초록 ▼

A laser alignment device is described in which a first pipe cap includes an open pipe receiving end formed about a central axis. A laser mount is provided on the first pipe cap, and a second pipe cap is releasably mounted to the first pipe cap. A mounting access is provided on the second pipe cap th

A laser alignment device is described in which a first pipe cap includes an open pipe receiving end formed about a central axis. A laser mount is provided on the first pipe cap, and a second pipe cap is releasably mounted to the first pipe cap. A mounting access is provided on the second pipe cap that is substantially coaxial with the central axis.

대표청구항 ▼

A laser alignment device is described in which a first pipe cap includes an open pipe receiving end formed about a central axis. A laser mount is provided on the first pipe cap, and a second pipe cap is releasably mounted to the first pipe cap. A mounting access is provided on the second pipe cap th

A laser alignment device is described in which a first pipe cap includes an open pipe receiving end formed about a central axis. A laser mount is provided on the first pipe cap, and a second pipe cap is releasably mounted to the first pipe cap. A mounting access is provided on the second pipe cap that is substantially coaxial with the central axis. f the dielectric block; and I/O electrodes extending from side-surfaces to an undersurface of the dielectric block, the side-surfaces being orthogonal to a direction in which the inner-conductor holes are arrayed in the dielectric block, and the undersurface being a mounting surface for being mounted on a mounting board, wherein the I/O electrodes are separated from the outer conductor and provide capacitance between the I/O electrodes and the plurality of inner-conductor holes, at least one of the I/O electrodes extends onto the undersurface of the dielectric block so as to overlie at least two of the inner-conductor holes when viewed from the undersurface, and further extends from the corresponding side-surface to a point beyond the second one of the at least two inner-conductor holes in a direction away from the corresponding side-surface for providing the capacitance stability between the second one of the at least two inner-conductor holes and the at least one of the I/O electrodes; and wherein a first one and a second one of the at least two inner-conductor holes are capacitively coupled to each other. 6. A communication device comprising at least one of a transmitting circuit and a receiving circuit, the at least one circuit comprising a dielectric filter as described in claim 1. 7. A dielectric filter according to claim 1, wherein the outer conductor is formed on all of the outer surfaces of the dielectric block except the top surface. 8. A dielectric filter according to claim 7, wherein the inner conductors are connected to the outer conductor at the bottom surface. 9. A dielectric filter according to claim 2, wherein the second region extends to a point beyond the second one of the at least two inner conductor holes in a direction away from the corresponding side-surface. 10. A dielectric filter comprising: a substantially rectangular parallelepiped dielectric block; a plurality of inner-conductor holes extending from a top surface to an opposing bottom surface of the dielectric block; an inner conductor provided on the respective surface of each of the inner-conductor holes; an outer conductor formed on outer surfaces of the dielectric block; and I/O electrodes extending from side-surfaces to an undersurface of the dielectric block, the side-surfaces being orthogonal to a direction in which the inner-conductor holes are arrayed in the dielectric block, and the undersurface being a mounting surface for being mounted on a mounting board, wherein the I/O electrodes are separated from the outer conductor and provide capacitance between the I/O electrodes and the plurality of inner-conductor holes, at least one of the I/O electrodes is disposed in such a position on the undersurface of the dielectric block as to couple to at least two of the inner-conductor holes, and extends from the corresponding side-surface to a point beyond the second one of the at least two inner-conductor holes in a direction away from the corresponding side-surface for providing the capacitance stability between the second one of the at least two inner-conductor holes and the at least one of the I/O electrodes; and wherein a first one and a second one of the at least two inner-conductor holes are capacitively coupled to each other. 11. A dielectric filter according to claim 10, wherein the at least one of the I/O electrodes has a width which is different between a first region corresponding to the first one of the at least two inner-conductor holes and a second region corresponding to the second one of the at least two inner-conductor holes when viewed from the undersurface. 12. A dielectric filter according to claim 11, wherein the second region extends to a point beyond the second one of the at least two inner conductor holes in a direction away from the corresponding side-surface. 13. A dielectric filter according to claim 11, wherein the width at the first region is larger than the width at the second region. 14. A dielectr