[특허]Method of forming freestanding metal dendrites

[미국특허] Method of forming freestanding metal dendrites 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-003/02 H05K-003/10
출원번호	US-0928633 (2001-08-13)
발명자 / 주소	Campbell, Jeffrey S. Wike, William T.
출원인 / 주소	International Business Machines Corporation
대리인 / 주소	Hogg, William N.
인용정보	피인용 횟수 : 3 인용 특허 : 22

초록 ▼

A technique for making acicular, branched, conductive dendrites, and a technique for using the dendrites to form a conductive compressible pad-on-pad connector are provided. To form the dendrites, a substrate is provided on which dendrites are grown, preferably on a metal film. The dendrites are then removed from the substrate, preferably by etching metal from the substrate. The so formed dendrites are incorporated into a compressible dielectric material, which then forms a compressible pad-on-pad connector between two conducting elements, such as connector pads on electrical devices, e.g. an I/C chip mounted on a substrate, such as a chip carrier.

대표청구항 ▼

1. A method of forming free standing metal dendrites comprising the steps of: providing a substrate on which said dendrites can be grown; growing dendrites on said substrate; removing said grown dendrites from said substrate; and dispersing said dendrites in a compressible dielectric material. 2. The method as defined in claim 1 wherein said substrate includes a metal. 3. The method as defined in claim 2 wherein said step of removing the grown dendrites from the substrate includes etching the metal. 4. The method as defined in claim 3 wherein the metal is copper. 5. The method as defined in claim 4 wherein a second layer of metal overlies said copper. 6. The method as defined in claim 5 wherein said second metal is palladium. 7. The method as defined in claim 5 wherein said dendrites are grown on said second metal. 8. The method as defined in claim 1 wherein said dendrites are branched acicular structures. 9. The method as defined in claim 1 wherein the dendrites are formed at least in pert from palladium. 10. The method as defined in claim 1 further comprising providing a plurality of spaced sites on said substrate where said dendrites are grown. 11. The method as defined in claim 10 wherein said plurality of sites are formed using a photoresist coating and forming openings to define said sites in said photoresist by photolithography. 12. The method as defined in claim 1 wherein said compressible dielectric material is selected from the group of epoxies, acrylics, and polyimides. 13. The method as defined in claim 1 wherein said compressible material is a flouro-silicon.

이 특허에 인용된 특허 (22) 인용/피인용 타임라인 분석

Naylor Malcolm (Slough GB3), Anisotropic electrical connection.
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Johnson David C. (Winston-Salem NC) Volz Keith L. (Jamestown NC) Bates Warren A. (Winston-Salem NC) Deak Frederick R. (Kernersville NC) Brooks Charles P. (Winston-Salem NC), Anisotropic interposer pad.
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Tsukagoshi Isao (Shimodate JPX) Yamaguchi Yutaka (Yuki JPX) Nakajima Atsuo (Ibaraki JPX) Mikami Yoshikatsu (Shimodate JPX) Muto Kuniteru (Shimodate JPX) Ikezoe Yoshiyuki (Yuki JPX), Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit.
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Atsumi Yoshinori (Oome JPX), Connecting structure for an electronic part.
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Tomalia Donald A. (Midland MI) Wilson Larry R. (Beaverton MI) Hedstrand David M. (Midland MI) Tomlinson Ian A. (Midland MI) Fazio Michael J. (Midland MI) Kruper ; Jr. William J. (Sanford MI) Kaplan D, Dense star polymer conjugates.
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Patterson Timothy P. (Costa Mesa CA) Hoge Carl E. (Encinitas CA), Directionally conductive polymer.
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Hanrahan James R. (Springfield PA) Johnson Daniel D. (Hockessin DE), Electrical conductive polymer matrix.
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Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Opila ; Jr. Robert L. (Aberdeen NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Piscataway NJ) Vesperman William C. , Electrical interconnection by a composite medium.
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Miller Larry L. ; Tomalia Donald A. ; Duan Robert G., Electrically conducting dendrimers.
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Takashi Nogami (Tokyo JPX) Masayuki Mitsuhashi (Saitama JPX), Electroconductive rubbery member and elastic connector therewith.
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Busacco Raymond A. (Lake Ariel PA) Chang Chi S. (Endicott NY) Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Macek Thomas G. (Endicott NY) Petrozello James R. (Endicott NY) Saxenmeyer , High density connector.
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Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Engle David E. (Vestal NY) Hall Richard R. (Endwell NY) Macek Thomas G. (Endicott NY), High density connector.
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Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Engle David E. (Vestal NY) Hall Richard R. (Endwell NY) Macek Thomas G. (Endicott NY), High density connector.
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Bartyzel Bernd (Austin TX) Duncan Steven A. (Austin TX) Fields Daniel A. (Austin TX) Vanderlee Keith A. (Austin TX), Method and apparatus for reducing interference in a pin array.
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Ozawa Kazuhito (Nara JPX), Method of connecting electronic element to base plate.
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Bindra Perminder S. (South Salem NY) Cuomo Jerome J. (Lincolndale NY) Gall Thomas P. (Endwell NY) Ingraham Anthony P. (Endicott NY) Kang Sung K. (Chappaqua NY) Kim Jungihl (Chappaqua NY) Lauro Paul (, Method of fabricating nendritic materials.
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Ishii Masahito (Hino JPX) Kataoka Tatsuo (Kawaguchi JPX) Tanaka Yoshitaka (Urawa JPX), Mounting substrate and its production method, and printed wiring board having connector function and its connection meth.
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Takiar Hem P. (San Jose CA) Shah Divyesh P. (Sunnyvale CA) Hilton Robert E. (Cupertino CA), Nickel plated copper tape.
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Cranston Benjamin H. (Princeton NJ) Shepherd Lloyd (Madison NJ), Polymer interconnect structure.
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Bindra Perminder S. (South Salem NY) Cuomo Jerome J. (Lincolndale NY) Gall Thomas P. (Endwell NY) Ingraham Anthony P. (Endicott NY) Kang Sung K. (Chappaqua NY) Kim Jungihl (Chappaqua NY) Lauro Paul (, Separable electrical connection technology.
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Tomalia Donald A. (Midland MI) Kaplan Donald A. (Cincinnati OH) Kruper ; Jr. William J. (Sanford MI) Cheng Roberta C. (Midland MI) Tomlinson Ian A. (Midland MI) Fazio Michael J. (Midland MI) Hedstran, Starburst conjugates.
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Seraphim Donald P. ; Li Che-yu ; Krusius J. Peter, Tiled flat panel displays.
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이 특허를 인용한 특허 (3) 인용/피인용 타임라인 분석

Ripley, Edward B.; Seals, Roland D.; Morrell, Jonathan S., Ceramic nanostructures and methods of fabrication.
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Kuwahara, Takashi; Takahashi, Seiya; Akimoto, Hiroshi, Connector connectable with low contact pressure.
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Sammakia, Bahgat; Jones, Jr., Wayne E.; Subbarayan, Ganesh, Nano-structure enhancements for anisotropic conductive material and thermal interposers.
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A	생활필수품
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A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Method of forming freestanding metal dendrites 원문보기