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The present invention provides an improved multi-layer composite of two or more polymeric layers at least one of which is formed from a thermosetting composition. The composite includes at least a first polymeric layer formed on a substrate and a second polymeric layer over the first polymeric layer

The present invention provides an improved multi-layer composite of two or more polymeric layers at least one of which is formed from a thermosetting composition. The composite includes at least a first polymeric layer formed on a substrate and a second polymeric layer over the first polymeric layer, wherein in the absence of a boron-containing compound, the first and second polymeric layers have poor interlayer adhesion. The improvement resides in the inclusion of at least one boron-containing compound in one or both of the first and second polymeric layers in an amount sufficient to improve the interlayer adhesion between the first and second polymeric layers. Also provided is an improved curable coating composition used to form a multi-layer composite coating of two or more cured coating layers, at least one of which is formed from the thermosetting composition. Related methods and coated substrates are also provided.

대표청구항 ▼

The present invention provides an improved multi-layer composite of two or more polymeric layers at least one of which is formed from a thermosetting composition. The composite includes at least a first polymeric layer formed on a substrate and a second polymeric layer over the first polymeric layer

The present invention provides an improved multi-layer composite of two or more polymeric layers at least one of which is formed from a thermosetting composition. The composite includes at least a first polymeric layer formed on a substrate and a second polymeric layer over the first polymeric layer, wherein in the absence of a boron-containing compound, the first and second polymeric layers have poor interlayer adhesion. The improvement resides in the inclusion of at least one boron-containing compound in one or both of the first and second polymeric layers in an amount sufficient to improve the interlayer adhesion between the first and second polymeric layers. Also provided is an improved curable coating composition used to form a multi-layer composite coating of two or more cured coating layers, at least one of which is formed from the thermosetting composition. Related methods and coated substrates are also provided. ns thereof. 3. The silicone composition in accordance with claim 2, wherein the polar radical comprises an acryloxy group. 4. The silicone composition in accordance with claim 2, wherein the polar radical comprises an epoxy group. 5. The silicone composition in accordance with claim 4, wherein the polar radical comprises 7-oxabicyclo[4,1,0]hept-3-yl. 6. The silicone composition in accordance with claim 1, wherein R4is a methyl group. 7. The silicone composition in accordance with claim 1, wherein the at least one thermally conductive filler comprises aluminum oxide, aluminum nitride, boron nitride, diamond, magnesium oxide, zinc oxide, zirconium oxide, silver, gold, copper, or combinations thereof. 8. The silicone composition in accordance with claim 7, wherein the at least one thermally conductive filler comprises aluminum oxide. 9. The silicone composition in accordance with claim 7, wherein the at least one thermally conductive filler comprises diamond. 10. The silicone composition in accordance with claim 7, wherein the at least one thermally conductive filler comprises aluminum nitride. 11. The silicone composition in accordance with claim 7, wherein the at least one thermally conductive filler comprises boron nitide. 12. The silicone composition in accordance with claim 1, wherein the at least one filler is present in a range between about 60% by weight and about 95% by weight of the total composition. 13. The silicone composition in accordance with claim 1, wherein the diluant comprises tert-butyl-styrene, methacryloxypropyltrimethoxysilane, methylmethacrylate, hexanedioldiacrylate, or glycidoxypropyltrimethoxysilane. 14. The silicone composition in accordance with claim 13, wherein the diluant comprises tert-butyl-styrene. 15. The silicone composition in accordance with claim 1, wherein the diluant is present in a range between about 1% by weight and about 20% by weight of the total composition. 16. The silicone composition in accordance with claim 1, wherein the composition provides a thermal conductivity greater than about 1.5 W/mK. 17. The silicone composition in accordance with claim 1, wherein the composition provides adhesion to at least one substrate. 18. The silicone composition in accordance with claim 17, wherein the substrate comprises silicon. 19. The silicone composition in accordance with claim 1, which further comprises a curing catalyst. 20. The silicone composition in accordance with claim 19, wherein the curing catalyst comprises peroxide, iodonium salt, or platinum catalyst. 