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특허 상세정보

Method and apparatus for absorbing thermal energy

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/700; 165/104.33; 361/690; 361/679; 361/708; 361/715; 174/015.1
출원번호 US-0166202 (2002-06-11)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Burns, Doane, Swecker & Mathis, LLP
인용정보 피인용 횟수 : 36  인용 특허 : 38
초록

An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing material integrated within the interior volume, in contact with at least a portion of the secondary surfaces to form a composite structure. The thermal energy absorbing material is in operative thermal communication with the electronic component such that at least a portion of the thermal energy generat...

대표
청구항

An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing material integrated within the interior volume, in contact with at least a portion of the secondary surfaces to form a composite structure. The thermal energy absorbing material is in operative thermal communication with the electronic component such that at least a portion of the thermal energy generat...

이 특허에 인용된 특허 (38)

  1. Gonsalves Daniel D. ; Antonuccio Robert S. ; Carney James M. ; Montagna Joseph J.. Apparatus for dissipating heat from a circuit board having a multilevel surface. USP2001046212074.
  2. Knight Thomas F. (Belmont MA) Salzman David B. (Washington DC). Apparatus for non-conductively interconnecting integrated circuits using half capacitors. USP1997055629838.
  3. Pal Debabrata ; McDunn Kevin. Apparatus including a heat-dissipating apparatus, and method for forming same. USP2001036202739.
  4. Lyman Philip C. (Boulder CO). Battery. USP1996105567544.
  5. Derryl D. J. Allman ; Brian Bystedt. Capacitor with multiple-component dielectric and method of fabricating same. USP2002016341056.
  6. Fiechter Frederick Charles ; Quigley Patrick Griffin. Clad casting for laptop computers and the like. USP2000066073684.
  7. Haws James L. ; Short ; Jr. Byron Elliott. Compact phased array antenna system, and a method of operating same. USP2001106297775.
  8. Welsch Gerhard ; McGervey Donald. Directionally-grown capacitor anodes. USP2001056226173.
  9. Wong Harry (Monterey Park CA) Chang Stanley S. (Palos Verdes Estates CA) Chang Donald C. (Thousand Oaks CA) Kelly Kenneth C. (Sherman Oaks CA). EHF array antenna backplate including radiating modules, cavities, and distributor supported thereon. USP1992075128689.
  10. Craft ; Jr. Thomas F. ; Kay Jason A. ; Pawlenko Ivan ; D'Alessio Alfonso J. ; Tancreto Anthony R. ; Shevchuk George. Enclosure for electronic components. USP2001016169247.
  11. Bryant Yvonne G. (Raleigh NC) Colvin David P. (Apex NC). Fabric with reversible enhanced thermal properties. USP1994115366801.
  12. Holman Mark E.. Gel-coated microcapsules. USP2001086270836.
  13. Holman Mark E.. Gel-coated microcapsules. USP2000086099894.
  14. Holman Mark E.. Gel-coated microcapsules. USP2001016171647.
  15. Gordon Kerry W.. Heat absorber and combination electrical apparatus producing heat and heat absorber. USP2001016181558.
  16. Chandrakant D. Patel ; Marvin S. Keshner. Heat dissipating chassis member. USP2002076418017.
  17. Bell Dean P. ; Burke Elizabeth D. ; Case Paul E. ; Johnston Donald E. ; McCord Ronald L. ; Stanulis Donald ; Sturgill W. Jeffrey. Height reducible EMI shielded electronic enclosure. USP2000086111192.
  18. Austin Thomas A. ; Greer Stephen ; Low Andrew. Integral heat pipe enclosure. USP2000066076595.
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  20. Pause Barbara. Interactive thermal insulating system having a layer treated with a coating of energy absorbing phase change material adjacent a layer of fibers containing energy absorbing phase change material. USP2000066077597.
  21. Fitch John Stuart ; Hamburgen William Riis. Lap-top enclosure having surface coated with heat-absorbing phase-change material. USP2001116317321.
  22. Nial ; Jr. John A. ; De Leon J. David ; Kaloterakis Nickolas ; Ammons ; Jr. T. William ; Dulcey Joseph. Magnetic flux suppression system. USP2001046219218.
  23. Langari Abdolreza ; Hashemi Seyed Hassan. Method and structure for temperature stabilization in flip chip technology. USP2001076261871.
  24. Fillion Raymond A. (Niskayuna NY) Wojnarowski Robert J. (Ballston Lake NY) Gdula Michael (Knox NY) Cole Herbert S. (Burnt Hills NY) Wildi Eric J. (Niskayuna NY) Daum Wolfgang (Schenectady NY). Method for fabricating an integrated circuit module. USP1994105353498.
  25. Colvin David P. (Apex NC) Bryant Yvonne G. (Raleigh NC) Mulligan James C. (Raleigh NC). Method of using thermal energy absorbing and conducting potting materials. USP1993075224356.
  26. Sengupta Subrata (Coral Gables FL). Microencapsulated phase change material slurry heat sinks. USP1991045007478.
  27. Rowe David A. (Redondo Beach CA) Lao Binneg Y. (Rancho Palos Verdes CA) Dietterle Robert E. (Fullerton CA). Microwave multiport multilayered integrated circuit chip carrier. USP1988044739448.
  28. Salee Gideon (Columbus OH). Microwave-activated mixed-powder thermal storage material; and method. USP1997055630961.
  29. Salee Gideon (Dayton OH). Microwaved-activated thermal storage material; and method. USP1995065424519.
  30. Moraes Luciano da Luz,BRX ; Correa Juan Carlos Carne,BRX ; de Barros Daniel Alessandro Oliveira,BRX. Mounting of capacitors in electrical control box. USP2001106300564.
  31. Grewe Timothy Michael ; Osovski Steve William. Phase change assisted heat sink. USP2001056239502.
  32. Klett James W. ; Burchell Timothy D.. Pitch-based carbon foam heat sink with phase change material. USP2000036037032.
  33. Pushaw Robert J.. Skived foam article containing energy absorbing phase change material. USP1999095955188.
  34. Pushaw Robert J.. Skived foam article containing energy absorbing phase change material. USP1998125851338.
  35. McQueen Malcolm M. ; Kresch Sam. Thermal dispersion mass flow rate and liquid level switch/transmitter. USP2001036208254.
  36. Colvin David P. ; Bryant Yvonne G. ; Driscoll John C. ; Mulligan James C.. Thermal insulating coating employing microencapsulated phase change material and method. USP1998095804297.
  37. Sekhon Kalwant S. (Fullerton CA) Nelson Lloyd A. (Villa Park CA) Fritz ; Jr. John E. (Anaheim CA). Transistor cooling by heat pipes having a wick of dielectric powder. USP1977094047198.
  38. Lyman Philip C.. Ultracapacitor design having a honey comb structure. USP1998085793603.

