IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0303596
(1999-05-03)
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발명자
/ 주소 |
- Ehrhardt, William C.
- Cheng, Longchun
- Stasney, Dawn
- Whitaker, Kim A.
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| 출원인 / 주소 |
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| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
56 인용 특허 :
134 |
초록
▼
A method and composition for controlling corrosion of metals, particularly ferrous-based metals in contact with aqueous systems is disclosed, which includes treating industrial waters with a combination of a tetrazolium salt of the general formula: where R1,R2and R3may be various organic or inorgan
A method and composition for controlling corrosion of metals, particularly ferrous-based metals in contact with aqueous systems is disclosed, which includes treating industrial waters with a combination of a tetrazolium salt of the general formula: where R1,R2and R3may be various organic or inorganic substitutents, where n may be 1 or 2, and at least one other aqueous system treatment material.
대표청구항
▼
A method and composition for controlling corrosion of metals, particularly ferrous-based metals in contact with aqueous systems is disclosed, which includes treating industrial waters with a combination of a tetrazolium salt of the general formula: where R1,R2and R3may be various organic or inorgan
A method and composition for controlling corrosion of metals, particularly ferrous-based metals in contact with aqueous systems is disclosed, which includes treating industrial waters with a combination of a tetrazolium salt of the general formula: where R1,R2and R3may be various organic or inorganic substitutents, where n may be 1 or 2, and at least one other aqueous system treatment material. 16. The method of claim 14, wherein said curing said selected areas comprises curing at least an outer periphery of said mark. 17. The method of claim 16, wherein said curing at least edges further comprises curing an inner periphery of said mark. 18. A method of labeling a semiconductor device component, comprising: placing at least one substrate in a horizontal plane; recognizing a location and an orientation of said at least one substrate; and stereolithographically fabricating at least one mark on said at least one substrate. 19. The method of claim 18, further comprising storing data including at least one physical parameter of said at least one substrate and of said at least one mark in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and the orientation of said at least one substrate. 20. The method of claim 19, further including storing in computer memory at least one parameter of another structure to be associated with said at least one substrate. 21. The method of claim 19, further comprising using the stored data, in conjunction with said machine vision system, to effect said stereolithographically fabricating said at least one mark. 22. The method of claim 18, further comprising recognizing the location of said at least one substrate on which said at least one mark is to be fabricated. 23. The method of claim 18, further including securing said at least one substrate to a carrier prior to said placing said at least one substrate in said horizontal plane. 24. A method of packaging and marking a semiconductor device component, comprising: providing at least one substrate; and disposing at least one layer of unconsolidated material over a surface of said at least one substrate and at least partially consolidating selected areas of said at least one layer to substantially simultaneously form a layer of a package and a layer of a marking in said selected areas of said at least one layer. 25. The method of claim 24, wherein said disposing comprises disposing at least one layer of uncured photopolymer over said surface. 26. The method of claim 25, wherein said at least partially consolidating comprises at least partially curing said selected areas. 27. The method of claim 26, wherein said at least partially curing comprises directing a UV laser on said selected areas. 28. The method of claim 26, wherein said at least partially curing comprises curing at least edges of said layer of said package and of said layer of said marking to be formed from said at least one layer of uncured photopolymer. 29. The method of claim 28, further comprising further curing uncured photopolymer bounded by said edges. 30. The method of claim 28, wherein said curing at least edges comprises curing at least an outer periphery of said layer of said marking. 31. The method of claim 30, wherein said curing at least edges further comprises curing an inner periphery of said layer of said marking. cluding dextrins such as limit dextrin, hydrolyzed amylose, and hydrolyzed amylopectin. The amount of carbohydrate in the binder solution is generally on the order of about 5-50 grams carbohydrate per 100 ml of carrier solution, more preferably 5-30 g/ml, and most preferably 15 g/ml (or comparable amounts on a dry basis). truction Kinetics." Appl. Environ. Microb 36(5), 710-714 (1978). Valeri, C.R., Cassidy, G., Collings, L., and Ragno, G. "Evaluation of the Sterimatics ST-30 system for preparing sterile, pyrogren-free water; lactated Ringeris resuscitative fluid, intravenous sodium chloride solution; and sodium chloride-glucose-phosphate solution used in the deglycerolization of human red cells frozen with 40% W/V glycerol (Feb. 1984-Sep. 1985)." NBRL Technical Report 86-01. Valeri, CR: Final inspection of lactated Ringer's resuscitation fluid; intravenous sodium chloride solution; and sodium chloride-glucose solution used in the deglycerolization of human red cells frozen with 40% W/V glycerol, produced by the Sterimatics EDM Reflups system and stored for 8 months to 2.3 years. NBRL Technical Report 94-07. Yu, D., Aihara, M., and Antal, Jr. M.J. "Hydrogen Production by Steam Reforming Glucose in Supercritical Water," Energy & Fuels, 7, 574 (1993).
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