21. The silicone composition in accordance with claim 19, wherein the catalyst is present in a range between about 10 parts per million and about 2% by weight of the total composition. 22. A silicone composition comprising a curable adhesive formulation which comprises (A) a polydiorganosiloxane comprising the general formula: (R4)2R5SiO[(R4)2SiO]m[R4R5SiO]nSi(R4)2R5 wherein R5is an acryloxy group or an epoxy group; R4is methyl, "m"+"n" has a value sufficient to provide a polydiorganosiloxane with an initial viscosity in a range between about 100 centipoise and about 50,000 centipoise at 25° C.; (B) at least one thermally conductive filler comprising aluminum oxide, aluminum nitride, boron nitride, or diamond; (C) at least one diluant comprising tert-butyl-styrene; and (D) at least one curing catalyst comprising peroxide, iodonium salt, or platinum catalyst wherein the total silicone composition has a viscosity in a range between about 10,000 centipoise and about 250,000 centipoise at 25° C. 23. A method for substantially increasing the thermal conductivity of a silicone composition comprising: providing at least one polydiorganosiloxane wherein the polydiorganosiloxane has the general formula: (R4)2R5SiO[(R4)2SiO]m[R4R5SiO]nSi(R4)2R5 wherein R5a polar radical with a dipole moment greater than about 2 debye; R4comprises C1-8alkyl radicals, phenyl radicals, vinyl radicals or mixtures thereof; and "m"+"n" has a value sufficient to provide a polydiorganosiloxane with an initial viscosity in a range between about 100 centipoise and about 50,000 centipoise at 25° C.; and combining into the polydiorganosiloxane at least one thermally conductive filler in a range between about 60% by weight and about 95% by weight of the total composition wherein the total silicone composition has a viscosity in a range between about 10,000 centipoise and about 250,000 centipoise at 25° C. 24. The method in accordance with claim 23, wherein the polar radical comprises an epoxy group, a cyano group, an acryloxy group, a methacryloxy group, a urethane group, or combinations thereof. 25. The method in accordance with claim 24, wherein the polar radical comprises an acryloxy group. 26. The method in accordance with claim 24, wherein the polar radical comprises an epoxy group. 27. The method in accordance with claim 26, wherein the polar radical comprises 7-oxabicyclo[4,1,0]hept-3-yl. 28. The method in accordance with claim 23, wherein R4is methyl. 29. The method in accordance with claim 23, wherein the at least one thermally conductive filler comprises aluminum oxide, aluminum nitride, boron nitride, diamond, magnesium oxide, zinc oxide, zirconium oxide, silver, gold, copper, or combinations thereof. 30. The method in accordance with claim 29, wherein the at least one thermally conductive filler comprises aluminum oxide. 31. The method in accordance with claim 29, wherein the at least one thermally conductive filler comprises diamond. 32. The method in accordance with claim 29, wherein the at least one thermally conductive filler comprises aluminum nitride. 33. The method in accordance with claim 29, wherein the at least one thermally conductive filler comprises boron nitride. 34. The method in accordance with claim 23, further comprising combining into the polydiorganosiloxane composition a diluant. 35. The method in accordance with claim 34, wherein the diluant comprises tert-butyl-styrene, methacryloxypropyltrimethoxysilane, methylmethacrylate, hexanedioldiacrylate, or glycidoxypropyltrimethoxysilane. 36. The method in accordance with claim 35, wherein the diluant comprises tert-butyl styrene. 37. The method in accordance with claim 34, wherein the diluant is present in a range between about 1% by weight and about 20% by weight of the total composition. 38. The method in accordance with claim 23, wherein the composition provides a thermal conductivity greater than about 1.5 W/mK. 39. The method in accordance with claim 23, further comprising combining into the polydiorganosiloxane composition a curing catalyst. 40. The method in accordance with claim 39, wherein the curing catalyst comprises peroxide, iodonium salt, or platinum catalyst. 41. The method in accordance with claim 39, wherein the catalyst is present in a range between about 10 parts per million and about 2% by weight of the total composition. 42. A method for substantially increasing the thermal conductivity of a silicone composition comprising: providing at least one polydiorganosiloxane wherein the polydiorganosiloxane has the general formula: (R4)2R5SiO[(R4)2SiO]m[R4R5SiO]nSi(R4)2R5 wherein R5comprises an acryloxy group or epoxy group; R4is methyl, "m"+"n" has a value sufficient to provide a polydiorganosiloxane with an initial viscosity in a range between about 100 centipoise and about 50,000 centipoise at 25° C.; combining into the polydiorganosiloxane at least one thermally conductive fill er in a range between about 60% by weight and about 95% by weight of the total composition wherein the filler comprises aluminum oxide, aluminum nitride, boron nitride, or diamond; combining into the polydiorganosiloxane at