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[미국특허] Method of fabricating shaped springs 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-009/00
출원번호 US-0547560 (2000-04-12)
발명자 / 주소
  • Mathieu, Gaetan L.
  • Eldridge, Benjamin N.
  • Wenzel, Stuart W.
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    Blakely Sokoloff Taylor & Zafman LLP
인용정보 피인용 횟수 : 104  인용 특허 : 22

초록 ▼

A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An e

대표청구항 ▼

A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An e

이 특허에 인용된 특허 (22) 인용/피인용 타임라인 분석

  1. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.
    상세보기
  2. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals.
    상세보기
  3. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
    상세보기
  4. Babuka, Robert; Piechota, John L.; Poch, Leonard J., High density planar interconnected integrated circuit package.
    상세보기
  5. Ainslie Norman G. (Croton-on-Hudson NY) Krzanowski James E. (Watertown MA) Palmateer Paul H. (Wappingers Falls NY), High melting point process for Au:Sn:80:20 brazing alloy for chip carriers.
    상세보기
  6. Little Michael J. (Woodland Hills CA), Integrated circuit spring contact fabrication methods.
    상세보기
  7. Igor Y. Khandros ; Thomas H. Dozier ; Gary W. Grube ; Gaetan L. Mathieu, Method for shaping spring elements.
    상세보기
  8. Chen Jimmy Kuo-Wei ; Eldridge Benjamin N. ; Dozier Thomas H. ; Yeh Junjye J. ; Herman Gayle J., Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive.
    상세보기
  9. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
    상세보기
  10. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.
    상세보기
  11. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
    상세보기
  12. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
    상세보기
  13. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
    상세보기
  14. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.
    상세보기
  15. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
    상세보기
  16. Marcus Robert B. ; Zhang Yanwei, Micromachined element and method of fabrication thereof.
    상세보기
  17. Sliwa ; Jr. John W. (601 Coleridge Ave. Palo Alto CA 94301), Microvibratory memory device.
    상세보기
  18. Smith Donald L. (Palo Alto CA) Alimonda Andrew S. (Los Altos CA), Photolithographically patterned spring contact.
    상세보기
  19. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.
    상세보기
  20. Faraci Anthony B. ; Zaccardi James B. ; DiStefano Thomas H. ; Smith John W., Socket for engaging bump leads on a microelectronic device and methods therefor.
    상세보기
  21. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
    상세보기
  22. Marcus Robert B. ; Kadija Igor V. ; Aharonov Robert Reuven, Ultra-miniature electrical contacts and method of manufacture.
    상세보기

