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A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injectio

A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset.

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A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injectio

A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset. e outer U-shaped yoke attaching directly to the wrist joint of the articulated arm and said end effector rotary-drive directly rotating the outer U-shaped yoke, the outer and inner U-shaped yokes being joined to each other by rotational joints that are located between ends of each of the sides that are distal from the bases thereof to permit relative rotation of the U-shaped yokes with respect to each other, said gripper mounting plate being incorporated into the base of the inner U-shaped yoke between the sides thereof; and a yoke rotary-drive coupled between and energizing rotation of the outer and inner U-shaped yokes with respect to each other, whereby the end effector gripper may rotate a wafer carrier that is gripped by the gripper blades about an axis that: passes through the rotational joints between ends of the sides of the U-shaped yokes; and is oriented parallel to semiconductor wafers held in the wafer carrier. 26. A pod loader interface that is adapted for unloading and reloading a SMIF pod that includes: a wafer carrier adapted to receive a plurality of semiconductor wafers; a pod base that is adapted to receive the wafer carrier; and a pod cover which mates with and seals to the pod base thereby enclosing within the SMIF pod the wafer carrier and semiconductor wafers received therein; the pod loader interface being adapted for gripping the wafer carrier and for transporting semiconductor wafers held in the wafer carrier; the pod loader interface comprising: a main bulkhead having an opening formed therethrough; a loading platform supported on said bulkhead, said loading platform being adapted for receiving the pod base of the SMIF pod, and for unlocking the pod cover from the pod base; an elevator supported on said bulkhead, said elevator being adapted for lifting the pod cover upward above the pod base to thereby expose the wafer carrier of the SMIF pod; an articulated arm supported on said bulkhead that includes: a pivoting shoulder joint that is adapted to be secured to said bulkhead of the pod loader interface; an upper arm that extends away from said shoulder joint; a pivoting elbow joint that is located at an end of the upper arm distal from said shoulder joint; a forearm that is pivotally coupled to said upper arm by said elbow joint and that extends away from said shoulder joint; and a pivoting wrist joint that is located at an end of the forearm distal from said elbow joint; said articulated arm being adapted for transporting the wafer carrier and semiconductor wafers held in the wafer carrier through the opening in said bulkhead; and an end effector that includes: an end effector gripper that is attached to said articulated arm and which includes: a gripper mounting plate that is attached to the wrist joint of the articulated arm; aligning means, secured to said gripper mounting plate, which adapt the end effector gripper for properly aligning with the wafer carrier; a pair of gripper blades that are separated from each other along and are coupled to said gripper mounting plate, and which during gripping of the wafer carrier by the end effector gripper initially close toward each other and then draw nearer to said gripper mounting plate; and drive means, also secured to said gr