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Methods for wafer proximity cleaning and drying 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/00
출원번호 US-0309641 (2002-12-03)
발명자 / 주소
  • de Larios, John Martin
  • Ravkin, Mike
  • Travis, Glen
  • Keller, Jim
  • Krusell, Wilbur
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Martine & Penilla, LLP
인용정보 피인용 횟수 : 57  인용 특허 : 4

초록

A method for preparing a semiconductor wafer surface is provided which includes providing a plurality of source inlets and a plurality of source outlets and applying isopropyl alcohol (IPA) vapor gas through the plurality of source inlets to the wafer surface when the plurality of source inlets and

대표청구항

A method for preparing a semiconductor wafer surface is provided which includes providing a plurality of source inlets and a plurality of source outlets and applying isopropyl alcohol (IPA) vapor gas through the plurality of source inlets to the wafer surface when the plurality of source inlets and

이 특허에 인용된 특허 (4)

  1. Batchelder William T. (San Mateo CA), Apparatus and method for spin coating wafers and the like.
  2. Hatano Tatsuo,JPX ; Murakami Seishi,JPX ; Tada Kunihiro,JPX, Film forming and dry cleaning apparatus and method.
  3. Snodgrass Ocie T. ; Gibson Gregory M. ; Newquist Carl W., Linear developer.
  4. Watanabe Yoshio,JPX ; Kawashima Kenichi,JPX, Method of fabricating a semiconductor device using a CMP process.

이 특허를 인용한 특허 (57)