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  5. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K; Schmidt,Roger R.; Simons,Robert E.. Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack. USP2006087086247.
  6. Kostamo, Pasi. Display system. USP2017119827209.
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  8. Levola, Tapani; Saarikko, Pasi. Display system. USP2017019535253.
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  10. Willets,Julie A.; Meyers,Gerald D.; Johnson,Larry L.. Fuel cell system with inverter and phase change material. USP2008047352578.
  11. Rubenstein, Brandon A.. Heat transfer device. USP2017039606586.
  12. Rubenstein, Brandon A.; Stellman, Jeffrey Taylor. Heat transfer device with phase change material. USP2015018934235.
  13. Pidwerbecki, David; Uan-Zo-li, Alexander B.. High heat capacity electronic components and methods for fabricating. USP2015129226428.
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  22. Sainiemi, Lauri; Levola, Tapani; Saarikko, Pasi. Microfabrication. USP2016049304235.
  23. Westerinen, William J.; Robbins, Steven John; Badyal, Rajeev; Fleck, Rod G.. Mobile device light guide display. USP20190110191515.
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  25. Kostamo, Pasi; Tervonen, Ari J.. Optical components. USP2016089423360.
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  27. Weckwerth, Mark V.; Island, Tobin C.; Grove, Robert E.. Optical sensor and method for identifying the presence of skin. USP2014078777935.
  28. Weckwerth, Mark V.; Island, Tobin C.; Grove, Robert E.. Optical sensor and method for identifying the presence of skin and the pigmentation of skin. USP2017069687671.
  29. Bohn, David D.. Pixel opacity for augmented reality. USP2015129223138.
  30. Foxenland, Eral. Self-cooling electrical device. USP2012078218321.
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  32. Zhao, Yuan; Berhe, Mulugeta; Maslyk, Daniel; Allen, Scott Timon. Systems for thermal management and methods for the use thereof. USP20181110121725.
  33. Chang, Kuang-Yu; Chiou, Ing-Jer. Thermal buffering element. USP2015129210832.
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