Long range ordered semiconductor interface phase and oxides
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/311
H01L-021/31
출원번호
US-0555251
(2000-10-19)
국제출원번호
PCT/US98/25355
(1998-11-25)
국제공개번호
WO99/28953
(1999-06-10)
발명자
/ 주소
Herbots, Nicole
Atluri, Vasudeva P.
Bradley, James D.
Swati, Banerjee
Hurst, Quinton B.
Xiang, Jiong
출원인 / 주소
Arizona Board of Regents
대리인 / 주소
Gallagher & Kennedy, P.A.
인용정보
피인용 횟수 :
12인용 특허 :
1
초록▼
A semiconductor processing method capable of producing highly ordered, ultra thin dielectrics, including gate oxide and other semiconductor dielectrics, and interphase phases with low defect density. The process includes a degrease step, an etch, primary oxidation and then a passivation step which u
A semiconductor processing method capable of producing highly ordered, ultra thin dielectrics, including gate oxide and other semiconductor dielectrics, and interphase phases with low defect density. The process includes a degrease step, an etch, primary oxidation and then a passivation step which utilizes hydrofluoric acid to passivate the cleaned silicon surface with hydrogen. Dielectric layers may then be formed with low interface defect density, low flat band voltages and low fixed charge on semiconductor substrates.
대표청구항▼
A semiconductor processing method capable of producing highly ordered, ultra thin dielectrics, including gate oxide and other semiconductor dielectrics, and interphase phases with low defect density. The process includes a degrease step, an etch, primary oxidation and then a passivation step which u
A semiconductor processing method capable of producing highly ordered, ultra thin dielectrics, including gate oxide and other semiconductor dielectrics, and interphase phases with low defect density. The process includes a degrease step, an etch, primary oxidation and then a passivation step which utilizes hydrofluoric acid to passivate the cleaned silicon surface with hydrogen. Dielectric layers may then be formed with low interface defect density, low flat band voltages and low fixed charge on semiconductor substrates. eric film laminated to at least one of a polymeric film and a metallized film. 8. The sleeve of claim 1 wherein at least a portion of one surface of the upper portion of the sleeve is provided with a printed design disposed thereon. 9. The sleeve of claim 1 wherein at least a portion of one surface of the skirt portion of the lower portion of the sleeve is provided with a printed design disposed thereon. ulated foam board system of claim 17, wherein the foam board system is composed of from about 5 wt.% to about 25 wt.% of said central layer. 19. An insulated foam board system, comprising: a first foam layer being a blend of crystal polystyrene and impact polystyrene; a second foam layer being an independently selected blend of crystal polystyrene and impact polystyrene; and a coated or laminated central layer to provide flexibility that is located between said first layer and said second layer, said second central layer being bonded to said first layer and said second layer, said central layer being made from a material selected from the group consisting of crystal polystyrene, impact polystyrene, polyethylene terephthalate and combinations thereof; wherein the density of the insulated foam board system is from about 1 to about 6 lbs/ft3. 20. An insulated foam board system comprising: a first foam layer comprising a polystyrene, a second foam layer comprising an independently selected polystyrene, and a coated or laminated central layer to provide flexibility that is located between said first layer and said second layer, said central layer comprising a high impact polystyrene, wherein the density of the insulated foam board system is from about 1 to about 4 lbs/ft3. 21. The insulated foam board system of claim 20, wherein said first foam layer consists essentially of a polystyrene, said second foam layer consists essentially of an independently selected polystyrene and said central layer consists essentially of a high impact polystyrene. 22. The insulated foam board system of claim 20, wherein the density of the insulated foam board system is from about 2 to about 4 lbs/ft3. 23. The insulated foam board system of claim 20, wherein the machine direction flexural average strength stress at yield of the insulated foam board system is greater than about 250 psi. 24. The board system of claim 20, wherein the thickness of the insulated foam board system is from about 1/8 of an inch to about 1 inch. 25. The board system of claim 20, wherein the insulated foam board system is a fanfold board. 26. The insulated foam board system of claim 20, wherein said first and second foam layers are made of the same polystyrene material. 27. The insulated foam board system of claim 20, further comprising a laminated surface coating located on an outer surface of said first layer. 28. The insulated foam board system of claim 27, further comprising a second laminated surface coating located on an outer surface of said second layer. 29. The insulated foam board system of claim 20, wherein said central layer is bonded to said first layer via an adhesive. 30. The insulated foam board system of claim 20, wherein said central layer is bonded to said second layer via an adhesive. 31. The insulated foam board system of claim 20, wherein the foam board system is composed of from about 2 wt.% to about 50 wt.% of said central layer. 32. The insulated foam board system of claim 31, wherein the foam board system is composed of from about 5 wt.% to about 25 wt.% of said central layer. 33. The insulated foam board system of claim 32, wherein the foam board system is composed of from about 5 wt.% to about 15 wt.% of said central layer. 