  1. Ravkin,Mike; Boyd,John; Dordi,Yezdi N.; Redeker,Fred C.; de Larios,John M., Apparatus and method for depositing and planarizing thin films of semiconductor wafers.
  2. Hemker,David; Redeker,Fred C.; Boyd,John; de Larios,John M.; Ravkin,Michael; Korolik,Mikhail, Apparatus and method for providing a confined liquid for immersion lithography.
  3. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Apparatus and system for cleaning a substrate.
  4. de Larios,John M.; Owczarz,Aleksander; Schoepp,Alan; Redeker,Fritz, Apparatuses and methods for cleaning a substrate.
  5. Kelekar, Rajesh; Egami, Glen Eric; Francis, Aaron T., Chuck for mounting a semiconductor wafer for liquid immersion processing.
  6. Weidman, Timothy W.; Wijekoon, Kapila P.; Zhu, Zhize; Gelatos, Avgerinos V. (Jerry); Khandelwal, Amit; Shanmugasundram, Arulkumar; Yang, Michael X.; Mei, Fang; Moghadam, Farhad K., Contact metallization scheme using a barrier layer over a silicide layer.
  7. Korolik, Mikhail; de Larios, John M.; Ravkin, Mike; Farber, Jeffrey, Controls of ambient environment during wafer drying using proximity head.
  8. Stewart, Michael P.; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Eaglesham, David J., Electroless deposition process on a silicon contact.
  9. Stewart, Michael P.; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Eaglesham, David J., Electroless deposition process on a silicon contact.
  10. Webb, Eric G.; Mayer, Steven T.; Dinneen, David Mark; Minshall, Edmund B.; Bartlett, Christopher M.; Stowell, R. Marshall; Winslow, Mark T.; Kepten, Avishai; Feng, Jingbin; Kaplan, Norman D.; Lyons, Richard K.; Alexy, John B., Electroless plating-liquid system.
  11. Lim, Gregory; Francis, Aaron; Williams, Kenneth; Mariserla, Sandeep, Ex-situ cleaning assembly.
  12. Cheng, Wing Lau; Cheng, legal representative, Helen; Kholodenko, Arnold, Hybrid composite wafer carrier for wet clean equipment.
  13. Lim, Gregory; Francis, Aaron; Williams, Kenneth, In-situ cleaning assembly.
  14. Woods,Carl; Garcia,James P.; de Larios,John, Meniscus, vacuum, IPA vapor, drying manifold.
  15. Ravkin, Mike; Korolik, Mikhail; Wilcoxson, Mark, Method and apparatus for atomic layer deposition (ALD) in a proximity system.
  16. Freer, Erik M.; deLarios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a semiconductor substrate.
  17. Freer, Erik M.; deLarios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a semiconductor substrate.
  18. Boyd,John M.; Ravkin,Mike; Redeker,Fred C.; de Larios,John, Method and apparatus for cleaning a substrate using megasonic power.
  19. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a substrate using non-Newtonian fluids.
  20. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a substrate using non-newtonian fluids.
  21. de Larios,John M.; Ravkin,Mike; Woods,Carl; Redeker,Fritz; Garcia,James P.; Nickhou,Afshin, Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces.
  22. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fritz C., Method and apparatus for particle removal.
  23. Magni, Enrico; Lenz, Eric, Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer.
  24. Ravkin,Michael; Smith,Michael G. R.; de Larios,John M.; Redeker,Fritz; Korolik,Mikhail; DiPietro,Christian, Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer.
  25. Zhu, Ji; Mendiratta, Arjun; Mui, David, Method and apparatus for removing contaminants from substrate.
  26. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Method and apparatus for removing contamination from substrate.
  27. de Larios,John M.; Ravkin,Mike; Parks,John; Korolik,Mikhail; Redeker,Fred C., Method and apparatus for transporting a substrate using non-Newtonian fluid.
  28. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and material for cleaning a substrate.
  29. Korolik, Mikhail; Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Mike; Redeker, Fritz, Method and system for using a two-phases substrate cleaning compound.
  30. Lopatin,Sergey; Shanmugasundram,Arulkumar; Lubomirsky,Dmitry; Pancham,Ian A., Method for forming CoWRe alloys by electroless deposition.
  31. Korolik, Mikhail; Ravkin, Michael; deLarios, John; Redeker, Fritz C.; Boyd, John M., Method for removing material from semiconductor wafer and apparatus for performing the same.
  32. Yun, Seokmin; Zhu, Ji; deLarios, John M.; Wilcoxson, Mark, Method of dielectric film treatment.
  33. Mikhaylichenko, Katrina; Ravkin, Mike; Redeker, Fritz; de Larios, John M.; Freer, Erik M.; Korolik, Mikhail, Methods for contained chemical surface treatment.
  34. Zhu, Ji; Yun, Seokmin; Wilcoxson, Mark; de Larios, John, Post etch wafer surface cleaning with liquid meniscus.
  35. Lubomirsky, Dmitry; Weidman, Timothy W.; Shanmugasundram, Arulkumar; Kovarsky, Nicolay Y.; Wijekoon, Kapila, Process for electroless copper deposition.
  36. Mori,Yoshiaki, Processing-subject cleaning method and apparatus, and device manufacturing method and device.
  37. Mikhaylichenko, Katrina; deLarios, John, Proximity head heating method and apparatus.
  38. Ravkin, Michael; de Larios, John M.; Redeker, Fred C.; Korolik, Mikhail; Freer, Erik M., Proximity head with angled vacuum conduit system, apparatus and method.
  39. Woods,Carl; Smith,Michael G. R.; Parks,John; Garcia,James P.; de Larios,John M., Proximity meniscus manifold.
  40. Ravkin, Michael; de Larios, John M.; Korolik, Mikhail; Smith, Michael G. R.; Woods, Carl, Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same.
  41. Lenz, Eric, Reclaim chemistry.
  42. Lopatin,Sergey D.; Shanmugasundrum,Arulkumar; Shacham Diamand,Yosef, Silver under-layers for electroless cobalt alloys.
  43. Ravkin, Mike; Kabansky, Alex; de Larios, John, Single phase proximity head having a controlled meniscus for treating a substrate.
  44. Feng, Jingbin; Mayer, Steven T.; Dinneen, Daniel Mark; Minshall, Edmund B.; Bartlett, Christopher M.; Webb, Eric G.; Stowell, R. Marshall; Winslow, Mark T.; Kepten, Avishai; Kaplan, Norman D.; Lyons, Richard K.; Alexy, John B., Small-volume electroless plating cell.
  45. Quillen, Michael W.; Holbrook, L Palmer; Moore, John Cleaon, Substrate cleaning processes through the use of solvents and systems.
  46. Freer, Erik M.; deLarios, John M.; Ravkin, Michael; Korolik, Mikhail; Redeker, Fritz C., Substrate cleaning technique employing multi-phase solution.
  47. Woods, Carl, Substrate meniscus interface and methods for operation.
  48. Freer, Erik M.; de Larios, John M.; Ravkin, Michael; Korolik, Mikhail; Mikhaylichenko, Katrina; Redeker, Fritz C., Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions.
  49. Woods,Carl; Smith,Michael G. R.; Parks,John, Substrate proximity processing housing and insert for generating a fluid meniscus.
  50. Woods,Carl; de Larios,John, System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold.
  51. Boyd, John M.; Redeker, Fred C., System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology.
  52. O'Donnell, Robert; Lin, Cheng-Yu (Sean); Kholodenko, Arnold, System, method and apparatus for maintaining separation of liquids in a controlled meniscus.
  53. Andreas, Michael, Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries.
  54. Smith,Stephen M.; Treur,Randolph E., Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same.
  55. Yun, Seokmin; Boyd, John M.; de Larios, John M.; Redeker, Fritz, Wafer edge surface treatment with liquid meniscus.
  56. Lee, Keum-Joo, Wafer spin drying apparatus with a plurality of supply nozzles and methods for using the same.
  57. Woods, Carl, Wafer support apparatus for electroplating process and method for using the same.
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