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In a magnetic bearing apparatus provided at least with a touchdown bearing and a corrugated plate-like damper member inserted into an annular gap between the touchdown bearing and its retainer member, to keep on holding the corrugated plate-like damper member in a predetermined position without fail

In a magnetic bearing apparatus provided at least with a touchdown bearing and a corrugated plate-like damper member inserted into an annular gap between the touchdown bearing and its retainer member, to keep on holding the corrugated plate-like damper member in a predetermined position without fail. A cylindrical retainer member 9 is a thrust bearing retainer member and also a touchdown bearing retainer member. A touchdown bearing 4, i.e., a pair of roller bearings 4a and 4b disposed in upper and lower stages are received in an inner circumferential portion of the cylindrical retainer member 9. An annular gap G is formed between the inner circumferential surface of the cylindrical retainer member 9 and outer races of the pair of roller bearings 4a and 4b. A pair of corrugated strip steel plates 8a and 8b that are the corrugated plate-like damper members are inserted into this annular gap G. Also, a strip-like metal thin plate 10a is inserted while being clamped between the upper corrugated strip steel plate 8a and the lower corrugated strip steel plate 8b. Thus, the strip-like metal thin plate 10a functions as a positional offset preventing means of the pair of corrugated strip steel plates 8a and 8b.

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In a magnetic bearing apparatus provided at least with a touchdown bearing and a corrugated plate-like damper member inserted into an annular gap between the touchdown bearing and its retainer member, to keep on holding the corrugated plate-like damper member in a predetermined position without fail

In a magnetic bearing apparatus provided at least with a touchdown bearing and a corrugated plate-like damper member inserted into an annular gap between the touchdown bearing and its retainer member, to keep on holding the corrugated plate-like damper member in a predetermined position without fail. A cylindrical retainer member 9 is a thrust bearing retainer member and also a touchdown bearing retainer member. A touchdown bearing 4, i.e., a pair of roller bearings 4a and 4b disposed in upper and lower stages are received in an inner circumferential portion of the cylindrical retainer member 9. An annular gap G is formed between the inner circumferential surface of the cylindrical retainer member 9 and outer races of the pair of roller bearings 4a and 4b. A pair of corrugated strip steel plates 8a and 8b that are the corrugated plate-like damper members are inserted into this annular gap G. Also, a strip-like metal thin plate 10a is inserted while being clamped between the upper corrugated strip steel plate 8a and the lower corrugated strip steel plate 8b. Thus, the strip-like metal thin plate 10a functions as a positional offset preventing means of the pair of corrugated strip steel plates 8a and 8b. d semiconductor chip in the layer with said semiconductor chip disposed therein. 18. A laminated-chip semiconductor device comprising: a plurality of semiconductor chips having a plurality of terminals; and a plurality of chip-mounting substrates on each of which at least one of said semiconductor chips is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a side edge rotated by a predetermined angle from a mutual parallel state with respect to at least two predetermined layers among two or more laminated layers. 19. The laminated-chip semiconductor device according to claim 18, wherein said chip-mounting substrates disposed in at least two predetermined layers among said chip-mounting substrates have the whole arrangements of said relay terminals, which are in a mutual parallel state between said layers. 20. The laminated-chip semiconductor device according to claim 18, wherein said relay terminals are disposed such that a center of the whole arrangement of said relay terminals is arranged to correspond with th