[미국특허]
Target fabrication method for cylindrical cathodes
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-014/34
B23K-035/14
B23P-025/00
B21D-035/00
출원번호
US-0871051
(2001-05-31)
발명자
/ 주소
McLeod, Paul Stephen
출원인 / 주소
Seagate Technology LLC
인용정보
피인용 횟수 :
26인용 특허 :
19
초록▼
A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fa
A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fabricating multiple annular rings including each of the basic metal constituents of the desired alloy and attaching the annular rings to the cooling tube such that the exposed outer portions of the annular rings provide a homogeneous layer of the desired alloy on the non-planar substrates during sputtering.
대표청구항▼
A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fa
A method for fabricating cylindrical sputter targets for rotary cylindrical cathodes used in depositing a dielectric layer of desired alloy on non-planar substrates during sputtering is disclosed. The method includes forming a cooling tube having a passage within to receive a cooling medium, then fabricating multiple annular rings including each of the basic metal constituents of the desired alloy and attaching the annular rings to the cooling tube such that the exposed outer portions of the annular rings provide a homogeneous layer of the desired alloy on the non-planar substrates during sputtering. 0, DeHoff; US-4623364, 19861100, Cottringer et al.; US-4652275, 19870300, Bloecher et al.; US-4684678, 19870800, Schultz et al.; US-4707534, 19871100, Schultz; US-4735632, 19880400, Oxman et al.; US-4744802, 19880500, Schwabel; US-4751138, 19880600, Tumey et al.; US-4770671, 19880900, Monroe et al.; US-4773599, 19880900, Lynch et al.; US-4799939, 19890100, Bloecher et al.; US-4802896, 19890200, Law et al.; US-4822464, 19890400, Pocius; US-4836832, 19890600, Tumey et al.; US-4871376, 19891000, DeWald; US-4881951, 19891100, Monroe et al.; US-4927431, 19900500, Buchanan et al.; US-4952342, 19900800, Drain et al.; US-4964883, 19901000, Morris et al.; US-4983672, 19910100, Almer et al.; US-4985340, 19910100, Palazzotto et al.; US-4997461, 19910300, Markhoff-Matheny et al.; US-5009675, 19910400, Kunz et al.; US-5011508, 19910400, Wald et al.; US-5042991, 19910800, Kunz et al.; US-5045363, 19910900, Almer et al.; US-5061294, 19911000, Harmer et al.; US-5090968, 19920200, Pellow; US-5137542, 19920800, Buchanan et al.; US-5152917, 19921000, Pieper et al.; US-5201916, 19930400, Berg et al.; US-5203884, 19930400, Buchanan et al.; US-5213591, 19930500, Celikkaya et al.; US-5215863, 19930600, Nawata et al.; US-5314513, 19940500, Miller et al.; US-5314959, 19940500, Rolando et al.; US-5360462, 19941100, Harmer et al.; US-5435816, 19950700, Spurgeon et al.; US-5436063, 19950700, Follett et al.; US-5451446, 19950900, Kincaid et al.; US-5496387, 19960300, Culler; US-5498235, 19960300, Flower; US-5500273, 19960300, Holmes et al.; US-5549962, 19960800, Holmes et al.; US-5571297, 19961100, Swei et al.; US-5580647, 19961200, Larson et al.; US-5667842, 19970900, Larson et al.; US-5681217, 19971000, Hoopman et al.; US-5704952, 19980100, Law et al.; US-5714259, 19980200, Holmes et al.; US-5833724, 19981100, Wei et al.; US-5855632, 19990100, Stoetzel et al.; US-5855652, 19990100, Talley; US-5863306, 19990100, Wei et al.; US-5863847, 19990100, De Voe et al.; US-5914299, 19990600, Harmer et al., 051/295; US-5922784, 19990700, DeVoe et al.; US-5946991, 19990900, Hoopman; US-5975987, 19991100, Hoopman et al.; US-6017831, 20000100, Beardsley et al.; US-6076248, 20000600, Hoopman et al.; US-6077601, 20000600, DeVoe et al.; US-6129540, 20001000, Hoopman et al.; US-6139594, 20001000, Kincaid et al.
Kirs Milan R. (Lafayette CA) Belkind Abraham I. (North Plainfield NJ) Kurie J. Randall (Livingston NJ) Orban Zoltan (Franklin Park NJ) Boehmler Carolynn (Vacaville CA), Cylindrical magnetron shield structure.
Seeser James W. (Santa Rosa CA) Allen Thomas H. (Santa Rosa CA) Dickey Eric R. (Northfield MN) Hichwa Bryant P. (Santa Rosa CA) Illsley Rolf F. (Santa Rosa CA) Klinger Robert F. (Rohnert Park CA) LeF, Geometries and configurations for magnetron sputtering apparatus.
Seeser James W. ; Allen Thomas H. ; Dickey Eric R. ; Hichwa Bryant P. ; Illsley Rolf F. ; Klinger Robert F. ; Lefebvre Paul M. ; Scobey Michael A. ; Seddon Richard I. ; Soberanis David L. ; Temple Mi, Geometries and configurations for magnetron sputtering apparatus.
Veerasamy Vijayen ; Weiler Manfred,DEX ; Li Eric, Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon.
Bloomquist Darrel R. (Boise ID) Drennan George A. (Eagle ID) Lawton Robert J. (Boise ID) Opfer James E. (Palo Alto CA) Jacobson Michael B. (Boise ID), System and method for depositing plural thin film layers on a substrate.
Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. H. (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA), Wafer coating system.
Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. Howard (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA), Wafer coating system.
Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. Howard (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA), Wafer coating system.
Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
Umezaki, Hiroshi; Miyamoto, Norifumi; Washizu, Kazuhiko; Hamaguchi, Takehiko; Itoh, Kenji, Magnetic head tester and method of manufacturing magnetic disk drive.
Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
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