IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0709769
(2000-11-10)
|
|
발명자
/ 주소 |
- Li, Shijian
- Birang, Manoocher
- Emami, Ramin
- Nagengast, Andrew
- Brown, Douglas Orcutt
- Wang, Shi-Ping
- Scales, Martin
- White, John
|
| 출원인 / 주소 |
|
| 대리인 / 주소 |
Moser, Patterson & Sheridan
|
| 인용정보 |
피인용 횟수 :
7 인용 특허 :
114 |
초록
▼
Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are f
Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.
대표청구항
▼
Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are f
Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface. to about 14. 20. A method of removal of metal from water, comprising: adding an effective amount of a soluble chelate ligand having a formula: to the water to be treated; binding said metal to be removed from said water to said chelate ligand; and precipitating said chelate ligand bound to said metal from said water. 21. The method of claim 20 wherein said metal to be removed from said water may be any metal in or capable of being placed in a positive oxidation state. 22. The method of claim 20 wherein said metal to be removed from said water is selected from a group consisting of lead, copper, mercury, cadmium, iron, nickel, zinc, aluminum, antimony, arsenic, barium, beryllium, chromium, cobalt, magnesium, manganese, selenium, silver, strontium, thallium, tin, gold, vanadium and any mixtures thereof. 23. The method of claim 20 wherein said metal remains bound to said chelate ligands at pH values from about 0 to about 14. 24. A method of removal of metal from water, comprising: adding an effective amount of a soluble chelate ligand having a formula: to the water to be treated; binding said metal to be removed from said water to said chelate ligand; and precipitating said chelate ligand bound to said metal from said water. 25. The method of claim 24 wherein said metal to be removed from said water may be any metal in or capable of being placed in a positive oxidation state. 26. The method of claim 24 wherein said metal to be removed from said water is selected from a group consisting of lead, copper, mercury
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