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Method, apparatus, and system for cooling electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0066726 (2002-02-06)
발명자 / 주소
  • Patel, Chandrakant D.
  • Beitelmal, Abdlmonem H.
  • Bash, Cullen E.
출원인 / 주소
  • Hewlett-Packard Development Company, L.P.
인용정보 피인용 횟수 : 117  인용 특허 : 9

초록

An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure for cooling the electronic components housed therein. In one embodiment the apparatus is a self-contained, stand-alone unit. In anothe

대표청구항

An apparatus, method, and system for cooling electronic components is disclosed. The apparatus includes liquid-to-air heat exchange equipment mounted to an enclosure for cooling the electronic components housed therein. In one embodiment the apparatus is a self-contained, stand-alone unit. In anothe

이 특허에 인용된 특허 (9)

  1. Patel Chandrakant D. ; Wagner Guy ; Beitelmal Abdlmonem H. ; Chavez Gustavo A., Apparatus and method for air-cooling an electronic assembly.
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  4. Ohmori Akimitsu (Tokyo JPX) Kinjo Morishige (Tokyo JPX), Electronic equipment having integrated circuit device and temperature sensor.
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  8. Chu Richard C. ; Chrysler Gregory M. ; Simons Robert E., Sub-dew point cooling of electronic systems.
  9. Fujimoto Akihiro,JPX, Test head cooling system.

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