IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0670079
(2000-09-27)
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발명자
/ 주소 |
- McNulty, Thomas C.
- Rangarajan, Anand
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출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
20 인용 특허 :
13 |
초록
▼
In a readily switchable multiple solar panel system, the individual solar panels are interconnected with a control or switching apparatus which allows the solar panels to be readily switched into various series, parallel, or series-parallel configurations. With a relay based switching apparatus, a r
In a readily switchable multiple solar panel system, the individual solar panels are interconnected with a control or switching apparatus which allows the solar panels to be readily switched into various series, parallel, or series-parallel configurations. With a relay based switching apparatus, a relay is connected between a pair of solar panels, so that in a first state, the panels are in series where the total voltage is the sum of each individual panel's voltage. When the relay is switched to the second state, each solar panel is in parallel, where the total voltage is a single panel's voltage and the current is multiplied by the number of panels. Multiple panels can be connected in this manner, with a relay between each successive pair of panels. With each relay connected in a parallel arrangement, a simple control switch in series with the relay coils can control the panel switching. The coil of each relay can also be individually controlled. Other individual voltage sources than solar panels can similarly be connected through a switching system which provides selective configuration of the sources into series, parallel, or series-parallel arrangements.
대표청구항
▼
In a readily switchable multiple solar panel system, the individual solar panels are interconnected with a control or switching apparatus which allows the solar panels to be readily switched into various series, parallel, or series-parallel configurations. With a relay based switching apparatus, a r
In a readily switchable multiple solar panel system, the individual solar panels are interconnected with a control or switching apparatus which allows the solar panels to be readily switched into various series, parallel, or series-parallel configurations. With a relay based switching apparatus, a relay is connected between a pair of solar panels, so that in a first state, the panels are in series where the total voltage is the sum of each individual panel's voltage. When the relay is switched to the second state, each solar panel is in parallel, where the total voltage is a single panel's voltage and the current is multiplied by the number of panels. Multiple panels can be connected in this manner, with a relay between each successive pair of panels. With each relay connected in a parallel arrangement, a simple control switch in series with the relay coils can control the panel switching. The coil of each relay can also be individually controlled. Other individual voltage sources than solar panels can similarly be connected through a switching system which provides selective configuration of the sources into series, parallel, or series-parallel arrangements. t die is electrically connected to said first surface of said first interposer substrate with wire bonds and said active surface of said at least one second die is electrically connected to said first surface of said second interposer substrate with wire bonds. 13. The assembly according to claim 12, further including a dielectric material disposed between said first and second interposer substrates and substantially encapsulating said wire bonds and said plurality of conductive elements. 14. The assembly according to claim 12, wherein a transverse distance between said first and second interposer substrates is at least greater than a wire bond loop height. 15. The assembly according to claim 12, wherein a transverse distance between said first and second interposer substrates is between one wire bond loop height and two wire bond loop heights. 16. The assembly according to claim 12, wherein a transverse distance between said first and second interposer substrates is at least twice that of a wire bond loop height. 17. The assembly according to claim 11, further including a dielectric material disposed between said first and second interposer substrates and substantially encapsulating said plurality of conductive elements. 18. The assembly of claim 11, wherein said at least one opening of said first interposer substrate and said at least one opening of said second interposer substrate are at least partially mutually laterally offset. 19. The assembly of claim 11, wherein said at least one opening of said first interposer substrate and said at least one opening of said second interposer substrate are fully mutually laterally offset. 20. The assembly of claim 19, wherein said at least one first die and said at least one second die are respectively electrically connected to first surfaces of said first and second interposer substrates with wire bonds. 21. A semiconductor device assembly, comprising: a first interposer substrate having at least one semiconductor die secured thereto on one side thereof and a plurality of terminals in electrical communication with the at least one semiconductor die on an opposite side thereof;
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