초록 ▼

The lighting system comprises a body (1) to emit visible light and an envelope (5) which is transparent to light. The invention is characterized in that the lighting system comprises at least one opto-electronic element (2, 2') to emit light in a first wavelength range, in that the body (1) is provi

The lighting system comprises a body (1) to emit visible light and an envelope (5) which is transparent to light. The invention is characterized in that the lighting system comprises at least one opto-electronic element (2, 2') to emit light in a first wavelength range, in that the body (1) is provided with conversion means (3) for absorbing light emitted by the opto-electronic element (2, 2') and re-emitting light in a second wavelength range, and in that the envelope (5) is provided with a coating (6) reflecting light of the first wavelength range. In a preferred embodiment, the opto-electronic elements (2, 2') are light-emitting diodes, which preferably emit blue light. Preferably, the conversion means (3) consist of a luminescent material and can be excited, preferably, by light originating from the wavelength range of 400 to 500 nm. Preferably, the coating (6) comprises a multilayer optical filter and is, preferably, provided on an inside surface of the envelope (5). In operation, the luminous flux of the opto-electronic element is preferably equal to or higher than 5 lm. The body (1) may assume various shapes, such as a spiral-shaped coil, so that the lighting system resembles a carbon filament lamp. The lighting system according to the invention has a comparatively high luminous efficacy and a relatively long service life.

대표청구항 ▼

The lighting system comprises a body (1) to emit visible light and an envelope (5) which is transparent to light. The invention is characterized in that the lighting system comprises at least one opto-electronic element (2, 2') to emit light in a first wavelength range, in that the body (1) is provi

The lighting system comprises a body (1) to emit visible light and an envelope (5) which is transparent to light. The invention is characterized in that the lighting system comprises at least one opto-electronic element (2, 2') to emit light in a first wavelength range, in that the body (1) is provided with conversion means (3) for absorbing light emitted by the opto-electronic element (2, 2') and re-emitting light in a second wavelength range, and in that the envelope (5) is provided with a coating (6) reflecting light of the first wavelength range. In a preferred embodiment, the opto-electronic elements (2, 2') are light-emitting diodes, which preferably emit blue light. Preferably, the conversion means (3) consist of a luminescent material and can be excited, preferably, by light originating from the wavelength range of 400 to 500 nm. Preferably, the coating (6) comprises a multilayer optical filter and is, preferably, provided on an inside surface of the envelope (5). In operation, the luminous flux of the opto-electronic element is preferably equal to or higher than 5 lm. The body (1) may assume various shapes, such as a spiral-shaped coil, so that the lighting system resembles a carbon filament lamp. The lighting system according to the invention has a comparatively high luminous efficacy and a relatively long service life. ving a lower elasticity than the stiffener is filled in a space defined between the surface of the solid device and a surface of the semiconductor chip opposed to the solid device. 4. A semiconductor device as set forth in claim 1, wherein the solid device is a wiring board. 5. A semiconductor device as set forth in claim 1, wherein a heatsink plate for dissipating heat from the semiconductor chip is provided on the surface of the semiconductor chip opposite from the solid device. 6. A semiconductor device comprising: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip with a surface thereof opposite from the solid device being generally flush with a surface of the semiconductor chip opposite from the solid device, wherein the surface of the semiconductor chip opposite from the solid device and the surface of the stiffener opposite from the solid device are mirror-finished surfaces.