a first set of tri-stimulus values of the light output and providing signals indicative thereof. The signals are utilized in a transformation matrix whereby a second set of tri-stimulus values is obtained. The system controls the light output as a function of the second set of tri-stimulus values. ation source produces an average laser radiation power of greater than 2 watts. 8. A method according to claim 1, wherein said at least one metal layer comprises a copper layer being drilled by said radiation having said wavelength which is in a range of from above 3 μm to about 5 μm. 9. A method according to claim 8, wherein the pulsed laser radiation source comprises a Holmium laser. 10. A method according to claim 8, wherein the pulsed laser radiation source comprises an Erbium laser. 11. A method according to claim 8, wherein the pulsed laser radiation source comprises a laser and an optical parametric oscillator, and the providing step comprises: emitting, by said laser, initial radiation having an initial wavelength shorter than said wavelength; and converting, by said optical parametric oscillator, the initial radiation having said initial wavelength into said radiation having said wavelength. 12. A method according to claim 8, wherein the pulsed laser radiation source comprises a laser and an optical parametric amplifier, and the providing step comprises: emitting, by said laser, initial radiation having an initial wavelength shorter than said wavelength; and converting, by said optical parametric amplifier, the initial radiation having said initial wavelength into said radiation having said wavelength. 13. A method according to claim 8, wherein the pulsed laser radiation source has an irradiation fluence of greater than 10 J/cm2. 14. A method according to claim 1, wherein said at least one dielectric layer is drilled by said radiation having said wavelength which is in a range of from above 3 μm to below 8 μm. 15. A method according to claim 14, wherein the pulsed laser radiation source comprises a Holmium laser. 16. A method according to claim 14, wherein the pulsed laser radiation source comprises an Erbium laser. 17. A method according to claim 14, wherein the pulsed laser radiation source comprises a carbon monoxide laser. 18. A method according to claim 14, wherein the pulsed laser radiation source comprises a laser and an optical parametric oscillator, and the providing step comprises: emitting, by said laser, initial radiation having an initial wavelength shorter than said wavelength; and converting, by said optical parametric oscillator, the initial radiation having said initial wavelength into said radiation having said wavelength. 19. A method according to claim 14, wherein the pulsed laser radiation source comprises a laser and an optical parametric amplifier, and the providing step comprises: emitting, by said laser, initial radiation having an initial wavelength shorter than said wavelength; and converting, by said optical parametric amplifier, the initial radiation having said initial wavelength into said radiation having said wavelength. 20. A method according to claim 14, wherein the dielectric layer comprises a polymer based material, and the wavelength of the radiation is chosen to match a strong absorption or absorptions in the material. 21. A method according to claim 20, wherein the pulsed laser radiation source comprises a carbon monoxide laser which emits said radiation having said wavelength which matches strong absorptions in said polymer based material corresponding to carbon-oxygen, carbon-hydrogen and carbon-nitrogen bond excitations. 22. A method according to claim 20, wherein the pulsed laser radiation source comprises an Erbium laser which emits laser radiation having a laser wavelength which matches a strong absorption in a resin material used as the dielectric layer. 23. A method according to claim 20, wherein the dielectric layer comprises fibres or dispersed particles of reinforcing materials, and the wavelength of the pulsed laser radiation from the source is chosen to match a strong absorption or absorptions in the reinforcing material. 24. A method according to claim 20, wherein the dielectric layer comprises a dielectric material having a wa ter content, and the pulsed laser radiation source comprises an Erbium laser emitting laser radiation having a laser wavelength of about 2.9 μm which overlaps the strong excitation of hydroxyl bonds in the water. 25. A method according to claim 14, wherein the wavelength of the radiation is chosen such that the radiation drills the microvia hole in the metal layer, which is a copper layer, without inducing collateral damage to the dielectric layer made of insulating material and underlying the copper layer. 26. A method according to claim 25, wherein the pulsed laser radiation source comprises an Erbium laser emitting laser radiation having a laser wavelength of 2.94 μm. 27. A method according to claim 1, wherein the microvia hole is a blind microvia hole drilled in the dielectric layer and having a bottom defined by the metal layer which is a copper layer, the pulsed laser radiation source emitting said radiation having said wavelength in the mid-infrared spectral region, wherein said radiation is sufficiently strong to remove said dielectric layer but incapable of removing the copper layer thereby the drilling of said blind microvia hole self-limiting at the copper layer beneath the dielectric layer. 28. A method according to claim 27, wherein the wavelength matches an absorptive feature of the material of the dielectric layer. 29. A laser drilling tool for drilling a microvia hole in a printed circuit board which is a laminate of at least one conductive layer and at least one dielectric layer, said tool comprises a pulsed laser radiation source emitting radiation in the infrared wavelength range, wherein said wavelength is longer than 3 μm and shorter than 8 μm. 30. A laser drilling tool according to claim 29, wherein the pulsed laser radiation source comprises a Holmium laser. 31. A laser drilling tool according to claim 29, wherein the pulsed laser radiation source comprises an Erbium laser. 32. A laser drilling tool according to claim 29, wherein the pulsed laser radiation source comprises a laser for emitting an initial radiation having an initial wavelength shorter than said wavelength; and an optical parametric oscillator coupled for receiving said initial radiation and for converting the initial radiation having said initial wavelength into said radiation having said wavelength. 33. A laser drilling tool according to claim 29, wherein the pulsed laser radiation source comprises a laser for emitting an initial radiation having an initial wavelength shorter than said wavelength; and an optical parametric amplifier coupled for receiving said initial radiation and for converting the initial radiation having said initial wavelength into said radiation having said wavelength. 34. A laser drilling tool according to claim 29, wherein the pulsed laser radiation source comprises a carbon monoxide laser. 35. A laser drilling tool according to claim 29, further comprising a system architecture which focuses the radiation on the printed circuit board at a location where the microvia hole is to be drilled. 36. A laser drilling tool according to claim 35, further comprising a motorized table for supporting the printed circuit board and moving the printed circuit board relative to and underneath the focused radiation. 37. A laser drilling tool according to claim 29, wherein the microvia hole comprises blind and through microvia holes drilled in the dielectric layer of the printed circuit board. 38. A laser drilling tool according to claim 29, wherein the microvia hole comprises blind and through microvia holes drilled in the conductive layer which is laminated on top the dielectric layer. 39. A laser drilling tool according to claim 29, wherein the tool drills holes in a percussion mode. 40. A laser drilling tool according to claim 29, wherein the tool drills holes in a trepanning mode. 41. A laser drilling tool according to claim 29, wherein the microvia hole is less than 100 μm in diameter. 42. A method of drillin