초록 ▼

The present invention includes automatic lift-type power generation equipment unit A which is one of the equipment within the automatic lift-type mobile facility that is adapted to be loaded onto the rear of a carrying vehicle (a), comprising a power generation section 1A which is a component of sai

The present invention includes automatic lift-type power generation equipment unit A which is one of the equipment within the automatic lift-type mobile facility that is adapted to be loaded onto the rear of a carrying vehicle (a), comprising a power generation section 1A which is a component of said mobile facility, supplies electric power by generating said power, and includes cubicle 3A, prime mover equipment 4A, and electric power equipment 5A, and an automatic lifting-and-lowering section 2A which includes chassis 6A, outriggers 7A, jacks 8A, universal casters, and a remote controller.

대표청구항 ▼

The present invention includes automatic lift-type power generation equipment unit A which is one of the equipment within the automatic lift-type mobile facility that is adapted to be loaded onto the rear of a carrying vehicle (a), comprising a power generation section 1A which is a component of sai

The present invention includes automatic lift-type power generation equipment unit A which is one of the equipment within the automatic lift-type mobile facility that is adapted to be loaded onto the rear of a carrying vehicle (a), comprising a power generation section 1A which is a component of said mobile facility, supplies electric power by generating said power, and includes cubicle 3A, prime mover equipment 4A, and electric power equipment 5A, and an automatic lifting-and-lowering section 2A which includes chassis 6A, outriggers 7A, jacks 8A, universal casters, and a remote controller. and the routing line is a planar metal lead that is contiguous with the bumped terminal and overlaps the pad; an insulative adhesive that contacts and is sandwiched between the conductive trace and the chip and fills the cavity; and a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad. 12. The assembly of claim 11, wherein the conductive trace is an electroplated metal. 13. The assembly of claim 11, wherein the conductive trace consists of the bumped terminal and the routing line. 14. The assembly of claim 11, wherein the bumped terminal and the routing line are integral with one another. 15. The assembly of claim 11, wherein the adhesive is silicone, polyimide or epoxy. 16. The assembly of claim 11, wherein the adhesive is silicone. 17. The assembly of claim 11, wherein the connection joint contacts a surface of the conductive trace that overlaps and faces away-from the pad, the connection joint contacts opposing peripheral sidewalls of the conductive trace that overlap and are orthogonal to the pad, the connection joint is the only electrical conductor external to the chip that contacts the pad, the connection joint and the adhesive are the only materials external to the chip that contact the pad, the connection joint and the adhesive are the only materials that contact both the conductive trace and the pad, and the adhesive contacts and is sandwiched between the conductive trace and the pad. 18. The assembly of claim 11, including a transfer molded encapsulant that contacts the chip on a side opposite the pad. 19. The assembly of claim 11, including an insulative base that contacts the conductive trace, the adhesive and the connection joint such that the bumped terminal is exposed. 20. The assembly of claim 11, wherein the assembly is devoid of wire bonds and solder joints. 21. A semiconductor chip assembly, comprising: a semiconductor chip that includes a conductive pad; a conductive trace that includes a bumped terminal and a routing line, wherein the bumped terminal includes a cavity that faces towards the chip, the bumped terminal is disposed outside a periphery of the chip, and the routing line overlaps the pad; an insulative adhesive that contacts and is sandwiched between the conductive trace and the chip; an encapsulant that covers the chip on a side opposite the pad and extends into the cavity; and a connection joint that extends through an opening in the adhesive and contacts and electrically connects the conductive trace and the pad. 22. The assembly of claim 21, wherein the routing line is a planar metal lead. 23. The assembly of claim 21, wherein the adhesive contacts and is sandwiched between the conductive trace and the pad. 24. The assembly of claimed 21, wherein the encapsulant contacts the chip on the side opposite the pad. 25. The assembly of claim 21, wherein the encapsulant fills the cavity. 26. The assembly of claim 21, wherein the encapsulant is a transfer molded material. 27. The assembly of claim 21, wherein the encapsulant is compressible and permits the bumped terminal to exhibit elastic deformation in response to external pressure applied to the bumped terminal. 28. The assembly of claim 21, wherein the connection joint contacts a surface of the conductive trace that overlaps and faces away from the pad, the connection joint contacts opposing peripheral sidewalls of the conductive trace that overlap and are orthogonal to the pad, the connection joint is the only electrical conductor external to the chip that contacts the pad, the connection joint and the adhesive are the only materials external to the chip that contact the pad, the connection joint and the adhesive are the only materials that contact both the conductive trace and the pad, and the adhesive contacts and is sandwiched between the conductive trace and the pad. 29. The assembly of claim 21, including an insulative base that contacts the