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Articles sealed with glass 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23B-018/00
  • B23B-017/06
  • B23B-009/00
  • C03C-029/00
출원번호 US-0068684 (2002-02-06)
발명자 / 주소
  • Young, Dianna M.
출원인 / 주소
  • Corning Incorporated
대리인 / 주소
    Kung, Vincent T.
인용정보 피인용 횟수 : 24  인용 특허 : 13

초록

An article of manufacture that has a component capable of being sealed with a copper aluminosilicate glass. The sealing glass has a coefficient of thermal expansion (CTEs) of in the range between 20-82×10-7/° C., over a range of 25-500° C.) and a softening points in the range of 660-1000° C. The gla

대표청구항

An article of manufacture that has a component capable of being sealed with a copper aluminosilicate glass. The sealing glass has a coefficient of thermal expansion (CTEs) of in the range between 20-82×10-7/° C., over a range of 25-500° C.) and a softening points in the range of 660-1000° C. The gla

이 특허에 인용된 특허 (13)

  1. Erbe Erik M. (Stillwater MN) Sapieszko Ronald S. (Woodbury MN), Chemically derived leucite.
  2. Fong Gerald D. (Beaver Dams NY) Hultman Sheryl L. (Corning NY), Copper-exuding, boroaluminosilicate glasses.
  3. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
  4. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
  5. Kiefer Werner (Mainz-Mombach DT), Fireproof glass windowpanes.
  6. Yoshinobu Akimoto JP; Hiroaki Kinoshita JP, Infrared absorbing glass, and it's fabrication method.
  7. Dumesnil Maurice E. (Los Altos Hills CA) Finkelstein Leo (San Francisco CA), Low melting glass composition.
  8. Powell Jimmie Lee (Wappingers Falls NY), Low temperature sealed glass compositions and process for their preparation.
  9. Berkenblit Melvin (Yorktown Heights NY) Chan See Ark (Bronx NY) Landermann Joan B. (Fishkill NY) Reisman Arnold (Yorktown Heights NY) Takamori Takeshi (Croton-on-Hudson NY), Method of controlling the softening point of solder glass.
  10. Smith ; III Edward F. (Madison CT), Sealing glass composite.
  11. Smith Edward F. (Madison CT), Sealing glass composite.
  12. Dumesnil Maurice E. (Palo Alto CA) Schreier Ulrich (San Francisco CA), Sealing glass composition.
  13. Lim Byung C. (Kyungki KRX) Hong Yoo S. (Seoul KRX) Lee Ki Y. (Kyungki KRX) Park Tae H. (Kyungki KRX), Sealing glass compositions using ceramic composite filler.

이 특허를 인용한 특허 (24)

  1. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
  2. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  4. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
  5. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
  6. Ramakrishnan, Ed Sundaram; Prakash, Shiva, Electronic device including an organic active layer and process for forming the electronic device.
  7. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
  8. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  9. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  10. Becken, Keith James; Logunov, Stephan Lvovich; Zhang, Aiyu; Bayne, John, Hermetically sealed glass package and method of manufacture.
  11. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  12. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  13. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
  14. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
  15. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  16. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  17. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
  18. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
  19. Russell, Andrew Lawrence; Zhang, Lu; Gu, Yabei, Method of sealing a glass envelope.
  20. Ishibashi, Ryou; Naitou, Takashi; Kodama, Motomune; Aoyagi, Takuya; Hino, Tetsushi; Aoyama, Motoo; Hashimoto, Tsuneyuki; Takahashi, Katsuhito; Sakano, Junichi; Nakano, Hiroshi, Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly.
  21. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
  22. Cripe, David W.; McCoy, Bryan S.; Lower, Nathan P.; Wilcoxon, Ross K., System and method for proportional cooling with liquid metal.
  23. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
  24. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
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