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A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorize

A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates.

대표청구항 ▼

1. A method of electroplating a substrate, comprising: gripping the substrate at the edges thereof; electrifying the substrate; moving the substrate over a plurality of absorptive applicator assemblies; and pumping a plating solution through a plurality of holes in an substantially planar elec

1. A method of electroplating a substrate, comprising: gripping the substrate at the edges thereof; electrifying the substrate; moving the substrate over a plurality of absorptive applicator assemblies; and pumping a plating solution through a plurality of holes in an substantially planar electroplating anode onto the plurality of absorptive applicator assemblies, and onto the substrate. 2. The method according to claim 1, further comprising: pumping the plating solution into a manifold and around a plurality of baffles. 3. The method of claim 2, wherein the anode is parallel and in contact with the plurality of absorptive applicator assemblies. 4. The method of claim 1, wherein the plurality of absorptive applicator assemblies form two parallel rows. 5. The method of claim 1, wherein each of the plurality of absorptive applicator assemblies comprises a roller assembly. 6. The method of claim 1, wherein each of the plurality of absorptive applicator assemblies comprises a strip portion. 7. The method of claim 1, wherein each of the plurality of absorptive applicator assemblies comprises a block portion. 8. A method of electroplating a substrate, comprising: gripping the substrate at the edges thereof; electrifying the substrate; moving the substrate between first and second rows formed by a plurality of absorptive applicator assemblies, each absorptive applicator assembly comprising a porous tubular member defining an inner fluid passageway; providing a unitary electroplating anode having a profile that conforms to a profile collectively defined by the plurality of absorptive applicator assemblies; and pumping a plating solution into the fluid passageways of the tubular members of at least one of the first and second rows, and from the porous tubular members onto the substrate. 9. The method of claim 8, wherein the plurality of the absorptive applicator assemblies comprises plastic rollers. 10. The method of claim 8, wherein each tubular member has bristles extending radially therefrom.