초록 ▼

A structure suitable for connecting an integrated circuit to a supporting substrate wherein the structure has thermal expansion characteristics well-matched to the integrated circuit is an interposer. The integrated circuit and the interposer are comprised of bodies that have substantially similar c

A structure suitable for connecting an integrated circuit to a supporting substrate wherein the structure has thermal expansion characteristics well-matched to the integrated circuit is an interposer. The integrated circuit and the interposer are comprised of bodies that have substantially similar coefficients of thermal expansion. The interposer has a first surface adapted to electrically and mechanically couple to the integrated circuit. The interposer has a second surface adapted to electrically and mechanically couple to a supporting substrate. Electrically conductive vias provide signal pathways between the first surface and the second surface of the interposer. Various circuit elements may be incorporated into the interposer. These circuit elements may be active, passive, or a combination of active and passive elements.

대표청구항 ▼

1. An electronic assembly comprising: a die including a silicon substrate, the die comprising a first plurality of insulated gate field effect transistors having a first set of electrical characteristics; an interposer including a first surface and an opposing second surface, the first surface a

1. An electronic assembly comprising: a die including a silicon substrate, the die comprising a first plurality of insulated gate field effect transistors having a first set of electrical characteristics; an interposer including a first surface and an opposing second surface, the first surface attached to the die by solder bumps, the interposer comprising a second plurality of insulated gate field effect transistors having a second set of electrical characteristics, the first set of electrical characteristics is different from the second set of electrical characteristics; and a circuit substrate attached to the second surface by solder balls; wherein the interposer comprises circuit elements. 2. The electronic assembly of claim 1, wherein the circuit elements comprise active circuit elements. 3. The electronic assembly of claim 1, wherein the circuit elements comprise passive circuit elements. 4. The electronic assembly of claim 1, wherein the circuit elements comprise active and passive circuit elements. 5. The electronic assembly of claim 4, wherein the active circuit elements include at least one field effect transistor, and the passive circuit elements include at least one capacitor. 6. The electronic assembly of claim 1, wherein the first set of electrical characteristics includes a first gate dielectric breakdown voltage, the second set of electrical characteristics includes a second gate dielectric breakdown voltage and the second gate dielectric breakdown voltage is greater than the first gate dielectric breakdown voltage. 7. The electronic assembly of claim 1, wherein the die and the interposer are electrically coupled through the solder bumps, and a first power supply node of the die is coupled to a first terminal of a capacitor disposed on the interposer, and a second power supply node of the die is coupled to a second terminal of the capacitor. 8. The electronic assembly of claim 1 wherein the interposer comprises a silicon substrate.