초록 ▼

A crib mattress cover has a top panel and a bottom panel sewn together and configured to fit over a rectangular crib mattress. One end of the cover is open, and a plurality of securing elements are attached along the opposing edges of the panels, on the interior surfaces thereof. When the securing m

A crib mattress cover has a top panel and a bottom panel sewn together and configured to fit over a rectangular crib mattress. One end of the cover is open, and a plurality of securing elements are attached along the opposing edges of the panels, on the interior surfaces thereof. When the securing members, which may be hook and loop fasteners, or a zipper, are joined together, the cover tightly fits over the mattress and cannot be easily dislodged by an infant resting in the crib.

대표청구항 ▼

A crib mattress cover has a top panel and a bottom panel sewn together and configured to fit over a rectangular crib mattress. One end of the cover is open, and a plurality of securing elements are attached along the opposing edges of the panels, on the interior surfaces thereof. When the securing m

A crib mattress cover has a top panel and a bottom panel sewn together and configured to fit over a rectangular crib mattress. One end of the cover is open, and a plurality of securing elements are attached along the opposing edges of the panels, on the interior surfaces thereof. When the securing members, which may be hook and loop fasteners, or a zipper, are joined together, the cover tightly fits over the mattress and cannot be easily dislodged by an infant resting in the crib. 26, 2000, pp 165-166.* Grass, C.D. et al "Electromigration Reliability Improvement of W--Plug Vias by Titanium Layering", 32 nd IEEE International Reliability Physics Symposium, Apr. 11-14, 1994, pp 173-177.* Fujii, M. et al., "Reservoir Length Dependence Of EM Lifetime For Tungsten Via Chains Under Low Current Stress", VMIC Conference, Jun. 18-20, 1996. Kirchheim, R. et al., "Atomistic and Computer Modeling of Metallization Failure Of Integrated Circuits By Electromigration", J. Appl. Phys. 70(1), pp. 172-181, Jul. 1, 1991. Artz, E. et al., "Electromigration Failure By Shape Change of Voids In Bamboo Lines", J. Appl. Phys. 76(3), pp. 1563-1571, Aug. 1, 1994.