Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure mo
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
대표청구항▼
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure mo
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided. h et al., 524/379; US-5506046, 19960400, Andersen et al., 524/446; US-5508072, 19960400, Andersen et al., 524/446; US-5514734, 19960500, Maxfield et al., 523/204; US-5552469, 19960900, Beall et al., 524/445; US-5554670, 19960900, Giannelis et al., 523/209; US-5578672, 19961100, Beall et al., 624/446; US-5659034, 19970800, DeBord et al., 546/002; US-5667886, 19970900, Gough et al., 428/331; US-5698624, 19971200, Beall et al., 524/445; US-5721306, 19980200, Tsipursky et al., 524/449; US-5730996, 19980300, Beall et al., 424/405; US-5747403, 19980500, Boyd et al., 502/062; US-5747560, 19980500, Christiani et al., 523/209; US-5760106, 19980600, Pinnavaia et al., 523/209; US-5760121, 19980600, Beall et al., 524/450; US-5766751, 19980600, Kotani et al., 428/323; US-5801216, 19980900, Pinnavaia et al., 523/209; US-5804613, 19980900, Beall et al., 523/200; US-5830528, 19981100, Beall et al., 427/220; US-5837763, 19981100, Ferraro et al., 524/449; US-5844032, 19981200, Serrano et al., 524/445; US-5849830, 19981200, Tsipursky et al., 524/450; US-5853886, 19981200, Pinnavaia et al., 428/403; US-5877248, 19990300, Beall et al., 524/450; US-5880197, 19990300, Beall et al., 524/445; US-5910523, 19990600, Hudson, 523/213; US-5952095, 19990900, Beall et al., 428/332; US-5955094, 19990900, Beall et al., 424/405; US-5981029, 19991100, Harada et al., 428/143; US-5994445, 19991100, Kaschel et al., 524/444; US-5998528, 19991200, Tsipursky et al., 524/445; US-6034163, 20000300, Barbee et al., 524/445; US-6050509, 20000400, Cl
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