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In a system having multiple power supplies with outputs connected in parallel, the number of supplies providing current is controlled to improve the overall system efficiency. For example, when the output current of individual power supplies falls below a threshold, one or more supplies may be place

In a system having multiple power supplies with outputs connected in parallel, the number of supplies providing current is controlled to improve the overall system efficiency. For example, when the output current of individual power supplies falls below a threshold, one or more supplies may be placed into a standby mode. This increases the output current of the supplies that are in an operational mode, improving the efficiency of the supplies that are in an operational mode.

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In a system having multiple power supplies with outputs connected in parallel, the number of supplies providing current is controlled to improve the overall system efficiency. For example, when the output current of individual power supplies falls below a threshold, one or more supplies may be place

In a system having multiple power supplies with outputs connected in parallel, the number of supplies providing current is controlled to improve the overall system efficiency. For example, when the output current of individual power supplies falls below a threshold, one or more supplies may be placed into a standby mode. This increases the output current of the supplies that are in an operational mode, improving the efficiency of the supplies that are in an operational mode. ll device as claimed in claim 1, wherein an amount of applied voltage to said gate input determines an amount of leakage current. die attached on a substrate, and a metal heat spreader having supporting arms embedded in a molding cap, wherein the embedded supporting arms are free of direct rigid affixation joining feet thereof to the substrate, and wherein the heat spreader is constructed of copper. 21. A plastic ball grid array semiconductor package, comprising a die attached on a substrate, and a metal heat spreader having supporting arms embedded in a molding cap, wherein the embedded supporting arms are free of direct rigid affixation joining feet thereof to the substrate, and wherein a portion of the heat spreader lying overlying the semiconductor device protrudes downward toward the upper surface of the semiconductor device, and a corresponding portion of the mold cap is thinner between the upper surface of the semiconductor device and the heat spreader than more peripherally.