Phosphorus-containing phenolic, thiophenolic or aminophenyl flame-retardant hardener, and epoxy resins cured thereby
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C07F-009/32
C07F-009/655
C08G-008/28
C08G-012/44
출원번호
US-0571682
(2000-05-16)
우선권정보
TW-089100075 (2000-01-04)
발명자
/ 주소
Wang, Chun-Shan
Shieh, Jeng-Yueh
출원인 / 주소
National Science Council
대리인 / 주소
Jackson Walker L.L.P.
인용정보
피인용 횟수 :
11인용 특허 :
2
초록▼
A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the pheny
A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the phenyl rings are substituted with at least one of the structures wherein R1and R2independently are H, C1-C18alkyl, C6-C18aryl, C6-C18substituted aryl, C6-C18aryl methylene, or C6-C18substituted aryl methylene; X is O, S or NH and Ar is wherein R is C1-C4alkyl and n=0-5.
대표청구항▼
A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the pheny
A hardener for an epoxy resin comprises a phenolic, thiophenolic, aminophenyl, tris-phenolic, tris-thiophenolic, tris-aminophenyl, tetrakis-phenolic, tetrakis-thiophenolic, or tetrakis-aminophenyl compounds; or phenol-formaldehyde or phenol-formaldehyde/melamine-formaldehyde resins wherein the phenyl rings are substituted with at least one of the structures wherein R1and R2independently are H, C1-C18alkyl, C6-C18aryl, C6-C18substituted aryl, C6-C18aryl methylene, or C6-C18substituted aryl methylene; X is O, S or NH and Ar is wherein R is C1-C4alkyl and n=0-5. ers, thiophosphate esters, phosphonate esters, thiophosphonate esters, phosphinate esters, thiophosphinate esters, phosphines, triphenylphosphine, phosphine oxides, triphenylphosphine oxide, tris(2-cyanoethyl)phosphine oxide, thiophosphine oxides, and phosphonium salts. 14. The composition of claim 13 wherein the organic phosphorus species is an aromatic phosphate. 15. The composition of claim 14 wherein the aromatic phosphate is selected from the group consisting of triphenylphosphate, tricresylphosphate, resorcinol bis(diphenylphosphate), and bisphenol A bis(diphenylphosphate). 16. The composition of claim 13 wherein the organic phosphorus species is present in an amount in a range of between about 0.5 wt % and about 15 wt %, based on the weight of the entire composition. 17. The composition of claim 1 wherein the antidrip agent comprises at least one fluoropolymer. 18. The composition of claim 17 wherein the fluoropolymer is present in an amount in a range of between about 0.01 wt % and about 2 wt %, based on the weight of the entire composition. 19. The composition of claim 17 wherein the fluoropolymer comprises polytetrafluoroethylene. 20. The composition of claim 17 wherein the fluoropolymer is added to the composition in the form of a concentrate in at least one other resinous component of the composition. 21. The composition of claim 20 wherein the fluoropolymer is added to the composition in the form of a concentrate in styrene-acrylonitrile copolymer. 22. The composition of claim 1 wherein the perfluoroalkanesulfonate salt comprises a sodium, potassium, or tetraalkylammonium salt of a perfluoroalkanesulfonic ac
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이 특허에 인용된 특허 (2)
Ito Mikio,JPX ; Miyake Sumiya,JPX, Flame-retardant resin composition and semiconductor sealant using the same.
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