least one diluant wherein the diluant comprises tert-butyl styrene; and combining into the polydiorganosiloxane at least one cure catalyst wherein the cure catalyst comprises peroxide, iodonium salt, or platinum catalyst wherein the total composition provides a thermal conductivity greater than about 1.5 W/mK and a viscosity in a range between about 10,000 centipoise and about 250,000 centipoise at 25° C. 43. A thermal interface material comprising: (A) at least one polydiorganosiloxane comprising (R4)2R5SiO[(R4)2SiO]m[R4R5SiO]nSi(R4)2R5 wherein R5a polar radical with a dipole moment greater than about 2 debye; R4comprises C1-8alkyl radicals, phenyl radicals, vinyl radicals or mixtures thereof; and "m"+"n" has a value sufficient to provide a polydiorganosiloxane with an initial viscosity in a range between about 100 centipoise and about 50,000 centipoise at 25° C.; (B) at least one thermally conductive filler; and (C) at least one diluant wherein the thermal interface material provides adhesion to at least one substrate. 44. The thermal interface material in accordance with claim 43, wherein the polar radical comprises a cyano group, an epoxy group, an acryloxy group, a methacryloxy group, a urethane group, or combinations thereof. 45. The thermal interface material in accordance with claim 44, wherein the polar radical comprises an acryloxy group. 46. The thermal interface material in accordance with claim 44, wherein the polar radical comprises an epoxy group. 47. The thermal interface material in accordance with claim 46, wherein the polar radical comprises 7-oxabicyclo[4,1,0]hept-3-yl. 48. The thermal interface material in accordance with claim 43, wherein R4is a methyl group. 49. The thermal interface material in accordance with claim 43, wherein the at least one thermally conductive filler comprises aluminum oxide, aluminum nitride, boron nitride, diamond, magnesium oxide, zinc oxide, zirconium oxide, silver, gold, copper, or combinations thereof. 50. The thermal interface material in accordance with claim 49, wherein the at least one thermally conductive filler comprises aluminum oxide. 51. The thermal interface material in accordance with claim 49, wherein the at least one thermally conductive filler comprises diamond. 52. The thermal interface material in accordance with claim 49, wherein the at least one thermally conductive filler comprises aluminum nitride. 53. The thermal interface material in accordance with claim 49, wherein the at least one thermally conductive filler comprises boron nitride. 54. The thermal interface material in accordance with claim 43, wherein the at least one filler is present in a range between about 70% by weight and about 95% by weight of the total composition. 55. The thermal interface material in accordance with claim 43, wherein the diluant comprises tert-butyl-styrene, methacryloxypropyltrimethoxysilane, methylmethacrylate, hexanedioldiacrylate, or glycidoxypropyltrimethoxysilane. 56. The thermal interface material in accordance with claim 43, wherein the diluant comprises tert-butyl-styrene. 57. The thermal interface material in accordance with claim 43, wherein the diluant is present in a range between about 1% by weight and about 20% by weight of the total composition. 58. The thermal interface material in accordance with claim 43, wherein the composition provides a thermal conductivity greater than about 1.5 W/mK. 59. The thermal interface material in accordance with claim 43, wherein the substrate comprises silicon. 60. The thermal interface material in accordance with claim 43, wherein the composition further comprises a cure catalyst. 61. The thermal interface material in accordance with claim 60, wherein the cure catalyst comprises a peroxide, an iodonium salt, or a platinum catalyst. 62. The thermal interface material in accordance with claim 60, wherein the catalyst is present in a range between about 10 parts per million and about 2% by weight of the total composition. 63. A thermal interface material comprising: (A) at least one polydiorganosiloxane comprising (R4)2R5SiO[(R4)2SiO]m[R4R5SiO]nSi(R4)2R5 wherein R5a polar radical with a dipole moment greater than about 2 debye; R4comprises C1-8alkyl radicals, phenyl radicals, vinyl radicals or mixtures thereof; and "m"+"n" has a value sufficient to provide a polydiorganosiloxane composition with an initial viscosity in a range between about 100 centipoise and about 50,000 centipoise at 25° C.; (B) at least one thermally conductive filler comprising aluminum oxide, diamond, boron nitride, or aluminum nitride; (C) at least one diluant comprises tert-butyl styrene; and (D) at least one cure catalyst wherein the cure catalyst comprises peroxide, iodonium salt, or platinum catalyst wherein the thermal interface material provides a thermal conductivity greater than about 1.5 W/mK. taining a silicone composition wherein the silicone composition includes the aforementioned polydiorganosiloxane. smission System," filed Jul. 9, 1999, U.S. application Ser. No. 09/349,975. U.S. Patent Application entitled "Time Division Multiple Acc