초록 ▼

This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper co

This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

대표청구항 ▼

1. An etching composition comprising (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex wherein the copper complexing agent is a thiourea or an imidazole-thione, wherein the copper complex is present in an amount which precipitates when applied to the copper

1. An etching composition comprising (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex wherein the copper complexing agent is a thiourea or an imidazole-thione, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. 2. The composition of claim 1 wherein the acid is a mineral acid or an alkane sulfonic acid. 3. The composition of claim 1 wherein the acid is selected from sulfuric acid, fluoroboric acid and methane sulfonic acid. 4. The composition of claim 1 wherein the oxidizing agent is selected from dissolved air, oxygen, peroxides, persulfates, peroxysulfates, permanganate, chromic acid, soluble metal ions from Groups IIIB, IVB, VB, and mixtures of those metals. 5. The composition of claim 1 wherein the copper complex is a copper thiourea or a copper imidazole-2-thione. 6. The composition of claim 5 wherein the imidazole-2-thione is represented by the formula compound wherein A and B are the same or different --RY groups wherein R is a linear, branched or cyclic hydrocarbylene group containing up to 12 carbon atoms, and Y is a hydrogen, halogen, cyano, vinyl, phenyl, or ether moiety. 7. The composition of claim 1, further comprising one or more surfactants. 8. The composition of claim 7, wherein the surfactant comprises at least one amphoteric, nonionic, cationic or anionic surfactant, or mixtures thereof. 9. The composition of claim 1, further comprising one or more chelating agents. 10. The composition of claim 9, wherein the chelating agent comprises at least one polyamine, aminocarboxylic acid or hydroxy carboxylic acid. 11. The composition of claim 6, wherein A is methyl or ethyl and B is an alkyl or cycloalkyl group containing from 3 to 6 carbon atoms. 12. The composition of claim 6, wherein A and B are same alkyl or cycloalkyl groups containing from 1 to 6 carbon atoms. 13. The composition of claim 1, wherein the copper complex is copper thiourea sulfate complex. 14. The composition of claim 1, wherein the copper complex is copper 1-methyl-3-propyl-imidazole-2-thione sulfuric acid complex. 15. The composition of claim 1, wherein the copper complex is copper thioruea methane sulfonate complex. 16. An etching composition comprising (a) an acid, (b) an oxidizing agent, (c) 1-methyl-3-propyl-imidazole-2-thione, and (d) copper 1-methyl-3-propyl-imidazole-2-thione sulfuric acid complex, wherein the copper 1-methyl-3-propyl-imidazole-2-thione sulfuric acid complex is present in an amount which precipitates when applied to a copper or copper alloy substrate. 17. An etching composition comprising (a) an acid, (b) an oxidizing agent, (c) thiourea, and (d) at least one of copper thiourea sulfate complex or copper thiourea methane sulfonate complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate.