초록 ▼

A process for fabricating an optical membrane device comprises providing a handle wafer and then oxidizing a surface of the handle wafer to form an insulating layer. A device wafer is then bonded to the handle wafer. An optical membrane structure is formed in this device wafer. The insulating layer

A process for fabricating an optical membrane device comprises providing a handle wafer and then oxidizing a surface of the handle wafer to form an insulating layer. A device wafer is then bonded to the handle wafer. An optical membrane structure is formed in this device wafer. The insulating layer is selectively removed to release the membrane structure. This device wafer can be manufactured from silicon wafer material. Such material typically has a low number of dislocations yielding a stable mechanical membrane structure. The insulating layer defines the electrical cavity across which electrical fields are established that are used to electrostatically deflect the membrane structure. The insulating layer is between 3 and 6 micrometers (μm) in thickness.

대표청구항 ▼

1. An optical membrane device comprising: a handle wafer material; an optical membrane layer in which a deflectable membrane structure is formed, wherein the optical membrane layer is between 5 and 10 micrometers in thickness; a solid insulating layer separating the handle wafer material from t

1. An optical membrane device comprising: a handle wafer material; an optical membrane layer in which a deflectable membrane structure is formed, wherein the optical membrane layer is between 5 and 10 micrometers in thickness; a solid insulating layer separating the handle wafer material from the optical A membrane layer that defines an electrical cavity across which electrical fields are established to deflect the membrane structure; wherein the insulating layer is between 3 and 6 micrometers in thickness. 2. An optical membrane device as claimed in claim 1, further comprising an optical port in the handle wafer material. 3. An optical membrane device as claimed in claim 1, wherein the handle wafer material is between 100 and 1000 micrometers thick. 4. An optical membrane device as claimed in claim 1, wherein the optical membrane layer comprises device wafer material tat has been mechanically bonded to the insulating layer. 5. An optical membrane device as claimed in claim 1, wherein the optical membrane layer comprises polycrystalline silicon. 6. An optical membrane device as claimed in claim 1, wherein the optical membrane layer comprises silicon nitride. 7. An optical membrane device comprising: a handle wafer material; an optical membrane layer in which a deflectable membrane structure is formed, wherein the optical membrane layer is between 6 and 8 micrometers in thickness; a solid insulating layer separating the handle wafer material from the optical membrane layer that defines an electrical cavity across which electrical fields are established to deflect the membrane structure; wherein the insulating layer is between 3 and 6 micrometers in thickness.