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Diode housing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/0203
출원번호 US-0754043 (2000-12-29)
우선권정보 DE-0029197 (1998-06-30)
발명자 / 주소
  • Waitl, Gunther
  • Brunner, Herbert
출원인 / 주소
  • Osram Opto Semiconductors GmbH & Co.
대리인 / 주소
    Cohen, Pontani, Lieberman & Pavane
인용정보 피인용 횟수 : 129  인용 특허 : 18

초록

A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The h

대표청구항

1. An apparatus for sending or receiving radiation, comprising: a housing having a top portion and a base, said top portion including walls defining an opening with an open top and a closed bottom; a conductor accommodated within said base, said conductor having two electrically isolated portion

이 특허에 인용된 특허 (18)

  1. Yamanaka Hideo,JPX, Air-packed CCD images package and a mold for manufacturing thereof.
  2. Quinn Kraig A. (Webster NY) Jedlicka Josef E. (Rochester NY) Ormond Brian T. (Webster NY), Assembly for mounting semiconductor chips in a full-width-array image scanner.
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  5. Ogata Shiro (Nishigyo JPX) Imanaka Koichi (Minami JPX) Goto Hiroshi (Yamatokoriyama JPX) Ito Yoshinori (Takatsuki JPX) Kitajima Kourou (Higashiyodogawa JPX), Light emitting semiconductor device having an optical element.
  6. Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL) Dorinski Dale W. (Coral Springs FL), Light erasable multichip module.
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  9. Brunner Herbert,DEX ; Haas Heinz,DEX ; Waitl Gunter,DEX, Method for producing an optoelectronic semiconductor component.
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  12. Matsuo Shogo,JPX, Package for housing a semiconductor element.
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  14. Lin Paul Y. S. (12th Fl. ; No. 25 ; Sec. 1 ; Tunghua S. Rd. Taipei TWX), Package structure of multi-chip light emitting diode.
  15. Hur Ki R. (Seoul KRX), Resin molded charge coupled device package and method for preparation thereof.
  16. Nakanishi Hideyuki,JPX ; Ueno Akira,JPX ; Nagai Hideo,JPX ; Yoshikawa Akio,JPX, Semiconductor laser device and optical pickup head.
  17. You Joong Ha,KRX, Semiconductor package with transparent window and fabrication method thereof.
  18. Hohn Klaus,DEX ; Debray Alexandra,DEX ; Schlotter Peter,DEX ; Schmidt Ralf,DEX ; Schneider Jurgen,DEX, Wavelength-converting casting composition and its use.

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