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In a preferred embodiment, the invention comprises an apparatus for generating electrical power which utilizes an electrically superconductive coil immersed in a cryogenic fluid for generating a magnetic field within a region surrounding the superconductive coil when an electrical current circulates

In a preferred embodiment, the invention comprises an apparatus for generating electrical power which utilizes an electrically superconductive coil immersed in a cryogenic fluid for generating a magnetic field within a region surrounding the superconductive coil when an electrical current circulates in the superconductive coil. The apparatus further includes a prime mover and a conduit which conducts a flow of gas resulting from evaporation of a cryogenic fluid to the prime mover to induce rotational motion in the prime mover. An electrical conductor is rotatably mounted within the region surrounding the superconductive coil in which the magnetic field is generated. The electrical conductor is operatively connected to the prime mover so that rotational movement of the prime mover is transferred to the electrical conductor to generate an electrical output current.

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In a preferred embodiment, the invention comprises an apparatus for generating electrical power which utilizes an electrically superconductive coil immersed in a cryogenic fluid for generating a magnetic field within a region surrounding the superconductive coil when an electrical current circulates

In a preferred embodiment, the invention comprises an apparatus for generating electrical power which utilizes an electrically superconductive coil immersed in a cryogenic fluid for generating a magnetic field within a region surrounding the superconductive coil when an electrical current circulates in the superconductive coil. The apparatus further includes a prime mover and a conduit which conducts a flow of gas resulting from evaporation of a cryogenic fluid to the prime mover to induce rotational motion in the prime mover. An electrical conductor is rotatably mounted within the region surrounding the superconductive coil in which the magnetic field is generated. The electrical conductor is operatively connected to the prime mover so that rotational movement of the prime mover is transferred to the electrical conductor to generate an electrical output current. get drive torque. Meanwhile, the motor torque upper limit value is estimated from the motor rotational speed. If the front wheel target drive torque exceeds the motor torque upper limit value, the drive torque ΔT, which corresponds to the amount by which the motor torque is insufficient, is added to the rear wheel target drive torque. at least one of said semiconductor chips is mounted, a plurality of relay terminals electrically connected to said respective terminals of said semiconductor chip are disposed to surround a portion with said semiconductor chip mounted thereon from the outside in the vicinity of said portion, and at least one of said semiconductor chips has a center offset from a center of another semiconductor chip in at least two predetermined layers among two or more laminated layers. 8. The laminated-chip semiconductor device according to claim 7, wherein said chip-mounting substrates disposed in at least two predetermined layers among said chip-mounting substrates have centers of the whole arrangements of said relay terminals disposed on said chip-mounting substrates, which are arranged to correspond with each other. 9. The laminated-chip semiconductor device according to claim 7, wherein said relay terminals are disposed such that said center of the whole arrangement of said relay terminals is arranged to correspond with the center of said chip-mounting substrate. 10. The laminated-chip semiconductor device according to claim 7, wherein a side edge of at least one of said offset semiconductor chips is rotated by a predetermined angle from a mutual parallel state with respect to an arrangement opposite to the side edge of said semiconductor chip in the whole arrangement of said relay terminals. 11. The laminated-chip semiconductor device according to claim 7, wherein at least one pair of packaging members formed of predetermined materials are disposed around at least said offset semiconductor chip among said semiconductor chips so that the packaging members are symmetric with each other with respect to said semiconductor chip in the layer with said semiconductor chip disposed therein. 12. A laminated-chip semiconductor device comprising: a first chip-mounting substrate on which at least one semiconductor chip having a plurality of terminals is mounted, and a plurality of relay terminals electrically connected to said respective terminals of sa