$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Integrated heat sink system for a closed electronics container 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0176217 (2002-06-20)
발명자 / 주소
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Simons, Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Wojnicki, Esq., Andrew J.Radigan, Esq., Kevin P.Heslin Rothenberg Farley & Mesiti P.C.
인용정보 피인용 횟수 : 28  인용 특허 : 21

초록

An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components withi

대표청구항

An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components withi

이 특허에 인용된 특허 (21)

  1. Vos David L. ; Feduke Ronald J. ; Jennings Robert L. ; Nielsen Jan M., Apparatus facilitating use of cots electronics in harsh environments.
  2. Lndqvist Gsta B. (Johanneshov SEX), Apparatus for cooling telecommunications equipment in a rack.
  3. Chien Chuan-Fu,TWX, CPU cooling system.
  4. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration system.
  5. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  6. Chrysler Gregory M.. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  7. Parmerlee James K. (Indianapolis IN) Tague B. Dale (Indianapolis IN), Cooling arrangement for plug-in module assembly.
  8. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  9. Hiroshi Tanaka JP; Tadayoshi Terao JP; Eitaro Tanaka JP; Takahide Ohara JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
  10. Miller David Jonathan,GBX ; Sams Ian James,GBX ; Holland Michael James,GBX ; Fields Simon David,GBX, Cooling system for use in cooling electronic equipment.
  11. Munekawa Masaaki (Sakai JPX), Device for releasing heat.
  12. Tajima Makoto (Tokyo JPX), Electronic component cooling unit.
  13. Biancardi Robert P., Energy saving air cooling system.
  14. Currie Thomas P. (St. Paul MN), Heat sink assembly for cooling electronic components.
  15. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  16. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  17. Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger and clamping plate.
  18. Lavochkin Ronald B., Liquid cooled heat sink for cooling electronic components.
  19. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  20. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  21. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.

이 특허를 인용한 특허 (28)

  1. Martin, Yves C.; Van Kessel, Theodore G., Air/fluid cooling system.
  2. Tsai,Ming Kun, CPU heat dissipating device structure.
  3. Pons, Philippe; Salles, Pierre, Cold plate, forming in particular a structural part of an item of equipment having heat-generating components.
  4. Strobel, Kurt Richard; Morozov, Igor G., Cooling apparatus for electronics.
  5. Newcome,Bruce, Diamond anode.
  6. Albrecht, Herbert, Electronic device for a magnetic resonance apparatus.
  7. Malone,Christopher G.; Simon,Glenn C., External liquid loop heat exchanger for an electronic system.
  8. Canney, Brian A.; Karrat, Wally; Lehman, Bret W.; Molloy, Christopher L., Free cooling solution for a containerized data center.
  9. Liu, HeBen, Heat dissipating apparatus and method for producing same.
  10. Lai, Cheng-Tien; Lee, Tsung-Lung; Wang, Shenghua, Heat dissipation device with working liquid received in circulatory route.
  11. Bratkovski, Alex; Wang, Shih-Yuan; Patel, Chandrakant, Integrated heat sink for a microchip.
  12. Lee,Hsieh Kun; Chen,Chun Chi; Zhang,Jianjun, Integrated liquid cooling system for electrical components.
  13. Huang,Jung Fong; Huang,Chih Chien, Liquid-cooled heat radiator kit.
  14. Dahm, Jonathan S., Method and apparatus for using light emitting diodes.
  15. Erturk,Hakan; Chrysler,Gregory M.; Sauciuc,Ioan, Method and system to cool memory.
  16. Dahm, Jonathan S.; Jongewaard, Mark Paul, Multiple light-emitting element heat pipe assembly.
  17. Mills, Robin Walter; Jandt, Klaus Dieter, Optical irradiation device.
  18. Laing, Karsten, Power supply unit for an electrical appliance and method for making electrical power available at components of an electrical appliance.
  19. Lee, Sang-cheol, Radiator for a heat generating components in electronic equipment.
  20. Lee, Sang-cheol, Radiator for a heat generating components in electronic equipment.
  21. Lee, Sang-cheol, Radiator for a heat generating components in electronic equipment.
  22. Lee, Sang-cheol, Radiator for a heat generating components in electronic equipment.
  23. Liu, I-Ming, Radiator plate rapid cooling apparatus.
  24. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  25. Barson,George F.; Weber,Richard M.; Haws,James L., Thermal management system and method for electronic equipment mounted on coldplates.
  26. Barson,George F.; Weber,Richard M.; Haws,James L., Thermal management system and method for electronic equipment mounted on coldplates.
  27. Peterson, Eric C.; Cutler, Benjamin F.; Foley, Thomas; Johnson, Peter; Fleming, Alexander Jacques; Tuckerman, David Bazeley, Underwater container cooling via external heat exchanger.
  28. Peterson, Eric C.; Cutler, Benjamin F.; Whitaker, Jr., Norman Ashton; Johnson, Peter; Fleming, Alexander Jacques; Tuckerman, David Bazeley, Underwater container cooling via integrated heat exchanger.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로