초록 ▼

A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall defining a frame aperture therethrough. The sid

A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall defining a frame aperture therethrough. The sidewall includes a frame seal-ring area circumscribing the frame aperture. The frame seal-ring area has a metallic surface. A sheet of a transparent material is provided having a window portion defined thereupon. The window portion has finished top and bottom surfaces. Next, a sheet seal-ring area on the sheet is prepared, the sheet seal-ring area circumscribing the window portion. Next, the prepared sheet seal-ring area of the sheet is metallized. Next, the frame is positioned against the sheet such that at least a portion of the frame seal-ring area and at least a portion of the sheet seal-ring area contact one another along a continuous junction region that circumscribes the window portion. Next, the junction region is heated until a metal-to-metal joint is formed between the frame and sheet all along the junction region, whereby a hermetic seal circumscribing the window portion is formed.

대표청구항 ▼

A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall defining a frame aperture therethrough. The sid

A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall defining a frame aperture therethrough. The sidewall includes a frame seal-ring area circumscribing the frame aperture. The frame seal-ring area has a metallic surface. A sheet of a transparent material is provided having a window portion defined thereupon. The window portion has finished top and bottom surfaces. Next, a sheet seal-ring area on the sheet is prepared, the sheet seal-ring area circumscribing the window portion. Next, the prepared sheet seal-ring area of the sheet is metallized. Next, the frame is positioned against the sheet such that at least a portion of the frame seal-ring area and at least a portion of the sheet seal-ring area contact one another along a continuous junction region that circumscribes the window portion. Next, the junction region is heated until a metal-to-metal joint is formed between the frame and sheet all along the junction region, whereby a hermetic seal circumscribing the window portion is formed. , 19730300, Westhaver; US-3766818, 19731000, Prohofsky; US-3901120, 19750800, Youngquist; US-3968719, 19760700, Sanderson; US-3982184, 19760900, Sanderson; US-4014242, 19770300, Sanderson; US-4018124, 19770400, Rosado; US-4142434, 19790300, Gross; US-4429609, 19840200, Warrender; US-4732071, 19880300, Deutsch; US-4796509, 19890100, Mizuguchi et al.; US-4991484, 19910200, Kawashima; US-5016515, 19910500, Scott; US-5056398, 19911000, Adamson; US-5111392, 19920500, Malin; US-5202528, 19930400, Iwaooji; US-5285711, 19940200, Sanderson; US-5349130, 19940900, Iwaooji; US-5388496, 19950200, Miller et al.; US-5396827, 19950300, Miller et al.; US-5440756, 19950800, Larson; US-5549028, 19960800, Steinberger; US-5619004, 19970400, Dame, 704/207; US-5719343, 19980200, Reyburn; US-5773737, 19980600, Reyburn; US-5777248, 19980700, Campbell; US-5780759, 19980700, Szalay; US-5814748, 19980900, Reyburn; US-5929358, 19990700, Reyburn; US-5960373, 19990900, Fukuda et al., 702/075; US-6066790, 20000500, Freeland et al. ol. 240, pp. 1460-1467 (1988). Medford et al., J. of Cellular Biochemistry, Supp. 12C, p. 212, Abstract L616 (1988). Mascarenhas, J. of Cellular Biocemistry, Supp. 12C, p. 138, Abstract L023 (1988). Kiesselbach, The Structure and Reproduction of Corn, University of Nebraska Press, Lincoln and London, pp. 40-49 (1980). McCormick, et al., Tomato Biotechnolgy, pp. 255-265, 1987. Kamaly, et al. Proc. Natl. Acad. Sci., vol. 81, pp. 2801-2805, May 1984. Rothstein, et al., Proc. natl. Acad. Sci., vol. 84, pp. 8439-8443, Dec. 1987. Grill, Plant Molecular Biology Reporter, vol. 1, No. 1, pp. 17-20, 1983. Traynor, et al., Plant Molecular Biology,, vol. 7, pp. 255-263, 1986. Turpen, et al., Plant Molecular Biology, vol. 10, pp. 489-498, 1988. Murai, et al., Science, vol. 222, pp. 476-482, Nov. 1983. Larkins, et al., J. Cell. Biochem., Supp. O (9 part C): 264, No. 1818. Shen et al., Mol. Gen. Genet., vol. 234, pp. 379-389, 1992. Koltnunow et al., The Plant Cell, vol. 2, pp. 1201-1224, 1990. Winnacker, From Genes to Clones, pp. 401-404, VCH Verlaggesellschaft mbH, Weinheim, Germany. Peacock, Nature, vol. 347, pp. 714-715, 1990. Spena et al., Theor. Appl. Genet, vol. 84, pp. 520-527, 1992. Mariani, et al., Nature, vol. 347, No. 6295, pp. 737-741, Oct. 25, 1990. Smith, et al., Nature, vol. 334, pp. 724-726, Aug. 25, 1988. Worrall, et al., The Plant Cell, vol. 4, pp. 759-711, Jul. 1992. Chang et al., Molecular and Cellular Biology, vol. 5, No. 9, pp. 2341-2348, Sep. 1985. Evans, et al., Biochemical Soceity Transactions, pp. 334S, 1992. Paul, et al., Plant Molecular Biology, vol. 19, pp. 611-622, 1992. Sheehy, et al., Proc. Natl. Acad. Sci., vol. 85, pp. 8805-8809, Dec. 1988. Coghlan, New Scientist, Jul. 18, 1992, pp. 20. Mauch, et al., Plant Physiol., vol. 88, pp. 936-942, 1988. Boller, Chapter 13, Plant Response to Stress, "Hydrolytic Enzymes in Plant Disease", pp. 385-413. Weintraub, Scientific American, Jan. 1990, pp. 34-40. van der Meer, et al., The Plant Cell, vol. 4, pp. 253-262, Mar. 1992. Lamy, et al., Nucleic Acids Research, vol. 19, No. 5, pp. 1001-1005, Jan. 31, 1991. mprises bases 270 to 860 of SEQ ID NO: 1. 11. The DNA sequence of any one of claims 1-3, wherein the promoter comprises bases 445 to 860 of SEQ ID NO: 1. 12. The DNA sequence of any one of claims 1-3, wherein the promoter comprises bases 645 to 860 of SEQ ID NO: 1. 