초록 ▼

Method for making a mesh-and-plate surgical implant includes the steps of applying maskant to first and second faces of a metal sheet, selectively ablating the maskant on both faces, affixing a first tape to the first face to cover same and maskant thereon, but leaving an exposed portion for a screw

Method for making a mesh-and-plate surgical implant includes the steps of applying maskant to first and second faces of a metal sheet, selectively ablating the maskant on both faces, affixing a first tape to the first face to cover same and maskant thereon, but leaving an exposed portion for a screw hole, affixing a second tape to the second face to cover same and maskant thereon, etching the first face screw hole portion to form a crater, removing the first tape, etching the crater and other exposed portions of the first face, removing the second tape, etching opposite the crater and other exposed portions of the second face to provide openings in communication with the crater, and other second face openings extending to the first face, and removing remaining maskant to provide the implant configured to include a pliable mesh portion and a rigid plate portion, and having a screw hole therein.

대표청구항 ▼

Method for making a mesh-and-plate surgical implant includes the steps of applying maskant to first and second faces of a metal sheet, selectively ablating the maskant on both faces, affixing a first tape to the first face to cover same and maskant thereon, but leaving an exposed portion for a screw

Method for making a mesh-and-plate surgical implant includes the steps of applying maskant to first and second faces of a metal sheet, selectively ablating the maskant on both faces, affixing a first tape to the first face to cover same and maskant thereon, but leaving an exposed portion for a screw hole, affixing a second tape to the second face to cover same and maskant thereon, etching the first face screw hole portion to form a crater, removing the first tape, etching the crater and other exposed portions of the first face, removing the second tape, etching opposite the crater and other exposed portions of the second face to provide openings in communication with the crater, and other second face openings extending to the first face, and removing remaining maskant to provide the implant configured to include a pliable mesh portion and a rigid plate portion, and having a screw hole therein. tween 10 and 100 kHz, the device comprising: at least three magnetron sources; each of the at least three magnetron sources comprising a target; at least two of the targets being connected at a time to a potential-free bipolar power supply device; the at least three targets being arranged relative to the substrates in such a way that the substrates are located at least partially inside a discharge current during a coating of the substrates; a switching device adapted to connect the targets to the bipolar power supply device; and a technological predetermined program for controlling the switching device, wherein the switching device connects at least two of the targets at a time to the bipolar power supply device according to the technologically predetermined program, wherein a region of high plasma density is created by the targets, wherein the substrates are located essentially in the region of high plasma density, and wherein the substrates are coated in the region of high plasma density. 9. The device of claim 8, wherein the at least three targets comprise at least four targets. 10. The device of claim 9, wherein at least two of the at least four targets are arranged on one side of the substrates and wherein at least two of the at least four targets are arranged on another side of the substrates. 11. The device of claim 8, wherein the at least three targets are arranged to surround the substrates. 12. The device of claim 8, wherein at least one of the at least three targets and the substrates are adapted to be movable. 13. The device of claim 8, wherein the at least three targets comprise four targets, wherein two of the four targets are arranged on opposite sides of the substrates, and wherein one of the two targets on each side of the substrates is adapted to be simultaneously connected to the bipolar power supply device. 14. The device of claim 8, wherein at least one of the at least three targets, which is arranged on one side of the substrates, is constantly connected to the bipolar power supply device and wherein at least two of the at least three targets, which are arranged on another side of the substrates, are changeably connected to the switching device. 15. The device of claim 8, wherein the at least three magnetron sources are spaced aparat such that their corresponding magnetic fields do not significantly influence one another. 16. The device of claim 8, further comprising a device arranged to surround the at least three magnetrons. 17. The device of claim 16, wherein the device arranged to surround the at least three magnetrons comprises one of a grounded screen and potential-free screen. 18. The device of claim 16, wherein the device arranged to surround the at least three magnetrons protrudes into an open area between a target plane and the substrates. 19. The device of claim 8, wherein the substrates comprise at least one of an optical, an electrical, and a mechanical component or tool, and wherein device is adapted to produce one of more decorative of functional layers on the substrates. 20. A device for coating substrates utilizing bipolar pulsed magnetron sputtering in the frequency range between 10 and 100 kHz, the device comprising: at least three magnetron sources; each of the at least three magnetron sources comprising a target; at least two of the targets being connected to a potential-free bipolar power supply device; the at least three targets being arranged relative to the substrates in such a way that the substrates are located at least partially inside a discharge current during a coating of the substrates; a switching device adapted to connect the targets to the bipolar power supply device; and a technological predetermined program for controlling the switching device, wherein the switching device connects at least two of the targets at a time to the bipolar power supply device according to the technologically predetermined program, wherein at least one of the at least