초록 ▼

A method for operating an electrolysis cell at a range of pressures and current densities, the cell having an ultrathin composite membrane, preferably comprising an expanded polytetrafluoroethylene base material impregnated with a hydrogen conducting ionomer. The resulting membrane is unexpectedly d

A method for operating an electrolysis cell at a range of pressures and current densities, the cell having an ultrathin composite membrane, preferably comprising an expanded polytetrafluoroethylene base material impregnated with a hydrogen conducting ionomer. The resulting membrane is unexpectedly durable and efficient when used in an electrolysis cell operating at high membrane pressure differentials, thereby allowing greater cell current densities and efficiency.

대표청구항 ▼

A method for operating an electrolysis cell at a range of pressures and current densities, the cell having an ultrathin composite membrane, preferably comprising an expanded polytetrafluoroethylene base material impregnated with a hydrogen conducting ionomer. The resulting membrane is unexpectedly d

A method for operating an electrolysis cell at a range of pressures and current densities, the cell having an ultrathin composite membrane, preferably comprising an expanded polytetrafluoroethylene base material impregnated with a hydrogen conducting ionomer. The resulting membrane is unexpectedly durable and efficient when used in an electrolysis cell operating at high membrane pressure differentials, thereby allowing greater cell current densities and efficiency. mprising: a substrate holder system configured to support the substrate such that the metal film is deposited on a first side of the substrate; an electric contact element configured to contact at least one of the second side or the edge of the substrate; and a seal disposed between the substrate holder system and the first side of the substrate. 11. The apparatus of claim 10, wherein the seal limits passage of fluid between the electrolyte cell and the second side of the substrate. 12. The apparatus of claim 10, wherein the seal comprises at least two peripherally circumferentially spaced seals. 13. The apparatus of claim 10, further comprising a rotatable head assembly disposed to rotate the substrate. 14. The apparatus of claim 10, wherein the substrate is not rotated about its vertical axis when the substrate is immersed in the electrolyte solution. 15. An apparatus for depositing a metal film onto a substrate having a seed layer on at least a first side, a second side that is opposed to the first side, and an edge, the apparatus comprising: a substrate holder system disposed to support the substrate at a position wherein at least a portion of the seed layer on the substrate is disposed, in contact with an electrolyte solution; and an electric contact element disposed to contact one or more of the second side or the edge of the substrate, wherein the electric contact element contacts a diffusion barrier layer disposed on the second side of the substrate. 16. An apparatus for depositing a metal film onto a substrate having seed layer on at least a first side, a second side that is opposed to the first side, and an edge, the apparatus comprising: a substrate holder system disposed to support the substrate at a position wherein at least a portion of the seed layer on the substrate is disposed in contact with an electrolyte solution; and an electric contact element disposed to contact one or more of the second side or the edge of the substrate, wherein the electric contact element is disposed to contact a bevel plating surface on the edge of the substrate. 17. A method for depositing a metal film onto a substrate having a seed layer disposed thereon, comprising: positioning the substrate in a substrate holder system such that the seed layer disposed on a front side of the substrate is in contact with an electrolyte solution; contacting the seed layer disposed on at least a portion of a back side of the substrate with one or more electric contact elements; and limiting the electrolyte solution from contacting the back side of the substrate using a seal disposed between the front side and the substrate holder system. 18. The method of claim 17, wherein the seed layer disposed on the front side is in communication with the seed layer disposed on the back side of the substrate. 19. The apparatus of claim 17, wherein the contacting step comprises contacting a diffusion barrier layer disposed on the back side of the substrate with at least a portion of the one or more contact elements. 20. A method for depositing a metal film onto a substrate having a metal film onto a first side, wherein the substrate comprises a second side that is opposed the first side and an edge, the method comprising: supporting the substrate in a seed layer facing down position at a position wherein at least a portion on the seed layer of the first side of the substrate is disposed in contact with an electrolyte solution; and contacting the second side or the edge of the substrate with an electric contact element, wherein the electric contact element contacts a diffusion barrier layer on the second side of the substrate, wherein the portion of the diffusion barrier layer that the electric contact element contacts is electrically coupled to the seed layer. 21. A method for depositing a metal film on a first side of a substrate having the first side, a second side and an edge, wherein the first side is opposed to the second side