13. A recombinant plant including the DNA sequence of any one of claims 1-3. 14. A method of increasing transcription of a gene at low temperature in a plant, which comprises: (a) growing a recombinant plant including the DNA sequence of claim 2 and (b) lowering the temperature to about 15° C. or less to induce transcription of said gene. 15. A method for producing a protein in a plant, which comprises: (a) growing a recombinant plant including the DNA sequence of claim 2, wherein said gene encodes a protein of interest; (b) expressing the protein encoded by said gene; and (c) isolating the protein. 16. A method of increasing a plant's tolerance to low temperature or freezing, which comprises: (a) growing a recombinant plant including the DNA sequence of claim 3 and (b) lowering the temperature to about 15° C. or less, thereby inducing expression of said protein and conferring low temperature or freezing tolerance to the plant. 17. The method of any one of claims 14-16, wherein the plant is monocotyledonous or dicotyledonous. 18. The method of any one of claims 14-16, wherein the plant is selected from the group consisting of Gramineae, Cruciferae, Leguminosae and Cucurbitaceae. 19. The method of any one of claims 14-16, wherein the plant is selected from the group consisting of wheat, barley, rice, rye, Brassica, alfalfa and cucumber. 20. The DNA sequence of any one of claims 1-3, wherein the promoter comprises bases 1 to 592 of SEQ ID NO: 1. 21. The DNA sequence of any one of claims 1-3, wherein the promoter comprises bases 1 to 682 of SEQ ID NO: 1. 22. The DNA sequence of any one of claims 1-3, wherein the promoter comprises bases 1 to 793 of SEQ ID NO: 1. f a sufficiently small size as to prevent a cable connector from traveling between the base plate and the cover plate when the cover plate is mounted to the base plate. 7. The assembly of claim 2, wherein the at least one connector is a rivet configured for insertion through the bores of the cover plate and into the spacers of the base plate. 8. The assembly of claim 2, wherein the cover plate and the at least one connector are formed of plastic. 9. The assembly of claim 1, wherein the base plate is a floor for the chassis. 10. The assembly of claim 1, wherein the means for interconnecting the base plate and the cover plate comprises a series of male members formed on one of the base plate and cover plate, and a series of female members aligned with and configured to receive the series male members on the other of the base plate and cover plate. 11. The assembly of claim 10, wherein the interconnection between the series of male members and female members define a standoff distance between the cover plate and base plate. 12. An assembly for managing and shielding cables routed within a chassis and attenuating electromagnetic waves emanating from the chassis, the assembly comprising: a base plate having a top surface and a bottom surface, the base plate being formed of a conductive material; a cover plate having a top surface and a bottom surface, the cover plate being spaced from and in substantially parallel alignment with the base plate; and at least one spacer extending from the top surface of the base plate and at least one bore extending through the cover plate in alignment with the at least one spacer of the cover plate as the base plate and cover plate are interconnected that define paths for cables to be routed therethrough and place the cables adjacent to the base plate and traveling along the top surface thereof, the at least one spacer defining a standoff distance sufficient to provide clearance between the cover plate and the base plate for cables to move freely therein. 13. An assembly for shielding and filtering cables routed therein from electromagnetic waves emanating from inside a chassis, the cables having wiring surrounded by insulation, the electromagnetic waves superimposing a noise on the signal in the wiring of the cable, the assembly comprising: a base plate having a top surface and a bottom surface, the base plate being formed of an electrically conductive material and being electrically grounded; a cover plate having a top surface and a bottom surface, the cover plate being spaced from and substantially aligned with the base plate such that the cables are routed thereinbetween; and means for interconnecting the base plate and cover plate that secure the cables adjacent to the base plate and traveling along the top surface thereof to capacitively couple the wiring of the cables and the base plate and thereby attenuate the noise superimposed on the wiring in the cable. 14. The assembly of claim 13, wherein the cover plate is formed of an insulative material to shield the cables from electromagnetic waves. 15. The assembly of claim 13, wherein the means for interconnecting the base plate and the cover plate minimizes the separation between the wiring of the cables and the base plate. 16. The assembly of claim 13, wherein the cover plate is made of an electrically conductive material and is electrically grounded, and wherein an insulator is mounted between said cover plate and said base plate whereby the assembly is capacitively coupled with the wiring of the cables. 17. The assembly of claim 13, wherein the cover plate and base plate are formed of metal. 18. A method for assembling a protective shield system comprising the steps of: forming a metal base plate with a top surface and a bottom surface, the metal base plate being electrically grounded; forming a cover plate with a top surface and a bottom surface; positioning one or more cables on the top surface of the base plate such tha