이 특허를 인용한 특허 (104) 인용/피인용 타임라인 분석

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
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  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
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  3. Mathieu, Gaetan L., Air bridge structures and methods of making and using air bridge structures.
    상세보기
  4. Mathieu,Gaetan L., Air bridge structures and methods of making and using air bridge structures.
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  5. Kautz, Stefan; Zeininger, Heinrich, Assembly element for tow component parts of a device.
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  6. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
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  7. Ho,Kwun Yao; Kung,Moriss, Chip carrier with oxidation protection layer.
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  8. Brown, Dirk D.; Williams, John D.; Yao, Hongjun; Ali, Hassan O., Circuitized connector for land grid array.
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  9. Brown,Dirk D.; Williams,John D.; Radza,Eric M., Connector for making electrical contact at semiconductor scales.
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  10. Dittmann,Larry E., Connector having staggered contact architecture for enhanced working range.
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  11. Dittmann, Larry E., Contact and method for making same.
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  12. Brown,Dirk D.; Williams,John D., Contact grid array formed on a printed circuit board.
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  15. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
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  16. Strid, Eric; Campbell, Richard, Differential signal probing system.
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  17. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
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  18. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
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  19. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
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  20. Light, David Noel; Kalakkad, Dinesh Sundararajan; Nguyen, Peter Tho, Electrical connector and method of making it.
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  21. Dittmann, Larry E., Electrical connector having a flexible sheet and one or more conductive connectors.
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  22. Ju,Ted, Electrical connector having an oscillating multilayered conducting body.
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  23. Light, David Noel; Wang, Hung-Ming; Baker, David Rodney; Nguyen, Peter Tho; Pao, Dexter Shih-Wei, Electrical connector with electrical contacts protected by a layer of compressible material and method of making it.
    상세보기
  24. Farnworth,Warren M.; Hiatt,William M.; Watkins,Charles M., Electrical contacts with dielectric cores.
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  25. Mathieu,Gaetan L.; Eldridge,Benjamin N., Interconnect for microelectronic structures with enhanced spring characteristics.
    상세보기
  26. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
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  27. Dittmann,Larry E., Interposer and method for making same.
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  28. Dittmann,Larry E., Interposer with compliant pins.
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  29. Dittmann,Larry E., Interposer with compliant pins.
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  30. Brown,Dirk D.; Williams,John D.; Yao,Hongjun, Land grid array connector including heterogeneous contact elements.
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  31. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
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  32. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
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  33. Schwindt,Randy J., Low-current probe card.
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  34. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
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  35. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
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  36. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
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  37. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
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  38. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
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  39. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
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  40. Smith,Kenneth; Gleason,Reed, Membrane probing system.
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  41. Smith,Kenneth; Gleason,Reed, Membrane probing system.
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  42. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
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  43. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
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  44. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
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  45. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
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  46. Radza, Eric M.; Williams, John D., Method and system for batch forming spring elements in three dimensions.
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  47. Brown, Dirk Dewar; Williams, John David; Long, William B.; Chen, Tingbao, Method and system for batch manufacturing of spring elements.
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  48. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
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  49. Dittmann,Larry E., Method for fabricating a connector.
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  50. Williams, John D., Method for fabricating a contact grid array.
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  51. Matsunaga,Noriaki; Shibata,Hideki; Hayasaka,Nobuo, Method for fabricating a probe pin for testing electrical characteristics of an apparatus.
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  52. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
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  53. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
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  54. Mathieu,Gaetan L.; Eldridge,Benjamin N., Method of forming an interconnection element.
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  55. Garcia,Jason A.; Beatty,John J., Method of making an electronic assembly.
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  56. Williams, John D., Method of making electrical connector on a flexible carrier.
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  57. Eldridge,Benjamin N.; Mathieu,Gaetan L.; Reynolds,Carl V., Method of making microelectronic spring contact array.
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  58. Chua,Christopher L.; Lemmi,Francesco; Van Schuylenbergh,Koenraad F.; Lu,Jeng Ping; Fork,David K.; Peeters,Eric; Sun,Decai; Smith,Donald L.; Romano,Linda T., Method of making photolithographically-patterned out-of-plane coil structures.
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  59. Chua,Christopher L.; Lemmi,Francesco; Van Schuylenbergh,Koenraad F.; Lu,Jeng Ping; Fork,David K.; Peeters,Eric; Sun,Decai; Smith,Donald L.; Romano,Linda T., Method of making photolithographically-patterned out-of-plane coil structures.
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  60. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
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  61. Xu, Baomin; Fork, David Kirtland; Young, Michael Yu Tak; Chow, Eugene Michael, Methods for manufacturing stressed material and shape memory material MEMS devices.
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  62. Mathieu,Gaetan L.; Eldridge,Benjamin N.; Wenzel,Stuart W., Methods of fabricating and using shaped springs.
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  63. Veeramani, Arun S.; Jensen, Heath A.; Frodis, Uri; Wiita, Christopher G.; Lockard, Michael S.; Boguslavsky, Irina; Lembrikov, Pavel; Smalley, Dennis R.; Chen, Richard T., Methods of forming parts using laser machining.
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  64. Lee, Sung-Young; Kim, Dong-Won; Kim, Min-Sang; Yun, Eun-Jung; Park, Dong-Gun, Multi-bit electro-mechanical memory device and method of manufacturing the same.
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  65. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
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  66. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.
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