초록 ▼

A method and apparatus are provided for electrolyzing water for enhanced production of oxygen, hydrogen and heat by the steps of (i) providing an electrochemical cell comprising an isotopic hydrogen storage cathode, an electrically conductive anode and an ionically conducting electrolyte comprising

A method and apparatus are provided for electrolyzing water for enhanced production of oxygen, hydrogen and heat by the steps of (i) providing an electrochemical cell comprising an isotopic hydrogen storage cathode, an electrically conductive anode and an ionically conducting electrolyte comprising water, and (ii) impressing a repeating sequence of voltages across the cathode and anode comprised of at least two cell voltage regimes, a first cell voltage regime consisting of a voltage sufficient to enhance cathodic absorption of hydrogen, and a second cell voltage regime consisting of at least one voltage pulse which is at least two times the voltage of the first cell voltage regime for a total duration no greater than 0.10 seconds.

대표청구항 ▼

A method and apparatus are provided for electrolyzing water for enhanced production of oxygen, hydrogen and heat by the steps of (i) providing an electrochemical cell comprising an isotopic hydrogen storage cathode, an electrically conductive anode and an ionically conducting electrolyte comprising

A method and apparatus are provided for electrolyzing water for enhanced production of oxygen, hydrogen and heat by the steps of (i) providing an electrochemical cell comprising an isotopic hydrogen storage cathode, an electrically conductive anode and an ionically conducting electrolyte comprising water, and (ii) impressing a repeating sequence of voltages across the cathode and anode comprised of at least two cell voltage regimes, a first cell voltage regime consisting of a voltage sufficient to enhance cathodic absorption of hydrogen, and a second cell voltage regime consisting of at least one voltage pulse which is at least two times the voltage of the first cell voltage regime for a total duration no greater than 0.10 seconds. orphology and Stability of Electrochemically Generated Copper Layers: The Effect of Electron Transfer and Nucleation Kinetics," Circuit World (1996) pp. 4-9, vol. 22, No. 3. Yoshiki, H. et al., "Adhesion Mechanism of Electroless Copper Film Formed on Ceramic Substrates Using ZnO Thin Film as an Intermediate Layer," J. Electrochem. Soc. (May 1998) pp. 1430-1434, vol. 145 No. 5, The Electrochemical Society, Inc. Yung, E.K. et al., "Fundamental Study of Acid Copper Through-Hole Electroplating Process," J. Electrochem. Soc. (Mar. 1989) pp. 756-767, vol. 136, No. 3, The Electrochemical Society, Inc. Yung, E.K. et al., "Plating of Copper into Through-Holes and Vias," J. Electrochem. So. (Jan. 1989) pp. 206-213, vol. 136, No. 1, The Electrochemical Society, Inc. L'Augmentation Du Courant Limite Par Les Differentes Formes D'Electrodes, 20 pgs. *Semitool, Inc. v. Novellus Systems, Inc.; Novellus's Final Invalidity Contentions; Mar. 7, 2003; 255 pgs; U.S.D.C. District of Oregon. *Semitool, Inc. v. Applied Materials, Inc.; Applied Materials' Final Invalidity Contentions; Feb. 7, 2003; 36 pgs; U.S.D.C. District of Oregon. *Semitool, Inc. v. Ebara Corporation and Ebara Technologies, Inc. ; Ebara's Final Preliminary Invalidity Contentions; Mar. 5, 2003; 19 pgs; U.S.D.C. District of Oregon.