초록 ▼

A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from th

A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from the surface (14) of the electronic component (12). The fin (26) is bonded to the second surface and includes a plurality of offset sidewall portions (48). In one form, a fan (22) is spaced above the second surface (20) to direct an impingement airflow (24) towards the second surface (20) substantially perpendicular to the second surface (20), and the serpentine, slit fin (26) underlies the fan (22) and is bonded to the second surface (20).

대표청구항 ▼

A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from th

A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from the surface (14) of the electronic component (12). The fin (26) is bonded to the second surface and includes a plurality of offset sidewall portions (48). In one form, a fan (22) is spaced above the second surface (20) to direct an impingement airflow (24) towards the second surface (20) substantially perpendicular to the second surface (20), and the serpentine, slit fin (26) underlies the fan (22) and is bonded to the second surface (20). 80900, Weber et al., 359/487; US-5825542, 19981000, Cobb, Jr. et al., 359/487; US-5825543, 19981000, Ouderkirk et al., 359/494; US-5867316, 19990200, Carlson et al., 359/500; US-5882774, 19990300, Jonza et al., 428/212; US-5962572, 19991000, Chen; US-5991077, 19991100, Carlson et al., 359/500; US-6005713, 19991200, Carlson et al., 359/494; US-6023312, 20000200, Hasegawa et al.; US-6025897, 20000200, Weber et al., 428/212; US-6031665, 20000200, Carlson et al., 359/500; US-6080467, 20000600, Weber et al., 428/212; US-6088067, 20000700, Willett et al., 428/212; US-6101032, 20000800, Wortman et al., 428/212