IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0003548
(2001-10-24)
|
발명자
/ 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
17 인용 특허 :
10 |
초록
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An apparatus for generating a constant source of electrical power in remote locations in the field for use while camping or hunting, in vehicles, on water craft, or for providing power during emergencies due to power failures, accidents, storms, or natural catastrophies. A safely and efficiently ope
An apparatus for generating a constant source of electrical power in remote locations in the field for use while camping or hunting, in vehicles, on water craft, or for providing power during emergencies due to power failures, accidents, storms, or natural catastrophies. A safely and efficiently operating power generator that makes a minimal intrusion upon the environment is provided comprising a low horsepower gasoline-powered engine which drives a permanent magnet 12-volt AC/DC generator having a built-in electronic governor circuit for sustaining a constant DC output. Constructed with a flexible coupling between the gasoline-powered engine and the generator, and a suitably sized resonator and inherent governor circuit, the invention affords a constant output and quiet operation for use in vehicles, on water craft, and in the field to provide electricity for illumination or for operating common 12-volt appliances.
대표청구항
▼
An apparatus for generating a constant source of electrical power in remote locations in the field for use while camping or hunting, in vehicles, on water craft, or for providing power during emergencies due to power failures, accidents, storms, or natural catastrophies. A safely and efficiently ope
An apparatus for generating a constant source of electrical power in remote locations in the field for use while camping or hunting, in vehicles, on water craft, or for providing power during emergencies due to power failures, accidents, storms, or natural catastrophies. A safely and efficiently operating power generator that makes a minimal intrusion upon the environment is provided comprising a low horsepower gasoline-powered engine which drives a permanent magnet 12-volt AC/DC generator having a built-in electronic governor circuit for sustaining a constant DC output. Constructed with a flexible coupling between the gasoline-powered engine and the generator, and a suitably sized resonator and inherent governor circuit, the invention affords a constant output and quiet operation for use in vehicles, on water craft, and in the field to provide electricity for illumination or for operating common 12-volt appliances. strate, said set of bottom-side pads disposed on said bottom-side signal layer. 6. The chip scale package of claim 1 further comprising the flip chip die bonded to said top-side of said substrate. 7. The chip scale package of claim 6 further comprising underfill material sealing a bottom edge of the flip chip die. 8. A chip scale package for connecting a flip chip die having signal and ground connections to a primary circuit board, said chip scale package comprising: a substrate comprising a top side with a mounting area for receiving the flip chip die and a bottom side for connecting said substrate to the primary circuit board; a first set of signal and ground pads on said top side of said substrate to electrically connect with the corresponding signal and ground connections on the flip chip die; a second set of signal and ground pads on said bottom side of said substrate to electrically connect the flip chip die with the primary circuit board; a plurality of signal and ground conductive paths extending from said top side to said bottom side of said substrate to electrically connect respective ones of said first set of signal and ground pads with respective ones of said second set of signal and ground pads, a ground plane on said bottom side of said substrate within a central area substantially beneath said mounting area of the flip chip die; a plurality of grounded thermal vias extending upward through said substrate from said ground plane; a plurality of conductive traces to connect selected ones of said ground conductive paths to respective ones of said grounded thermal vias to electrically connect said selected ones of said ground conductive paths to said ground plane; and a plurality of thermal solder balls coupled to said ground plane to provide electrically and thermally conductive paths from said ground plane to the primary circuit board. 9. The chip scale package of claim 8 further comprising a second plurality of solder balls, respective ones of said second plurality of solder balls coupled to respective ones of said second set of signal and ground pads. 10. The chip scale package of claim 8 wherein said first set of signal and ground pads comprise a top-side rectangular array of spaced apart signal and ground pads in an alternating signal and ground pattern. 11. The chip scale package of claim 10 wherein said plurality of signal and ground conductive paths comprise alternating signal and ground conductive paths corresponding to the alternating signal and ground pattern of said top-side rectangular array of spaced apart signal and ground pads. 12. The chip scale package of claim 11 wherein each said signal conductive path each said ground conductive path comprises: a via extending through said substrate from said top side to said bottom side of said substrate; a top-side conductive trace coupling a top end of said via to a respective one of said first set of signal and ground pads; and a bottom-side conductive trace coupling a bottom end of said via to a respective one of said second set of signal and ground pads. 13. A chip scale package to couple a flip chip die having a set of signal and ground connections with a primary circuit board, said chip scale package comprising: a substrate comprising top and bottom sides, said top side of said substrate having a mounting area for receiving the flip chip die; a first set of pads on said top side of said substrate arranged in an alternating pattern of signal and ground pads to electrically connect with the set of signal and ground pads on the flip chip die; a second set of pads on said bottom side of said substrate corresponding to said first set of pads, said second set of pads arranged in an alternating pattern of signal and ground pads; a plurality of conductive paths extending through said substrate and interconnecting corresponding ones of said first and second sets of pads in an alternating signal and ground pattern; a ground plane on said
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