초록 ▼

The present invention is directed to a machine with a position feedback system and a method for use thereof. The machine includes at least one movable element mounted for movement on a path and at least one programmable controller. The machine further includes at least two absolute or magnetostricti

The present invention is directed to a machine with a position feedback system and a method for use thereof. The machine includes at least one movable element mounted for movement on a path and at least one programmable controller. The machine further includes at least two absolute or magnetostrictive sensors or the machine includes an absolute sensor and a non-absolute sensor. The programmable controller uses positional information from the sensors to determine the position of the movable elements on the path and control the movable elements. The method includes determining a known position for the movable elements, linking at least two magnetostrictive sensors into one virtual sensor, and/or performing commutation alignment for the movable elements. Determining the position and commutation alignment can occur when the movable elements are stationary or moving.

대표청구항 ▼

The present invention is directed to a machine with a position feedback system and a method for use thereof. The machine includes at least one movable element mounted for movement on a path and at least one programmable controller. The machine further includes at least two absolute or magnetostricti

The present invention is directed to a machine with a position feedback system and a method for use thereof. The machine includes at least one movable element mounted for movement on a path and at least one programmable controller. The machine further includes at least two absolute or magnetostrictive sensors or the machine includes an absolute sensor and a non-absolute sensor. The programmable controller uses positional information from the sensors to determine the position of the movable elements on the path and control the movable elements. The method includes determining a known position for the movable elements, linking at least two magnetostrictive sensors into one virtual sensor, and/or performing commutation alignment for the movable elements. Determining the position and commutation alignment can occur when the movable elements are stationary or moving. r using a first set of process parameter values; a transfer mechanism for transferring the wafer between the measuring tool and the first processing tool; a chamber for enclosing the transfer mechanism and allowing communication between the transfer mechanism, the measuring tool and the first processing tool in a clean environment; and a processor configured to select the first set of process parameter values based on the measurement of the dimension; wherein the measuring tool is for measuring a critical dimension (CD) of a target feature on the wafer; wherein the chamber comprises: a mainframe for mounting a plurality of processing tools, including the first processing tool; a factory interface for housing the measurement tool and for mounting a wafer cassette; and a transfer chamber between and in communication with the mainframe and the factory interface; and wherein the transfer mechanism comprises a first robot for transferring the wafer between the measurement tool, the transfer chamber and the wafer cassette, and a second robot for transferring the wafer between the transfer chamber and the first processing tool. 2. The apparatus of claim 1, wherein the processor is further configured to: select a second set of process parameter values based on the measurement of the wafer dimension, and provide the second set of process parameter values to a previously visited processing tool. 3. The apparatus of claim 1, wherein measuring tool optically measures the CD of the target feature. 4. The apparatus of claim 3, wherein the target feature CD is measured using scatterometry or reflectometry. 5. The apparatus of claim 1, wherein the first processing tool comprises an etcher, and the first process parameter values comprise an etch recipe. 6. The apparatus of claim 1, wherein the measuring tool is further for aligning the wafer. 7. An apparatus for processing a semiconductor wafer, comprising: a measuring tool for measuring a dimension of a structure on the wafer; a first processing tool for performing a first process on the wafer using a first set of process parameter values; a transfer mechanism for transferring the wafer between the measuring tool and the first processing tool; a chamber for enclosing the transfer mechanism and allowing communication between the transfer mechanism, the measuring tool and the first processing tool in a clean environment; and a processor configured to: select the first set of process parameter values based on the measurement of the dimension; control the transfer mechanism to transfer the wafer from the first processing tool to the measuring tool after the first process is performed on the wafer; and control the measuring tool to re-measure the dimension of the wafer. 8. An apparatus for processing a semiconductor wafer, comprising: a measuring tool for measuring a dimension of a structure on the wafer; a first processing tool for performing a first process on the wafer using a first set of process parameter values, the first processing tool comprising an etcher and the first set of process parameter values comprising an etch recipe; a transfer mechanism for transferring the wafer between the measuring tool and the first processing tool; a chamber for enclosing the transfer mechanism and allowing communication between the transfer mechanism, the measuring tool and the first processing tool in a clean environment; a processor configured to select the first set of process parameter values based on the measurement of the dimension; wherein the measuring tool is for measuring a critical dimension (CD) of a target feature on the wafer; wherein the chamber comprises a mainframe to which the etcher is mounted, a factory interface to which the measurement tool and a wafer cassette are mounted, and a transfer chamber between the mainframe and the factory interface; and wherein the transfer mechanism comprises a robot for transferring the wafer between the measur