A defroster/face cool air passage for introducing cooled air from an evaporator to a defroster opening portion and a face opening portion by bypassing a heater core, and a foot cool air passage for introducing cooled air from the evaporator to a foot opening portion by bypassing a heater core, are f
A defroster/face cool air passage for introducing cooled air from an evaporator to a defroster opening portion and a face opening portion by bypassing a heater core, and a foot cool air passage for introducing cooled air from the evaporator to a foot opening portion by bypassing a heater core, are formed independently from each other. The foot cool air passage is located at sides of the heater core in a vehicle right-and-left direction. The cooled air from the foot cool air passage is mixed with warmed air having passed through the heater core at an inlet of the foot opening portion. Accordingly, pressure loss at a foot mode in an air conditioning unit with a central installation layout is reduced, and a mounting performance on a central portion of a vehicle instrument panel is improved.
대표청구항▼
A defroster/face cool air passage for introducing cooled air from an evaporator to a defroster opening portion and a face opening portion by bypassing a heater core, and a foot cool air passage for introducing cooled air from the evaporator to a foot opening portion by bypassing a heater core, are f
A defroster/face cool air passage for introducing cooled air from an evaporator to a defroster opening portion and a face opening portion by bypassing a heater core, and a foot cool air passage for introducing cooled air from the evaporator to a foot opening portion by bypassing a heater core, are formed independently from each other. The foot cool air passage is located at sides of the heater core in a vehicle right-and-left direction. The cooled air from the foot cool air passage is mixed with warmed air having passed through the heater core at an inlet of the foot opening portion. Accordingly, pressure loss at a foot mode in an air conditioning unit with a central installation layout is reduced, and a mounting performance on a central portion of a vehicle instrument panel is improved. method, as set forth in claim 1, wherein act (a) comprises the act of: providing the stencil integral with the substrate. 5. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing the substrate which comprises a non-wettable material. 6. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing the substrate which comprises a ceramic substrate. 7. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing the stencil which comprises a non-wettable material. 8. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing the plurality of holes in the stencil which are all of uniform size. 9. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing the plurality of holes in the stencil which are all of uniform volume. 10. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing each of the plurality of holes in the stencil having a width greater than a diameter of a solder ball formed within each respective hole. 11. The method, as set forth in claim 1, wherein act (b) comprises the acts of: disposing solder paste on the stencil; and moving a squeegee relative to the stencil to dispose the solder paste into the plurality of holes in the stencil. 12. The method, as set forth in claim 1, wherein act (a) comprises the act of: providing the stencil and substrate as a conveyor belt. 13. The method, as set forth in claim 12, wherein act (b) comprises the act of: disposing solder paste on the conveyor belt; and moving the conveyor belt along a given path relative to an adjacent squeegee to dispose the solder paste into the plurality of holes in the stencil. 14. The method, as set forth in claim 12, wherein act (c) comprises the act of: moving the conveyor belt along the given path through a furnace. 15. The method, as set forth in claim 1, further comprising the act of: removing the stencil from the substrate subsequent to formation of the solder balls. 16. The method, as set forth in claim 1, further comprising the act of: removing the solder balls from the stencil and substrate. 17. The method, as set forth in claim 1, wherein the acts are performed in order of recitation.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (6)
Ito Toshikazu (Ibaraki JPX), Air conditioning apparatus for automotive vehicles.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.