34. An insulated foam board system comprising: a first foam layer comprising a blend of crystal polystyrene and impact polystyrene, a second foam layer comprising an independently selected blend of crystal polystyrene and impact polystyrene, and a coated or laminated central layer to provide flexibility that is located between said first layer and said second layer, said central layer comprising a high impact polystyrene, wherein the density of the insulated foam board system is from about 1 to about 6 lbs/ft3. ard coat layer comprises (A) a resin cured by an ionizing radiation and, per 100 parts by weight of the resin, 2 to 25 parts by weight of (B) silica particles having an average diameter of 0.5 to 5 μm and 10 to 200 parts by weight of (C) fine particles having an average diameter of 1 to 60 nm. The very fine anti-glare hard coat film provides excellent visibility when the film is used for various types of displays since the film provides an excellent anti-glare property to the displays such as very fine liquid crystal displays without deterioration in the quality of displayed images. to claim 2, wherein the inorganic fine particle is a fumed silica having an average primary particle diameter of 3 to 30 nm. 6. The ink-jet recording material for a back lit use according to claim 1 or 2, wherein the inorganic pigment is a silica prepared by the wet process. 7. The ink-jet recording material for a back lit use according to claim 1 or 2, wherein the inorganic pigment is contained in an amount of 0.1 to 2 g/m2in a unit area of the recording material. 8. The ink-jet recording material for a back lit use according to claim 2, wherein the ink-receptive layer contains a water-soluble metallic compound. 9. The ink-jet recording material for a back lit use according to claim 8, wherein the water-soluble metallic compound is a zirconium compound. 10. The ink-jet recording material for a back lit use according to claim 1 or 2, wherein a contact angle of the surface of the ink-jet recording material for a back lit use with water is 13 to 35°, and a contact angle with linseed oil is 8 to 20°. 11. The ink-jet recording material for a back lit use according to claim 10, wherein a contact angle of the surface of the ink-jet recording material for a back lit use with linseed oil is 8 to 15°. 12. The ink-jet recording material for a back lit use according to claim 10, wherein a contact angle of the surface of the ink-jet recording material for a back lit use with water is 13 to 30°. 13. The ink-jet recording material for a back lit use according to claim 10, wherein the ink-receptive layer contains a surfactant with a HLB value of 3 to 8. 14. The ink-jet recording material for a back lit use according to claim 1 or 2, wherein the ink-jet recording material for a back lit use is used in a way that an image printed by the ink-jet method is directly observed by a transmitted light from a back light. 15. The ink-jet recording material according to claim 1 or 2, wherein a solid content of the ink-receptive layer per unit area is 10 g/m2or more. 16. The ink-jet recording material according to claim 1 or 2, wherein a solid content of the ink-receptive layer per unit area is 13 to 35 g/m2. 17. The ink-jet recording material according to claim 1 or 2, wherein the inorganic pigment is present in an amount of 0.1 to 5 g/m2per a unit area of the recording material. 18. The ink-jet recording material according to claim 2, wherein a weight ratio (A)/(B) of (A) the inorganic fine particles with the secondary average particle diameter of less than 0.5 μm and (B) the inorganic pigment with an average particle diameter of 0.5 μm or more is 82/18 to 99/1. 19. The ink-jet recording material according to claim 2, further including a weight ratio (A)/(B) of (A) the inorganic fine particles with the secondary average particle diameter of less than 0.5 μm and (B) the inorganic pigment with an average particle diameter of 0.5 μm or more is 90/10 to 98/2. ayer of the novel material as a protective overcoat. resin on total acrylic solids in the adhesive so that the carrier can be quickly removed following application of the graphic to the substrate; a substantially contiguous layer of a thermoplastic containing material, the thermoplastic material being on the adhesive; and a substantially contiguous layer of a means for adhering a graphic, the graphic adherent means being on the layer of thermoplastic containing material to provide a flexible laminate from which graphics may be cut. 2. The laminate of claim 1 wherein the thermoplastic is selected from the group consisting of polyurethane or vinyl, wherein the vinyl is selected from the group consisting of polyvinyl chloride, partially carboxylated polyvinyl chloride and non-carboxylated polyvinyl chloride. 3. The laminate of claim 1 where the plastic film is comprised of polyester. 4. The laminate of claim 3 where the polyester film has a thickness between 3.0 to 7.0 mils. 5. The laminate of claim 1 where the adhesive is a substantially contiguous layer on the second surface of the plastic film. 6. The laminate of claim 5 where the layer of adhesive is from 0.5 to 5.0 mils thick. 7. The laminate of claim 1 wherein the means for adhering a graphic is responsive to heat to adhere said substantially continguous layer of a means for adhering a graphic to a substrate, the adhesive on the second surface of the plastic film has a peel strength, immediately after application of said substantially continguous layer of a means for adhering a graphic to a substrate when it is desirable to remove the carrier, which is less than the corresponding peel strength of said means, whereby the carrier may be removed while said substantially continguous layer of a means for adhering a graphic is still at substantially the temperature for adhering it to a substrate. 8. The laminate of claim 1 wherein the substrate is a fabric.
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이 특허에 인용된 특허 (1)
Hall Steven C. (Round Rock TX) Gardner Mark I. (Red Rock TX) Fulford ; Jr. Henry J. (Austin TX), Oxide removal method for improvement of subsequently grown oxides.
Herbots, Nicole; Culbertson, Robert J.; Bradley, James; Hart, Murdock Allen; Sell, David Alexander; Whaley, Shawn David, Methods for wafer bonding, and for nucleating bonding nanophases.
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