초록 ▼

A card dispensing shoe includes a scanner system that discerns the value and suit of each card dispensed, and includes a mechanical barrier to prevent dispensing a card contrary to card game rules. A CPU system within the show executes software pre-programmed with game rules, and controls the barrie

A card dispensing shoe includes a scanner system that discerns the value and suit of each card dispensed, and includes a mechanical barrier to prevent dispensing a card contrary to card game rules. A CPU system within the show executes software pre-programmed with game rules, and controls the barrier to ensure against wrongful dispensing of a card. The card game can be video broadcast along with an image of each scanned card, and the resultant data broadcast over the internet to remotely located bettors who can place bets on the game in progress.

대표청구항 ▼

A card dispensing shoe includes a scanner system that discerns the value and suit of each card dispensed, and includes a mechanical barrier to prevent dispensing a card contrary to card game rules. A CPU system within the show executes software pre-programmed with game rules, and controls the barrie

A card dispensing shoe includes a scanner system that discerns the value and suit of each card dispensed, and includes a mechanical barrier to prevent dispensing a card contrary to card game rules. A CPU system within the show executes software pre-programmed with game rules, and controls the barrier to ensure against wrongful dispensing of a card. The card game can be video broadcast along with an image of each scanned card, and the resultant data broadcast over the internet to remotely located bettors who can place bets on the game in progress. of the substrate, and not displacing the polishing operation location from said first location toward said second location when the polishing operation location is between the first and second locations. 12. The method of claim 11 wherein the second location is more centrally located on the substrate than the first location. 13. The method of claim 11 further comprising rotating at least one of the polishing pad and the substrate separately from the displacement. 14. The method of claim 11 wherein the polishing pad is pressed between a structure and the substrate, and wherein the displacing the polishing operation location comprises displacing the structure relative to the polishing pad. 15. The method of claim 11 wherein the polishing pad only covers a portion of the conductive material, and wherein the displacing the polishing operation location comprises displacing the polishing pad relative to the substrate. 16. The method of claim 15 wherein the displacing comprises moving the substrate relative to the polishing pad. 17. The method of claim 15 wherein the displacing comprises moving the polishing pad relative to the substrate. 18. The method of claim 15 wherein the displacing comprises moving both the polishing pad and the substrate. 19. A semiconductor processing method of removing conductive material, comprising: providing a semiconductor wafer having a conductive material thereover, the wafer comprising an upper surface and an outer periphery around the upper surface, the conductive material extending across the upper surface of the wafer and to about the periphery; electrochemically removing at least some of the conductive material with a polishing pad having a surface in abrasive contact with only a portion of the conductive material; and displacing the polishing pad across the upper surface of the wafer during the removing, the displacing being only from a central region of the wafer surface toward the periphery of the wafer. 20. The method of claim 19 wherein the polishing pad is displaced circularly around the central region to define rings which progress increasingly outward toward the periphery of the wafer. 21. The method of claim 19 further comprising rotating the polishing pad separately from the displacement. 22. The method of claim 19 wherein an electrical circuit is provided through at least a portion of the conductive material during the removing, the circuit extending between at least one second electrical connection in electrical contact with a polishing surface of the polishing pad and at least one first electrical connection in direct electrical contact with conductive material only at the periphery. 23. A semiconductor processing method of removing conductive material, comprising: providing a semiconductor wafer having a conductive material thereover, the wafer comprising an upper surface and an outer periphery around the upper surface, the conductive material extending across the upper surface of the wafer and to about the periphery; electrochemically removing at least some of the conductive material with a polishing pad having a surface in abrasive contact with only a portion of the conductive material, the portion of the conductive material in abrasive contact with the surface being defined as polishing operation location, the polishing pad extending over the conductive material to cover more of the conductive material than the polishing operation location; and displacing the polishing operation location across the upper surface of the wafer during the removing, the displacing being only from a central region of the wafer surface toward the periphery of the wafer. 24. The method of claim 23 wherein the polishing operation location is displaced across the upper surface of the wafer without displacing the polishing pad. 25. The method of claim 23 wherein the polishing operation location is displaced circularly around the central region to define rings which progress increasingly out