초록 ▼

A resealable label flap including a tamper indicating tab that remains in contact with the package body to indicate that the label flap has been removed from the package body. The label flap includes a main body portion having a first adhesive applied to its bottom face surface. The first adhesive i

A resealable label flap including a tamper indicating tab that remains in contact with the package body to indicate that the label flap has been removed from the package body. The label flap includes a main body portion having a first adhesive applied to its bottom face surface. The first adhesive is a removable adhesive that allows the label flap to be repeatedly removed and reapplied to the package body. The label flap further includes a starting tab that does not adhere to the top surface of the package body. A tamper indicating tab is formed as part of the starting tab and includes the first adhesive applied to its bottom face surface. The tamper indicating tab is defined by a series of perforations such that when the label flap is initially removed from the product package, the tamper indicating tab separates from the starting tab along the perforations to indicate that the product package has been opened. The first adhesive applied to the bottom surface of the tamper indicating tab creates an adhesive bond with the package body that is stronger than the material between the perforations defining the tamper indicating tab such that the tamper indicating tab separates from the remaining portions of the label flap.

대표청구항 ▼

A resealable label flap including a tamper indicating tab that remains in contact with the package body to indicate that the label flap has been removed from the package body. The label flap includes a main body portion having a first adhesive applied to its bottom face surface. The first adhesive i

A resealable label flap including a tamper indicating tab that remains in contact with the package body to indicate that the label flap has been removed from the package body. The label flap includes a main body portion having a first adhesive applied to its bottom face surface. The first adhesive is a removable adhesive that allows the label flap to be repeatedly removed and reapplied to the package body. The label flap further includes a starting tab that does not adhere to the top surface of the package body. A tamper indicating tab is formed as part of the starting tab and includes the first adhesive applied to its bottom face surface. The tamper indicating tab is defined by a series of perforations such that when the label flap is initially removed from the product package, the tamper indicating tab separates from the starting tab along the perforations to indicate that the product package has been opened. The first adhesive applied to the bottom surface of the tamper indicating tab creates an adhesive bond with the package body that is stronger than the material between the perforations defining the tamper indicating tab such that the tamper indicating tab separates from the remaining portions of the label flap. 2. 30. A silicon dioxide deposition method comprising: providing a substrate within a reaction chamber, the reaction chamber having an internal surface; forming a high density plasma that is primarily inductively coupled within the chamber; while the high density plasma is within the chamber, flowing silane and O2into the chamber and depositing silicon dioxide onto the substrate from the silane and O2; a material forming on the internal surface of the chamber during the depositing of the silicon dioxide; and after depositing the silicon dioxide and while the substrate remains within the chamber; changing the plasma to a plasma that is primarily capacitively coupled; the primarily capacitively coupled plasma being utilized to alter the material on the internal surface of the chamber. 31. The method of claim 30 wherein the primarily inductively coupled plasma has a density of at least about 1011free electrons per cubic centimeter. 32. The method of claim 30 wherein the flow of the silane is ceased prior to changing the plasma to a primarily capacitively coupled plasma and remains ceased during the alteration of the material on the internal surface of the chamber. 33. The method of claim 30 wherein: substrate has trenches extending therein; the silicon dioxide is deposited within the trenches; and the silicon dioxide