초록 ▼

A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance,

A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

대표청구항 ▼

A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance,

A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture. conductive land on a second surface of said step up ring, wherein said trace is electrically connected to said land. 17. The structure of claim 16 further comprising an electrically conductive via extending from said first surface to said second surface of said step up ring, said via electrically connecting said trace to said land. 18. The structure of claim 16 further comprising an electrically conductive interconnection ball electrically connected to said land. 19. The structure of claim 16 wherein said step up ring has an outer side which extends between said first surface and said second surface of said step up ring, said trace being electrically connected to said land by an outer trace extending along said outer side of said step up ring. 20. A structure comprising: an image sensor having a bond pad and an active area responsive to radiation; a substrate transparent to said radiation; an electrically conductive trace formed on said substrate; an electrically conductive bump which electrically connects said bond pad to said trace; and a flexible conductor electrically connected to said trace.