IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0921084
(2001-08-02)
|
발명자
/ 주소 |
- Subramanian, Ramesh
- Keyser, Mercedes
|
출원인 / 주소 |
- Siemens Westinghouse Power Corporation
|
인용정보 |
피인용 횟수 :
57 인용 특허 :
9 |
초록
▼
A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids
A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids (18) is then cut into the masking material by a laser engraving process which exposes portions of the substrate surface. A plurality of supports (20) are then formed by electroplating a support material onto the exposed portions of the substrate surface. A layer of material is then electroplated onto the supports and over the masking material to form a skin that interconnects the supports. Finally, the remaining portions of the masking material are removed to form a plurality of cooling channels (26) defined by the supports, skin and substrate surface. An additional layer of material (42) may be deposited onto a top surface (50) of the cooling feature to provide additional thermal and/or mechanical protection.
대표청구항
▼
A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids
A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids (18) is then cut into the masking material by a laser engraving process which exposes portions of the substrate surface. A plurality of supports (20) are then formed by electroplating a support material onto the exposed portions of the substrate surface. A layer of material is then electroplated onto the supports and over the masking material to form a skin that interconnects the supports. Finally, the remaining portions of the masking material are removed to form a plurality of cooling channels (26) defined by the supports, skin and substrate surface. An additional layer of material (42) may be deposited onto a top surface (50) of the cooling feature to provide additional thermal and/or mechanical protection. wherein the wall thickness is between about 1.5 mm and about 3.0 mm. 8. The covering element as claimed in claim 1, wherein the cooling surface includes a supporting structure for increasing the rigidity and thermal conductivity. 9. The covering element as claimed in claim 8, wherein the supporting structure is formed by at least one longitudinal rib on the cooling surface along the longitudinal axis. 10. The covering element as claimed in claim 9, wherein the supporting structure includes a further longitudinal rib formed on the cooling surface along the longitudinal axis. 11. The covering element as claimed in claim 6, wherein at least two longitudinal ribs spaced from one another in the direction of the transverse axis are connected to a holding element. 12. The covering element as claimed in claim 9, wherein at least two longitudinal ribs spaced from one another in the direction of the transverse axis are connected to a holding element. 13. An arrangement including a covering element as claimed in claim 1 and including a carrying structure comprising: a) a longitudinal axis and a transverse axis, b) a first receiving region arranged along the longitudinal axis and including a first receiving surface, c) a second receiving surface located opposite along the longitudinal axis and including a second receiving surface, and d) a carrying element including a carrying surface, wherein the first receiving region is contiguous to the first bearing region, the second receiving region is contiguous to the second bearing region, and the holding element and carrying element overlap one another, the holding bearing surface and the carrying surface being located opposite one another. 14. The arrangement as claimed in claim 13, wherein the covering element and the carrying structure are arranged in a thermal machine. 15. The covering element as claimed in claim 1, wherein the holding element includes a holding bearing surface. 16. The covering element as claimed in claim 1, wherein the holding element includes a recess, for engaging into a carrying structure. 17. A covering element including a longitudinal axis and a transverse axis, comprising: a wall with a hot side capable of being exposed to a hot medium and with a cool side located opposite the hot side and including a cooling surface capable of being acted upon by a coolant; a first bearing region contiguous to the wall along the longitudinal axis and including a first bearing surface and a second bearing region located opposite the first bearing region along a longitudinal axis and including a second bearing surface; and a first edge region contiguous to the wall along the transverse axis and a second edge region located opposite the first edge region along the transverse axis wherein, a holding element, arranged between the first and the second bearing region, is provided on the cool side, wherein at least two holding elements are arranged, spaced from one another, along the transverse axis, and wherein the number and arrangement of the holding elements are defined by a predetermined thermal flexion of the wall. 18. The covering element as claimed in claim 17, wherein the predetermined thermal flexion is about 0.1 mm to about 1.0 mm. 19. The covering element of claim 18, wherein the predetermined thermal flexion is about 0.3 mm to about 0.7 mm. 20. The covering element as claimed in claim 18, wherein at least two holding elements are arranged, spaced from one another, along the transverse axis. 21. The covering element as claimed in claim 18, wherein at least two holding elements are arranged, spaced from one another, along the longitudinal axis. 22. The covering element as claimed in claim 17, wherein at least two holding elements are arranged, spaced from one another, along the longitudinal axis. 23. The covering element as claimed in claim 17, wherein at least two holding elements are arranged, spaced from one another, along the longitudinal axis. 24. An arran
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